Method for producing a structural component

US10076864B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10076864-B2
Application numberUS-201214359012-A
CountryUS
Kind codeB2
Filing dateSep 13, 2012
Priority dateNov 17, 2011
Publication dateSep 18, 2018
Grant dateSep 18, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for producing a structural component from an organometallic sheet includes a first step in which the organometallic sheet is preheated, introduced into a tool and subsequently re-formed. In a second step, a region of the re-formed organometallic sheet is heated. In a third step at least the heated region of the re-formed organometallic sheet is re-formed further in such a way that it enters into a material bond with a further region of the organometallic sheet to form an at least partly closed hollow profile. A device for carrying out the method for producing a structural component from an organometallic sheet and a structural component produced by the method also are described.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for producing a structural component from a thermoplastic sheet, the method comprising: in a first step, preheating the thermoplastic sheet, introducing the thermoplastic sheet into a tool, and subsequently shaping the thermoplastic sheet by closing the tool; in a second step, heating a region of the shaped thermoplastic sheet and injection molding a thermoplastic material around the thermoplastic sheet within the tool when the region is heated; and in a third step, opening the tool and moving at least the heated region of the shaped thermoplastic sheet with a slide to further shape the thermoplastic sheet after the tool is opened such that said region enters into a material bond with a further region of the thermoplastic sheet to form an at least partially closed hollow profile. 2. The method as claimed in claim 1 , further comprising attaching the thermoplastic material to a surface of the thermoplastic sheet with a material bond. 3. The method as claimed in claim 1 , wherein, by the shaping process, the thermoplastic sheet is shaped into a partial shape of the structural component according to the first step, and, by the further shaping process, the thermoplastic sheet is shaped into a final shape of the structural component according to the third step.

Assignees

Inventors

Classifications

  • Contains fabric, fiber particle, or filament made of glass, ceramic, or sintered, fused, fired, or calcined metal oxide, or metal carbide or other inorganic compound [e.g., fiber glass, mineral fiber, sand, etc.] · CPC title

  • Moulds · CPC title

  • B29C70/345Primary

    using matched moulds · CPC title

  • B29C70/46Primary

    using matched moulds, e.g. for deforming sheet moulding compounds [SMC] or prepregs · CPC title

  • Sheets, plates, blanks or films · CPC title

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What does patent US10076864B2 cover?
A method for producing a structural component from an organometallic sheet includes a first step in which the organometallic sheet is preheated, introduced into a tool and subsequently re-formed. In a second step, a region of the re-formed organometallic sheet is heated. In a third step at least the heated region of the re-formed organometallic sheet is re-formed further in such a way that it e…
Who is the assignee on this patent?
Flock Dustin, Meier Bernd, Adient Luxembourg Holding Sarl
What technology area does this patent fall under?
Primary CPC classification B29C70/345. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 18 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).