Adhesive composition having improved adhesive force for use as insulator

US10081744B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10081744-B2
Application numberUS-201415103311-A
CountryUS
Kind codeB2
Filing dateOct 28, 2014
Priority dateDec 13, 2013
Publication dateSep 25, 2018
Grant dateSep 25, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed herein is an adhesive composition for an insulator, the adhesive composition including a copolymer formed by using at least one type of phenol-based monomer; at least one type of monomer that is polymerizable by an alkali salt; and at least one type of monomer that is polymerizable by a bisulfate.

First claim

Opening claim text (preview).

The invention claimed is: 1. An adhesive composition for an insulator, the adhesive composition comprising copolymers, the copolymers comprising: at least one phenol-based monomer; at least one first monomer that is polymerizable by an alkali salt, the at least one first monomer being in a range of 5 parts to 40 parts by weight based on 100 parts by weight of the phenol-based monomer; at least one second monomer that is polymerizable by a bisulfate, the at least one second monomer being in a range of 5 parts to 40 parts by weight based on 100 parts by weight of the phenol-based monomer; and at least one acryl-based monomer or at least one epoxy-based monomer. 2. The adhesive composition of claim 1 , wherein the phenol-based monomer is cardanol, cardol, anacardic acid, ginkgoic acid, methylcardol, urushiol, thitsiol, rangol, laccol, phenol, alkylphenol, or alkenylphenol. 3. The adhesive composition of claim 1 , wherein the alkali salt is at least one selected from the group consisting of potassium carbonate, sodium carbonate, lithium carbonate, a bicarbonate salt, a bisulfide salt, a hydroxide salt, and a combination thereof. 4. The adhesive composition of claim 1 , wherein the bisulfite is at least one selected from the group consisting of sodium bisulfite, sodium metabisulfite, sodium hydrogen bisulfite, potassium bisulfite, potassium metabisulfite, ammonium bisulfite, succinic aldehyde disodium bisulfite, and a combination thereof. 5. The adhesive composition of claim 1 , wherein the copolymer further comprises at least one free radical initiator. 6. The adhesive composition of claim 5 , wherein the free radical initiator is at least one selected from the group consisting of an organic peroxide, an organic hydroperoxide, an azo initiator, and a combination thereof. 7. The adhesive composition of claim 5 , wherein the free radical initiator is at least one selected from the group consisting of benzoyl peroxide, di-t-amyl peroxide, di-cumyl peroxide, t-amyl hydroperoxide, t-butyl hydroperoxide, 2,2′-azobis(2,4-dimethylpentanenitrile), 2,2′-azobis(2-methylpropanenitrile), 2,2′-azobis(cyclohexanecarbonitrile), 2,2′-azobis(2-methylbutanenitrile), t-butylperoxy benzoate, 2,5-dimethyl-2,5di-(t-butylperoxy)hexane, 2,5-dimethyl-2,5-di-(t-butylperoxy) hexyne-3, and a combination thereof. 8. The adhesive composition of claim 1 , wherein the acryl-based monomer is at least one selected from the group consisting of ethyl acrylate, butyl acrylate, ethylmethyl acrylate, propyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, ethyl methacrylate, butyl methacrylate, and a combination thereof. 9. The adhesive composition of claim 1 , wherein the epoxy-based monomer is at least one selected from the group consisting of glycidyl acrylate, glycidyl methacrylate, α-ethylglycidyl acrylate, α-n-propylglycidyl acrylate, α-n-butylglycidyl acrylate, β-ethylglycidyl acrylate, β-ethylglycidyl methacrylate, 3,4-epoxybutyl acrylate, 3,4-epoxybutyl methacrylate, β-ethylglycidyl methacrylate, 6,7-epoxyheptyl methacrylate, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, and a combination thereof.

Assignees

Inventors

Classifications

  • containing epoxy radicals · CPC title

  • with acrylic or methacrylic acids · CPC title

  • C09J129/02Primary

    Homopolymers or copolymers of unsaturated alcohols (C09J129/14 takes precedence) · CPC title

  • C09J4/06Primary

    {Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond} in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00 · CPC title

  • C09J4/00Primary

    Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond {; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16} · CPC title

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Frequently asked questions

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What does patent US10081744B2 cover?
Disclosed herein is an adhesive composition for an insulator, the adhesive composition including a copolymer formed by using at least one type of phenol-based monomer; at least one type of monomer that is polymerizable by an alkali salt; and at least one type of monomer that is polymerizable by a bisulfate.
Who is the assignee on this patent?
Lg Hausys Ltd
What technology area does this patent fall under?
Primary CPC classification C09J129/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 25 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).