Image sensor with pixel units having mirrored transistor layout
US-9165959-B2 · Oct 20, 2015 · US
US10084007B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10084007-B2 |
| Application number | US-201615173326-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 3, 2016 |
| Priority date | Jan 11, 2016 |
| Publication date | Sep 25, 2018 |
| Grant date | Sep 25, 2018 |
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The present invention provides an image sensor. An image sensor include a pixel array. The pixel array includes: a plurality of pixels; and an isolation structure suitable for insulating between the plurality of pixels. The isolation structure includes: a first conductivity-type conductive layer formed over a substrate; and a second conductivity-type pickup region formed in the first conductivity-type conductive layer and disposed between each plurality of pixels.
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What is claimed is: 1. An image sensor comprising: a plurality of unit pixel groups; and an isolation structure suitable for insulating between the plurality of unit pixel groups, wherein the isolation structure comprises: a first conductivity-type conductive layer formed over a substrate; and a second conductivity-type pickup region formed in the first conductivity-type conductive layer and disposed between two adjacent unit pixel groups, wherein the first conductivity-type conductive layer comprises either a first conductivity-type well formed in the substrate, or a first conductivity-type epitaxial layer formed over the substrate. 2. The image sensor of claim 1 , wherein the isolation structure further comprises: an element isolation layer formed over the first conductivity-type conductive layer and having a bottom surface in contact with the second conductivity-type pickup region; and a plug formed through the element isolation layer and connected to the second conductivity-type pickup region. 3. The image sensor of claim 1 , wherein a positive voltage variable within a voltage range from a voltage higher than a ground voltage to a voltage equal to or lower than a supply voltage is applied to the second conductivity-type pickup region. 4. The image sensor of claim 1 , wherein when the plurality of unit pixel groups operate in a global shutter mode, a positive voltage is applied to the second conductivity-type pickup region during an integration time. 5. The image sensor of claim 1 , wherein when the plurality of unit pixel groups operate in a rolling shutter mode, a positive voltage is always applied to the second conductivity-type pickup region. 6. The image sensor of claim 1 , wherein each of the plurality of unit pixel groups comprises: a light-receiving part comprising a plurality of photoelectric conversion elements suitable for generating photocharges in response to incident light and sharing a single floating diffusion region; and an output part suitable for outputting an image signal corresponding to the photocharges generated in the light-receiving part. 7. The image sensor of claim 6 , wherein the second conductivity-type pickup region is disposed between two adjacent light-receiving parts. 8. An image sensor comprising: a plurality of unit pixel groups; and an isolation structure suitable for insulating between the plurality of unit pixel groups, wherein the isolation structure comprises: a first conductivity-type conductive layer formed over a substrate; and a second conductivity-type pickup region formed in the first conductivity-type conductive layer and disposed between the plurality of unit pixel groups, wherein the second conductivity-type pickup region has a dot shape. 9. An image sensor comprising: a plurality of unit pixel groups; an isolation structure suitable for insulating between the plurality of unit pixel groups; and a first pickup region of a first conductivity-type formed in the isolation structure and disposed between two adjacent unit pixel groups, wherein the isolation structure comprises: a first conductivity-type conductive layer; and a second pickup region of a second conductivity-type formed in the first conductivity-type conductive layer and disposed between two adjacent unit pixel groups, wherein the first and second pickup regions have a dot shape. 10. The image sensor of claim 9 , wherein the isolation structure further comprises: an element isolation layer formed over the first conductivity-type conductive layer and having a bottom surface in contact with the first and second pickup regions; a first plug formed through the element isolation layer and connected to the first pickup region; and a second plug formed through the element isolation layer and connected to the second pickup region. 11. The image sensor of claim 9 , wherein a positive voltage variable within a voltage range from a voltage higher than a ground voltage to a voltage equal to or lower than a supply voltage is applied to the second pickup region. 12. The image sensor of claim 9 , wherein when the plurality of unit pixel groups operate in a global shutter mode, a positive voltage is applied to the second pickup region during an integration time. 13. The image sensor of claim 9 , wherein when the plurality of unit pixel groups operate in a rolling shutter mode, a positive voltage is always applied to the second pickup region. 14. The image sensor of claim 9 , wherein a ground voltage is applied to the first pickup region. 15. The image sensor of claim 9 , wherein the first conductivity-type conductive layer comprises either a first conductivity-type well formed in the substrate, or a first conductivity-type epitaxial layer formed over the substrate. 16. The image sensor of claim 9 , wherein each of the plurality of unit pixel groups comprises: a light-receiving part comprising a plurality of photoelectric conversion elements suitable for generating photocharges in response to incident light and sharing a single floating diffusion region; and an output part suitable for outputting an image signal corresponding to the photocharges generated in the light-receiving part. 17. The image sensor of claim 16 , wherein the first pickup region is disposed between two adjacent output parts. 18. The image sensor of claim 16 , wherein the second pickup region is disposed between two adjacent light-receiving parts.
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