Optoelectronic module and method for producing an optoelectronic module

Patent metadata

Field	Value
Publication number	US-10082270-B2
Application number	US-201515513570-A
Country	US
Kind code	B2
Filing date	Sep 22, 2015
Priority date	Sep 23, 2014
Publication date	Sep 25, 2018
Grant date	Sep 25, 2018

Abstract

A light-emitting module including a light-emitting component and a resilient body is provided. The light-emitting component includes a light-emitting layer structure for generating light and includes a light-emitting main face through which the generated light leaves the light-emitting component. The resilient body, which is arranged over the light-emitting main face, is connected firmly to the light-emitting component, includes at least one light-deviating region, and includes a free-lying surface which includes at least one surface element, which lies at a distance greater than or equal to 4 mm from the light-emitting layer structure.

First claim

The invention claimed is:

1. A light-emitting module, comprising
a light-emitting component, which comprises a light-emitting layer structure for generating light and comprises a light-emitting main face through which the generated light leaves the light-emitting component, and
a resilient body, which is arranged over the light-emitting main face, is connected firmly to the light-emitting component, comprises at least one light-deviating region, and comprises a free-lying surface which comprises at least one surface element, which lies at a distance greater than or equal to 4 mm from the light-emitting layer structure.

2. The light-emitting module as claimed in claim 1 , wherein the distance
is greater than or equal to 1 cm, or greater than or equal to 2.5 cm, and
less than 5 m, or less than 1 m, or less than 25 cm.

3. The light-emitting module as claimed in claim 1 , wherein the light-emitting component comprises a plurality of light-emitting layer structures, which are formed on single-piece carrier.

4. The light-emitting module as claimed in claim 1 , wherein an overall luminous area formed by the light-emitting layer structure or structures is greater than or equal to 1 cm 2 .

5. The light-emitting module as claimed in claim 1 , wherein an elastic modulus of the resilient body in the region is from 0.01 kN/mm 2 to 5.0 kN/mm 2 .

6. The light-emitting module as claimed in claim 1 , wherein the free-lying surface of the resilient body is essentially not parallel to the light-emitting main face of the light-emitting component.

7. The light-emitting module as claimed in claim 1 , wherein the light-deviating region comprises a scattering region, a mirror region and/or a conversion region.

8. The light-emitting module as claimed in claim 1 , wherein the light-deviating region has a shape by means of which an item of information is represented.

9. The light-emitting module as claimed in claim 1 , wherein the resilient body is transparent or translucent outside the light-deviating region.

10. The light-emitting module as claimed in claim 9 , further comprising an internal operating element, which is embedded in the resilient body and can be operated from the outside by a user indirectly via the resilient body.

11. The light-emitting module as claimed in claim 10 , wherein the internal operating element comprises a push-button, a contact sensor, a control lever and/or a switch.

12. The light-emitting module as claimed in claim 9 , further comprising an external operating element, which is arranged on the surface of the resilient body and can be operated from the outside by a user.

13. The light-emitting module as claimed in claim 1 , further comprising an actuator, which is embedded in the resilient body and provides a user with a signal indirectly via the resilient body.

14. The light-emitting module as claimed in claim 1 , wherein the light-emitting component can be bent nondestructively.

15. A method for producing a light-emitting component comprising,
providing a light-emitting component, which comprises a light-emitting layer structure for generating light and comprises a light-emitting main face through which the light leaves the light-emitting component
arranging a resilient body over the light-emitting main face and
connecting the resilient body firmly to the light-emitting component, the resilient body comprising at least one light-deviating region and a free-lying surface which comprises at least one surface element, which lies at a distance greater than or equal to 4 mm from the light-emitting layer structure.

16. 3D-OLED, comprising
an organic light-emitting component, which comprises a light-emitting layer structure for generating light and comprises a light-emitting main face through which the generated light leaves the organic light-emitting component, and
a resilient body, which is arranged on the light-emitting main face, which is cohesively bonded to the light-emitting main face and which comprises at least one exposed outer surface, which is formed by a light-deviating region and which comprises at least one surface element, which has a distance greater than or equal to 4 mm from the light-emitting layer structure,

wherein the resilient body and its exposed outer surface have a three-dimensional shape such that a three-dimensional luminous surface is formed by the resilient body and the light-deviating region at the exposed outer surface.

17. The light-emitting module as claimed in claim 1 , wherein an elastic modulus of the resilient body in the region is from 0.1 kN/mm 2 to 1.0 kN/mm 2 .

Assignees

• Osram Oled Gmbh

Inventors

• Wehlus Thomas
• Riedel Daniel
• Riegel Nina
• Scharner Silke
• Rosenberger Johannes
• Fleissner Arne

Classifications

• F21V23/04

  the elements being switches (safety devices F21V25/00) · CPC title

• F21V15/01

  Housings, e.g. material or assembling of housing parts (F21V15/02 takes precedence {housings forming signs or letters G09F13/04}) · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• F21Y2107/00

  Light sources with three-dimensionally disposed light-generating elements · CPC title

• F21V3/0409

  Mechanical Engineering · mapped topic