Multilayer electronic component and conductive paste composition for internal electrode
US-2015371728-A1 · Dec 24, 2015 · US
US10083775B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10083775-B2 |
| Application number | US-201414765047-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 30, 2014 |
| Priority date | Jan 31, 2013 |
| Publication date | Sep 25, 2018 |
| Grant date | Sep 25, 2018 |
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The invention relates to a conductive material comprising a first phase including a thermoset compound, a second phase, consisting of a smaller volume, including a thermoplastic compound, and a conductive compound, wherein the second phase is dispersed in the first phase, the two phases are bicontinuous, and the conductive compound is situated at the interface between the first and second phases.
Opening claim text (preview).
The invention claimed is: 1. A conductive material comprising: a first phase including a thermoset compound; a second phase, which is smaller in volume than the first phase, including a thermoplastic compound; and a conductive compound, wherein: the second phase is dispersed in the first phase, the two phases are bicontinuous, and the conductive compound is located at the interface between the first and second phases wherein the conductive material comprises from 5 to 30% by mass of the thermoplastic compound. 2. The conductive material as claimed in claim 1 , wherein the thermoset compound comprises a thermoset resin. 3. The conductive material as claimed in claim 2 , wherein the thermoset resin comprises the product of reaction of a mixture of an epoxy resin and a hardener. 4. The conductive material as claimed in claim 3 , wherein the epoxy resin/hardener mixture is selected from the group of precursor couples consisting of an epoxy/amine couple, an epoxy/acid couple, an epoxy/anhydride couple, an epoxy/phenol couple, and combinations thereof. 5. The conductive material as claimed in claim 2 , wherein the thermoset resin is a polyester resin, a polyurethane resin, a phenol-formaldehyde resin or a urea-formaldehyde resin. 6. The conductive material as claimed in claim 1 , wherein the conductive compound is in the form of particles. 7. The conductive material as claimed in claim 6 , wherein the particles of conductive compound have a size from 5 nm to 5 μm. 8. The conductive material as claimed in claim 1 , wherein the conductive compound comprises carbon black. 9. The conductive material as claimed in claim 1 , wherein the conductive compound comprises transition metal particles. 10. The conductive material as claimed in claim 1 , wherein the conductive material comprises from 0.1 to 15% by mass of conductive compound. 11. The conductive material as claimed in claim 1 , wherein the conductive material has an electrical conductivity of from 10 −8 to 10 2 S/cm. 12. The conductive material as claimed in claim 1 , further comprising a reinforcement. 13. The conductive material as claimed in claim 12 , wherein the reinforcement comprises a weave of fibers. 14. The conductive material as claimed in claim 13 , wherein the fibers are selected from the group consisting of carbon fibers, glass fibers, aramid fibers, and combinations thereof.
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