Resin particle composition

US10081718B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10081718-B2
Application numberUS-201615218450-A
CountryUS
Kind codeB2
Filing dateJul 25, 2016
Priority dateFeb 10, 2016
Publication dateSep 25, 2018
Grant dateSep 25, 2018

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  1. Title

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  2. Abstract

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Abstract

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A resin particle composition includes resin particles, polishing agent particles having an average circle-equivalent diameter of 0.1 μm to 3.0 μm, and silica particles having a compression aggregation degree of 60% to 95% and a particle compression ratio of 0.20 to 0.40.

First claim

Opening claim text (preview).

What is claimed is: 1. A resin particle composition, comprising: resin particles; polishing agent particles having an average circle-equivalent diameter of 0.1 μm to 3.0 μm; and silica particles having a compression aggregation degree of 60% to 95% and a particle compression ratio of 0.20 to 0.40; wherein the silica particles are surface-treated with a siloxane compound having a viscosity of 1,000 cSt to 50,000 cSt, and the surface attachment amount of the siloxane compound is from 0.01% by weight to 5% by weight. 2. The resin particle composition according to claim 1 , wherein an average circle-equivalent diameter of the silica particles is from 40 nm to 200 nm. 3. The resin particle composition according to claim 1 , wherein a particle dispersion degree of the silica particles is 90% to 100%. 4. The resin composition according to claim 1 , wherein the siloxane compound is silicone oil. 5. The resin particle composition according to claim 1 , wherein an average circularity degree of the silica particles is 0.85 to 0.98. 6. The resin particle composition according to claim 1 , wherein the silica particles are sol-gel silica particles. 7. The resin particle composition according to claim 1 , wherein a ratio (Da/Dsi) of the average circle-equivalent diameter (Da) of the polishing agent particles to the average circle-equivalent diameter (Dsi) of the silica particles is from 0.5 to 75.

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What does patent US10081718B2 cover?
A resin particle composition includes resin particles, polishing agent particles having an average circle-equivalent diameter of 0.1 μm to 3.0 μm, and silica particles having a compression aggregation degree of 60% to 95% and a particle compression ratio of 0.20 to 0.40.
Who is the assignee on this patent?
Fuji Xerox Co Ltd
What technology area does this patent fall under?
Primary CPC classification C08K3/36. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 25 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).