Method of preparing organic electronic device

Patent metadata

Field	Value
Publication number	US-10079351-B2
Application number	US-201414777082-A
Country	US
Kind code	B2
Filing date	Sep 30, 2014
Priority date	Sep 30, 2013
Publication date	Sep 18, 2018
Grant date	Sep 18, 2018

Abstract

A method of preparing an organic electronic device, an organic electronic device prepared using the same, and a use thereof are provided. For example, the method of effectively preparing an organic electronic device using a flexible substrate, the organic electronic device prepared using the same, and the use thereof may be provided.

First claim

What is claimed is:

1. A method of preparing an organic electronic device, comprising:
forming a polymer layer having a convex portion and a concave portion formed in a surface thereof on an entire surface of a carrier substrate;
disposing a flexible substrate on the polymer layer to come in contact with the convex portion of the polymer layer;
forming an organic electronic element on a top surface of the flexible substrate; and
peeling off the flexible substrate and the organic electronic element from the polymer layer.

2. The method of claim 1 , wherein the polymer layer comprises polyorganosiloxane.

3. The method of claim 2 , wherein the polyorganosiloxane comprises a repeating unit represented by the following Formula 1:

wherein R 1 and R 2 are each independently hydrogen, an alkyl group, an alkenyl group, or an aryl group.

4. The method of claim 1 , wherein the convex portion of the polymer layer is formed so that a contact ratio of the convex portion of the polymer layer to the flexible substrate is in a range of 10 to 95%, based on the total area of the polymer layer.

5. The method of claim 1 , wherein the convex portion of the polymer layer is formed so that an aspect ratio of the convex portion is in a range of 0.0001 to 10,000.

6. The method of claim 1 , wherein the forming of polymer layer comprises:
forming a layer of a curable polymer composition on the carrier substrate;
bringing the layer of the curable polymer composition into contact with a mold; and
curing the layer of the curable polymer composition brought into contact with the mold.

7. The method of claim 6 , wherein the curable polymer composition is selected from the group consisting of an addition-curable silicon-based material, a condensation- or polycondensation-curable silicon-based material, a UV-curable silicon-based material, and a peroxide-vulcanized silicon-based material.

8. The method of claim 1 , wherein the flexible substrate is a thin-film glass.

9. The method of claim 1 , wherein the flexible substrate is a polymer film.

Assignees

• Lg Display Co Ltd

Inventors

• Lee Sang Jun
• Choi Jun Rye

Classifications

• Y02E10/549

  Organic PV cells · CPC title

• B32B3/30

  characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} · CPC title

• B32B2457/206

  Organic displays, e.g. OLED · CPC title

• B32B27/283

  comprising polysiloxanes · CPC title

• H01L51/004

  Electricity · mapped topic