Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board

Patent metadata

Field	Value
Publication number	US-10081585-B2
Application number	US-201414897864-A
Country	US
Kind code	B2
Filing date	Feb 21, 2014
Priority date	Jun 14, 2013
Publication date	Sep 25, 2018
Grant date	Sep 25, 2018

Abstract

There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The compound containing a phenolic hydroxyl group has a molecular structure represented by the following General Formula (I):

wherein X is a structural site represented by the following Structural Formula (x1) or (x2);

wherein, in Formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formula (Ar1), and in a case where when k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other;

wherein r is 1 or 2.

First claim

The invention claimed is:

1. A compound containing a phenolic hydroxyl group, which has a molecular structure represented by the following General Formula (I):

wherein X is a structural site represented by the following Structural Formula (x1) or (x2);

wherein, in Formula (x1) or (x2), each of R 1 and R 2 is any one of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group, and an aralkyl group, 1 is an integer of 0 to 3, n is an integer of 0 to 4, in a case where 1 or n is 2 or greater, a plurality of R 1 's or R 2 's may be the same as or different from each other, k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formulas (Ar1):

wherein in a case where k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other; and
wherein, R 3 is any one of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group, and an aralkyl group, R 3 may be bonded to either of two aromatic nuclei, s is an integer of 0 to 6, in a case where s is 2 or greater, a plurality of R 3 's may be the same as or different from each other, and r is 1 or 2.

2. A phenolic resin, comprising:
the compound containing a phenolic hydroxyl group according to claim 1 .

3. A curable composition, comprising as essential components:
the compound containing a phenolic hydroxyl group according to claim 1 ; and
a curing agent.

4. A cured product which is obtained by a curing reaction of the curable composition according to claim 3 .

5. A semiconductor sealing material, comprising:
the curable composition according to claim 3 ; and
an inorganic filler.

6. A printed circuit board obtained by impregnating a reinforcement basic material with a resin composition varnished by blending the curable composition according to claim 3 with an organic solvent, and superposing a copper foil on the resulting material, followed by heat-pressing.

Assignees

• Dainippon Ink & Chemicals

Inventors

• Satou Yutaka
• Takahashi Ayumi

Classifications

• H10W74/473

  containing a filler · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• C07C39/14 Primary

  with at least one hydroxy group on a condensed ring system containing two rings · CPC title

• C08L65/00

  Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain (C08L7/00 - C08L57/00, C08L61/00 take precedence); Compositions of derivatives of such polymers · CPC title

• H05K1/0373

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title