Die mounted contact applicator

Patent metadata

Field	Value
Publication number	US-10081022-B2
Application number	US-201615265560-A
Country	US
Kind code	B2
Filing date	Sep 14, 2016
Priority date	Sep 15, 2015
Publication date	Sep 25, 2018
Grant date	Sep 25, 2018

Abstract

A slot die assembly for applying at least one material onto a substrate includes an adapter having a passive heat transfer device, a shim package fluidically connected to the adapter, the shim package having a first material discharge slot and a second material discharge slot, and a die plate having a one or more fluid channels fluidically connected to the shim package. The assembly also includes one or more mounting studs extending from the adapter, the mounting studs configured to engage a parent machine.

First claim

The invention claimed is:

1. A slot die assembly for applying at least one material onto a substrate, the slot die assembly comprising:
an adapter having a passive heat transfer device disposed therein and configured to receive the at least one material;
a shim package having a first shim plate, a second shim plate and a third shim plate fluidically connected to the adapter and configured to receive the at least one material from the adapter, the first shim plate having a first slot for discharging a first material of the at least one material and the third shim plate having a second slot for discharging a second material of the at least one material;
a die plate having a one or more fluid channels fluidically connected to the shim package;
one or more mounting studs extending from the adapter to a first height, the mounting studs configured to engage a parent machine; and
one or more first fasteners configured to engage an applicator component, the first fasteners extending from the adapter to a second height, wherein the second height is less than the first height.

2. The slot die assembly of claim 1 , wherein a first path extends in the adapter and is configured to deliver the first material to the first slot for discharging the first material.

3. The slot die assembly of claim 2 , wherein a second path extends in the adapter, the shim package and the die plate and is configured to deliver the second material to the second slot for discharging the second material, the second path including the one or more fluid channels of the die plate.

4. The slot die assembly of claim 1 , wherein the second shim plate is positioned between and spaces apart the first shim plate from the third shim plate.

5. The slot die assembly of claim 1 , wherein the adapter has a width of approximately 300 mm.

6. An applicator for applying at least one material onto a substrate, the applicator comprising:
one or more applicator components having a combined first width, the one or more applicator components including at least one of a service block and a valve manifold; and
a slot die assembly secured to the one or more applicator components, the slot die assembly having a second width greater than the first width so as to extend beyond lateral ends of the one or more applicator components, the slot die assembly further comprising two mounting studs spaced apart along the width of the slot die assembly, and the one or more applicator components are positioned between the two mounting studs,
wherein the mounting studs are configured to engage a parent machine to secure the slot die assembly and the one or more applicator components to the parent machine, and
wherein the slot die assembly is configured to receive the at least one material and comprises a discharge slot for discharging the at least one material.

7. The applicator of claim 6 , wherein the slot die assembly includes an adapter, a shim package and a die plate, wherein the shim package includes one or more shim plate and the discharge slot is formed in a shim plate of the one or more shim plates.

8. The applicator of claim 7 , wherein the adapter includes a passive heat transfer device disposed therein.

9. The applicator of claim 8 , wherein the passive heat transfer device is made from a material having a higher thermal conductivity than the adapter.

10. The applicator of claim 6 , wherein the one or more applicator components further include a secondary fastening mechanism including one or more fasteners configured to engage the parent machine.

11. An applicator assembly for applying at least one material onto a substrate, the applicator assembly comprising:
a parent machine having one or more bores;
one or more applicator components having a combined first width, the one or more applicator components including at least one of a service block and a valve manifold; and
a slot die assembly secured to the one or more applicator components, the slot die assembly having a second width greater than the first width so as to extend beyond lateral ends of the one or more applicator components, the slot die assembly further comprising two mounting studs spaced apart along the width of the slot die assembly, and the one or more applicator components are positioned between the two mounting studs,
wherein the mounting studs are disposed in fastening engagement with the one or more bores, respectively, of the parent machine to secure the slot die assembly and the one or more applicator components to the parent machine, and
wherein the slot die assembly includes an adapter, a shim package and a die plate, and is configured to receive the at least one material, direct the at least one material through an internal flow path and discharge the at least one material through one or more shim plates of the shim package.

12. The applicator assembly of claim 11 , wherein the one or more applicator components further include a secondary fastening mechanism including one or more fasteners for engaging the parent machine.

Assignees

• Illinois Tool Works

Inventors

• Ayers Andrew S

Classifications

• B29C48/07

  Flat, e.g. panels · CPC title

• B05C5/0254

  Coating heads with slot-shaped outlet (B05C5/0283 takes precedence) · CPC title

• B29C48/305

  having a wide opening, e.g. for forming sheets · CPC title

• B29C48/875

  for achieving a non-uniform temperature distribution, e.g. using barrels having both cooling and heating zones · CPC title

• B29C48/307

  specially adapted for bringing together components, e.g. melts within the die · CPC title