Curable organopolysiloxane composition, and protective-agent or adhesive-agent composition for electrical/electronic components

Patent metadata

Field	Value
Publication number	US-10077339-B2
Application number	US-201515302563-A
Country	US
Kind code	B2
Filing date	Mar 26, 2015
Priority date	Apr 9, 2014
Publication date	Sep 18, 2018
Grant date	Sep 18, 2018

Abstract

A curable organopolysiloxane composition that can achieve excellent initial adhesion improvement effects towards various types of substrates, and a protective agent or adhesive composition for electric and electronic components, are provided. The curable organopolysiloxane composition comprises (A) either i) (a1) an organopolysiloxane having a specific alkoxysilyl-containing group and at least an average of 0.5 alkenyl groups, or ii) a mixture of (a1) and (a2) an organopolysiloxane that has at least two alkenyl groups in a molecule, and that does not have the aforementioned group having an alkoxysilyl group. In the mixture, the amount of component (a1) is 10 to less than 100 mass %. The curable organopolysiloxane composition further comprises (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in each molecule, (C) a catalyst for a hydrosilylation reaction, and (D) a catalyst for a condensation reaction.

First claim

The invention claimed is:

1. A curable organopolysiloxane composition comprising:
(A) 100 mass parts of either;
i) (a1) an organopolysiloxane having, in each molecule thereof, an average of 0.5 alkenyl groups and at least one alkoxysilyl-containing group bonded to a silicon atom and expressed by the general formula:

 where each R 1 represents the same or different monovalent hydrocarbon group without an aliphatic unsaturated bond, R 2 represents an alkyl group, each R 3 represents the same or different alkylene group, a represents an integer from 0 to 2, and p represents an integer from 1 to 50, or
ii) a mixture of component (a1) and (a2) an organopolysiloxane having, in each molecule thereof, at least two alkenyl groups but not the alkoxysilyl-containing group, where the amount of component (a1) in the mixture is 10 to less than 100 mass %;

(B) an organopolysiloxane having, in each molecule thereof, at least two silicon-bonded hydrogen atoms, where component (B) is present in an amount such that an amount of silicon-bonded hydrogen atoms in the curable organopolysiloxane composition is 0.3 to 20 with regard to one alkenyl group in component (A);
(C) a catalytic amount of a catalyst for a hydrosilylation reaction;
(D) a catalytic amount of a catalyst for a condensation reaction; and
(E) an adhesion promoter;
wherein component (E) comprises at least two of:
(e1) a reaction mixture of an organoalkoxysilane having an amino group and an organoalkoxysilane having an epoxy group;
(e2) an organic compound having at least two alkoxysilyl groups in a molecule and having a bond other than a silicon-oxygen bond between these alkoxysilyl groups; and
(e3) a silane having an epoxy group expressed by the general formula: R a n Si(OR b ) 4-n where R a represents an organic group having a monovalent epoxy group, R b represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n represents a number within a range of 1 to 3; or a hydrolysate thereof, or a partially hydrolyzed condensate thereof.

2. The curable organopolysiloxane composition according to claim 1 , wherein component (E) comprises:
100 mass parts of component (e1);
10 to 800 mass parts of component (e2); and
component (e3).

3. The curable organopolysiloxane composition according to claim 2 , wherein component (e3) is present in an amount of from 10 to 800 mass parts per 100 mass parts of component (e1).

4. The curable organopolysiloxane composition according to claim 1 , wherein component (a1) is a straight-chain organopolysiloxane having a group containing alkoxysilyl bonded to both molecular terminals and to a silicon atom on a molecular side chain.

5. The curable organopolysiloxane composition according to claim 1 , wherein the alkoxysilyl-containing group in component (a1) is expressed by the following formula:

6. The curable organopolysiloxane composition according to claim 1 , further comprising (F) an inorganic filler.

7. The curable organopolysiloxane composition according to claim 1 , which is room temperature curable.

8. The curable organopolysiloxane composition according to claim 1 , which is a two-component type curable organopolysiloxane composition.

9. The two-component type curable organopolysiloxane composition according to claim 8 , wherein a liquid component I contains at least component (C) and component (D), and optionally component (a2), and wherein a liquid component II contains at least component (A) and component (B).

10. A protective agent or adhesive composition for electric and electronic components, comprising the curable organopolysiloxane composition according to claim 1 .

11. An electric or electronic apparatus, made by sealing or enclosing an electric or electronic component using the curable organopolysiloxane composition according to claim 1 .

12. The curable organopolysiloxane composition according to 1, wherein component (a1) has at least two of the alkoxysilyl-containing groups.

13. The curable organopolysiloxane composition according to 12, wherein component (a1) has at least two and not more than 20 of the alkoxysilyl-containing groups.

14. The curable organopolysiloxane composition according to 1, wherein component (a1) has an average of at least 0.5 and not more than 20 alkenyl groups.

15. The curable organopolysiloxane composition according to 1, wherein component (B) is present in an amount of from 0.5 to 50 mass parts per 100 mass parts of component (A).

16. The curable organopolysiloxane composition according to 1, wherein component (E) is present in an amount of from 0.5 to 20 mass %.

17. The curable organopolysiloxane composition according to claim 1 , wherein component (E) comprises components (e1), (e2), and (e3).

18. The curable organopolysiloxane composition according to claim 1 , comprising:
i) 100 mass parts of component (e1); and/or
ii) 10 to 800 mass parts of component (e2); and/or
iii) 10 to 800 mass parts of component (e3) per 100 mass parts of component (e1); provided at least two of components (e1), (e2), and (e3) are present.

Assignees

• Dow Corning Toray Co Ltd

Inventors

• Fujisawa Toyohiko
• Kato Tomoko
• Kodama Harumi
• Onishi Masayuki

Classifications

• H10W74/476 Primary

  Organic materials comprising silicon · CPC title

• C08K2003/2227

  of aluminium · CPC title

• C08L83/00

  Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers · CPC title

• C08K3/22

  of metals · CPC title

• C08K3/36

  Silica · CPC title