Package manufacturing method, light emitting device manufacturing method, package, and light emitting device

Patent metadata

Field	Value
Publication number	US-10079332-B2
Application number	US-201615373345-A
Country	US
Kind code	B2
Filing date	Dec 8, 2016
Priority date	Dec 9, 2015
Publication date	Sep 18, 2018
Grant date	Sep 18, 2018

Abstract

A method for manufacturing a package includes the steps of: preparing a lead frame having a frame, a first electrode, a second electrode, a first connecting portion connecting the frame and the first electrode, and a second connecting portion connecting the frame and the second electrode; placing the lead frame in a mold; injecting a first resin into the mold from an inlet of the mold located adjacent to the first electrode to mold a flange portion and a wall portion of the package; and cutting the lead frame and a part of the flange portion located adjacent to the first electrode. In the step of injecting the first resin, the mold and the lead frame together provide a hollow space into which the first resin is injected and in which a part of the flange portion is formed so as to have a thickness different from a thickness of the lead frame.

First claim

The invention claimed is:

1. A method for manufacturing a package, comprising the steps of:
preparing a lead frame having a frame, a first electrode, a second electrode, a first connecting portion connecting the frame and the first electrode, and a second connecting portion connecting the frame and the second electrode;
placing the lead frame in a mold;
injecting a first resin into the mold from an inlet of the mold to mold a resin body for the package, the resin body including a wall portion and a flange portion projecting laterally and outwardly beyond an outermost surface of a lowermost portion of the wall portion; and
cutting the lead frame and a part of the flange portion, the part being located adjacent to the first electrode,
wherein, in the step in which the flange portion is molded, the mold and the lead frame together provide a hollow space into which the first resin is injected to mold the resin body in the hollow space, the hollow space being configured such that the flange portion of the resin body includes a portion adjacent the inlet and having
a thickness different from a thickness of the lead frame.

2. A method for manufacturing a package, comprising the steps of:
preparing a lead frame having a first electrode and a second electrode distinct from the first electrode, the first electrode and the second electrode located in a package formation region defined on the lead frame;
sandwiching the first electrode and the second electrode between an upper mold and a lower mold constituting a mold having an inlet from which a first resin is injected, such that, in a plan view, the inlet is outside the package formation region and spaced apart from the first electrode in plan view;
injecting a first resin from the inlet into the mold in which the first electrode and the second electrode have been sandwiched between the upper mold and the lower mold;
curing or solidifying the injected first resin; and
after curing or solidifying the injected first resin, removing an injection flow mark of the first resin formed adjacent to the first electrode and cutting the lead frame to singulate a package,
wherein, in the step of injecting the first resin, the upper mold, the lower mold, and the lead frame together provide a hollow space into which the first resin is injected, and
wherein the hollow space includes a space defined by the upper mold and the lower mold and having a vertical dimension different from a thickness of the lead frame, at a location adjacent the inlet.

3. A method for manufacturing a package according to claim 1 ,
wherein the lead frame has a first through-hole between the first electrode and the first connecting portion and has a second through-hole between the second electrode and the second connecting portion.

4. A method for manufacturing a package according to claim 3 ,
wherein, in the package, the first electrode has a first inner lead portion and a first outer lead portion, to which first outer lead portion the first through-hole partially belongs, and wherein, in the package, the second electrode has a second inner lead portion and a second outer lead portion, to which second outer lead portion the second through-hole partially belongs.

5. A method for manufacturing a package according to claim 1 ,
wherein the prepared lead frame has a first through-opening located adjacent to the first electrode or the first connecting portion and the first resin is injected through the first through-opening.

6. A method for manufacturing a package according to claim 1 ,
wherein the first electrode and the second electrode of the prepared lead frame are spaced apart from each other.

7. A method for manufacturing a package according to claim 1 ,
wherein the mold has a recessed portion that corresponds to the wall portion formed on the first electrode and the second electrode, and the first resin is injected into the recessed portion.

8. A method for manufacturing a package according to claim 1 ,
wherein the wall portion formed by molding the first resin with the mold constitutes side walls of a bottomed recess that fixes the first electrode and the second electrode and has a bottom at least a part of which is composed of the first electrode and the second electrode, and
wherein the flange portion formed by molding the first resin with the mold projects outwardly from the wall portion and has a part located adjacent to the first outer lead portion in plan view and having a thickness different from a thickness of the first outer lead portion.

9. A method for manufacturing a package according to claim 1 ,
wherein the step of injecting the first resin is carried out by transfer molding or injection molding.

10. A method for manufacturing a package according to claim 1 ,
wherein the first resin has been blended with a light reflecting material.

11. A method for manufacturing a light emitting device, comprising:
the steps of the method for manufacturing a package according to claim 1 ; and
a step of mounting a light emitting element on the first electrode or the second electrode, the step of mounting the light emitting element being carried out after the step of curing or solidifying the injected first resin and before or after the step of removing the injection flow mark of the first resin.

12. A method for manufacturing a light emitting device according to claim 11 ,
further comprising a step of applying a second resin into the package to seal the light emitting element, the step of applying the second resin being carried out after the step of mounting the light emitting element.

13. A method for manufacturing a package according to claim 1 ,
wherein the lead frame is placed in the mold having the inlet from which the first resin is injected, in such a position that the inlet is spaced apart from the first connecting portion when viewed in plan view.

14. A method for manufacturing a package according to claim 1 ,
wherein the lead frame has a through-opening including a first through-opening region adjacent the first electrode,
wherein the lead frame has a package formation region defined thereon where the package is to be formed and the first electrode and the second electrode are located in a plan view, and
wherein the first through-opening region includes a resin injection region outside the package formation region.

15. A method for manufacturing a package according to claim 2 ,
wherein the lead frame has a through-opening including a first through-opening region adjacent the first electrode,
wherein the lead frame has a package formation region defined thereon where the package is to be formed and the first electrode and the second electrode are located in a plan view, and
wherein the first through-opening region includes a resin injection region located outside the package formation region.

16. A method for manufacturing a package according to claim 15 ,
wherein the mold is configured such that the lead frame, the upper mold, and the lower mold define a cavity corresponding to a resin body for the package and define an intermediate opening located adjacent the first electrode in a plan view and communicating between the resin injection region and the cavity, the intermediate opening having a vertical opening dimension different from a thickness of the first electrode,
wherein the inlet communicates with the cavity via the resin injection region and the intermediate opening, and
wherein the first resin is injected from the inlet of the mold via the resin injection region and the intermediate opening, into the cavity.

Assignees

• Nichia Corp

Inventors

• Fukuda Mayumi
• Kishimoto Tomohisa

Classifications

• B29C33/12

  with incorporated means for positioning inserts, e.g. labels {(positioning reinforcements B29C70/541)} · CPC title

• B29C41/00

  Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor (with compacting pressure B29C43/00 {; by lay-up of reinforcement of substantial or continuous length B29C70/30}) · CPC title

• B29C45/14065

  Positioning or centering articles in the mould · CPC title

• B29C45/14655

  connected to or mounted on a carrier, e.g. lead frame · CPC title

• H01L2933/0058

  Electricity · mapped topic