Conductive composite material and method for producing said conductive composite material

US10083775B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10083775-B2
Application numberUS-201414765047-A
CountryUS
Kind codeB2
Filing dateJan 30, 2014
Priority dateJan 31, 2013
Publication dateSep 25, 2018
Grant dateSep 25, 2018

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention relates to a conductive material comprising a first phase including a thermoset compound, a second phase, consisting of a smaller volume, including a thermoplastic compound, and a conductive compound, wherein the second phase is dispersed in the first phase, the two phases are bicontinuous, and the conductive compound is situated at the interface between the first and second phases.

First claim

Opening claim text (preview).

The invention claimed is: 1. A conductive material comprising: a first phase including a thermoset compound; a second phase, which is smaller in volume than the first phase, including a thermoplastic compound; and a conductive compound, wherein: the second phase is dispersed in the first phase, the two phases are bicontinuous, and the conductive compound is located at the interface between the first and second phases wherein the conductive material comprises from 5 to 30% by mass of the thermoplastic compound. 2. The conductive material as claimed in claim 1 , wherein the thermoset compound comprises a thermoset resin. 3. The conductive material as claimed in claim 2 , wherein the thermoset resin comprises the product of reaction of a mixture of an epoxy resin and a hardener. 4. The conductive material as claimed in claim 3 , wherein the epoxy resin/hardener mixture is selected from the group of precursor couples consisting of an epoxy/amine couple, an epoxy/acid couple, an epoxy/anhydride couple, an epoxy/phenol couple, and combinations thereof. 5. The conductive material as claimed in claim 2 , wherein the thermoset resin is a polyester resin, a polyurethane resin, a phenol-formaldehyde resin or a urea-formaldehyde resin. 6. The conductive material as claimed in claim 1 , wherein the conductive compound is in the form of particles. 7. The conductive material as claimed in claim 6 , wherein the particles of conductive compound have a size from 5 nm to 5 μm. 8. The conductive material as claimed in claim 1 , wherein the conductive compound comprises carbon black. 9. The conductive material as claimed in claim 1 , wherein the conductive compound comprises transition metal particles. 10. The conductive material as claimed in claim 1 , wherein the conductive material comprises from 0.1 to 15% by mass of conductive compound. 11. The conductive material as claimed in claim 1 , wherein the conductive material has an electrical conductivity of from 10 −8 to 10 2 S/cm. 12. The conductive material as claimed in claim 1 , further comprising a reinforcement. 13. The conductive material as claimed in claim 12 , wherein the reinforcement comprises a weave of fibers. 14. The conductive material as claimed in claim 13 , wherein the fibers are selected from the group consisting of carbon fibers, glass fibers, aramid fibers, and combinations thereof.

Assignees

Inventors

Classifications

  • Processes for mixing polymers · CPC title

  • Polystyrene · CPC title

  • Conductive additives · CPC title

  • Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs · CPC title

  • H01B1/24Primary

    the conductive material comprising carbon-silicon compounds, carbon or silicon · CPC title

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Frequently asked questions

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What does patent US10083775B2 cover?
The invention relates to a conductive material comprising a first phase including a thermoset compound, a second phase, consisting of a smaller volume, including a thermoplastic compound, and a conductive compound, wherein the second phase is dispersed in the first phase, the two phases are bicontinuous, and the conductive compound is situated at the interface between the first and second phases.
Who is the assignee on this patent?
Centre Nat Rech Scient, Univ Maine, Centre Nat Rech Scient, and 1 more
What technology area does this patent fall under?
Primary CPC classification H01B1/24. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 25 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).