Light-emitting device
US-12155019-B2 · Nov 26, 2024 · US
US10084114B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10084114-B2 |
| Application number | US-201615149740-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 9, 2016 |
| Priority date | Jul 26, 2011 |
| Publication date | Sep 25, 2018 |
| Grant date | Sep 25, 2018 |
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Textured optoelectronic devices and associated methods of manufacture are disclosed herein. In several embodiments, a method of manufacturing a solid state optoelectronic device can include forming a conductive transparent texturing material on a substrate. The method can further include forming a transparent conductive material on the texturing material. Upon heating the device, the texturing material causes the conductive material to grow a plurality of protuberances. The protuberances can improve current spreading and light extraction from the device.
Opening claim text (preview).
We claim: 1. An optoelectronic device, comprising: an optoelectronic transducer having at least a first semiconductor material, a second semiconductor material, and an active region between the first and second semiconductor materials; a texturing material including titanium deposited over the optoelectronic transducer; and a transparent conductive material on the texturing material, wherein the transparent conductive material has a plurality of protuberances projecting away from the texturing material. 2. The device of claim 1 wherein the transparent conductive material comprises indium tin oxide. 3. The device of claim 1 wherein the texturing material has a thickness from about 30 angstroms to about 60 angstroms. 4. The device of claim 1 , further comprising a mask deposited over at least a portion of the texturing material. 5. The device of claim 1 wherein the protuberances of the transparent conductive material comprise a plurality of irregular pillars in a random pattern across the optoelectronic transducer. 6. The device of claim 1 wherein the solid state optoelectronic transducer includes a N-type gallium nitride (GaN) material, an indium gallium nitride (InGaN) material over the N-type material, and a P-type GaN material over the InGaN material. 7. An optoelectronic device, comprising: an optoelectronic transducer having a first semiconductor material, a second semiconductor material, and an active region positioned between the first and second semiconductor materials; a texturing material positioned on the second semiconductor material; a conductive material positioned on the texturing material and having a plurality of protuberances extending outwardly in a direction away from the texturing material, wherein the plurality of protuberances comprise a plurality of irregular pillars, wherein the conductive material is a first portion of conductive material; a mask positioned on at least a portion of the texturing material; and a second portion of conductive material positioned on the mask, wherein the first portion of the conductive material and the second portion of the conductive material form a pattern via absence and presence of the plurality of protuberances. 8. The optoelectronic device of claim 7 wherein the plurality of protuberances have a density, a size, a shape, an arrangement, or a combination thereof characteristic of a heating temperature used to grow the plurality of protuberances. 9. The optoelectronic device of claim 7 wherein the texturing material includes a plurality of ridges and valleys, and wherein the ridges and valleys define a pattern for the plurality of protuberances.
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