Circuit board interconnection structure and circuit board interconnection method

Patent metadata

Field	Value
Publication number	US-10080298-B2
Application number	US-201414257546-A
Country	US
Kind code	B2
Filing date	Apr 21, 2014
Priority date	Apr 26, 2013
Publication date	Sep 18, 2018
Grant date	Sep 18, 2018

Abstract

Provided is a circuit board interconnection structure including: a first circuit board including a first substrate and a first electrode formed on a surface of the first substrate; a second circuit board including a second substrate and a second electrode formed on a surface of the second substrate; one or more joining portions formed of a metal-containing conductive material for joining the first and second electrodes, interposed between the first and second electrodes; and a reinforcing resin portion for reinforcing the one or more joining portions. The first electrode is a transparent electrode including a metal oxide film. A first abutting portion of the joining portion abutting the first electrode, is formed by adhesional wetting of the first electrode with the conductive material.

First claim

The invention claimed is:

1. A circuit board interconnection structure comprising:
a first circuit board including a first substrate and a first electrode disposed on a surface of the first substrate;
a second circuit board including a second substrate and a second electrode disposed on a surface of the second substrate;
one or more joining portions composed of a metal-containing conductive material, comprising solder, for joining the first and second electrodes, interposed between the first and second electrodes; and
a reinforcing resin portion for reinforcing the one or more joining portions, the reinforcing resin portion including therein the one or more joining portions,
the first electrode being a transparent electrode including a metal oxide film,
a first abutting portion of the one or more joining portions abutting a surface of the metal oxide film of the first electrode facing the second electrode with a contact angle larger than 90°, and
a second abutting portion of the one or more joining portions abuts a surface of the second electrode facing the first electrode with a contact angle smaller than 90°.

2. The circuit board interconnection structure in accordance with claim 1 ,
wherein the metal oxide film includes at least one selected from the group consisting of an oxide containing indium and tin, an oxide containing gallium and zinc, and an oxide containing aluminum and zinc; and has a thickness of 0.05 μm to 0.4 μm, and
the metal oxide film is disposed directly on the surface of the first substrate.

3. The circuit board interconnection structure in accordance with claim 1 ,
wherein the conductive material includes at least one selected from the group consisting of indium, tin, gold, and silver.

4. The circuit board interconnection structure in accordance with claim 1 ,
wherein the first substrate includes a transparent substrate, and
the second substrate includes a resin film.

5. The circuit board interconnection structure in accordance with claim 1 ,
wherein the second electrode includes: a base electrode including copper; and a metal film including gold, disposed on a surface of the base electrode.

6. The circuit board interconnection structure in accordance with claim 5 ,
wherein the base electrode has a thickness of 5 μm to 30 μm, and
the metal film has a thickness of 0.05 μm to 0.45 μm.

7. The circuit board interconnection structure in accordance with claim 1 ,
wherein a ratio of a largest cross-sectional area of the one or more joining portions to a cross-sectional area of the first abutting portion is 1.1 to 4.

8. The circuit board interconnection structure in accordance with claim 1 , wherein the conductive material includes a Sn—Bi alloy, a Sn—Ag—Cu alloy, a Sn—Bi—Ag alloy, a Sn—Cu alloy, a Sn—Sb alloy, a Sn—Ag alloy, a Sn—Ag—Cu—Bi alloy, a Sn—Ag—Bi—In alloy, a Sn—Ag—Cu—Sb alloy, a Sn—Zn alloy, or a Sn—Zn—Bi alloy.

9. The circuit board interconnection structure in accordance with claim 1 , wherein the conductive material has a melting point of 110° C. to 240° C.

10. The circuit board interconnection structure in accordance with claim 1 , further comprising:
metal-containing conductive particles comprising solder that is a same solder as in the one or more joining portions,
the metal-containing conductive particles being dispersed in the reinforcing resin portion and having a different shape from the one or more joining portions.

Assignees

• Panasonic Corp

Inventors

• Eifuku Hideki
• Motomura Koji

Classifications

• H05K3/323

  by applying an anisotropic conductive adhesive layer over an array of pads · CPC title

• H05K1/03

  Use of materials for the substrate · CPC title

• H05K2201/0326

  Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO] · CPC title

• H05K2201/10234

  Metallic balls · CPC title

• H05K3/361 Primary

  Assembling flexible printed circuits with other printed circuits · CPC title