Electronic apparatus

Patent metadata

Field	Value
Publication number	US-10076063-B2
Application number	US-201514793161-A
Country	US
Kind code	B2
Filing date	Jul 7, 2015
Priority date	Mar 10, 2015
Publication date	Sep 11, 2018
Grant date	Sep 11, 2018

Abstract

According to one embodiment, an electronic apparatus includes a first substrate, a second substrate, an electronic component, a housing, and a protruding portion. The first substrate has a first face and a second face and is provided with an opening. The second substrate has a third face configured to face the second face and a fourth face and is configured to be electrically connected to the first substrate. The electronic component is configured to be mounted on the third face and is configured to be disposed at a position overlapping the opening in a direction in which the third face faces. The housing is configured to accommodate the first and second substrates. The protruding portion is provided in the housing and is configured to pass through the opening and be thermally connected to the electronic component.

First claim

What is claimed is:

1. An electronic apparatus comprising:
a first substrate comprising a first face and a second face on an opposite side of the first face and provided with an opening;
a second substrate comprising a third face configured to face the second face and a fourth face on an opposite side of the third face and configured to be electrically connected to the first substrate;
at least one first electronic component configured to be mounted on at least one of the first and second substrates and store information;
a second electronic component configured to be mounted on the third face of the second substrate, control the first electronic components, and be disposed at a position overlapping the opening in a direction in which the third face faces;
a housing configured to accommodate the first and second substrates and comprising a first cover configured to cover the first face of the first substrate;
a first protruding portion provided on the first cover and configured to protrude toward the second electronic component and pass through the opening; and
a first heat transfer member configured to be interposed between the first protruding portion and the second electronic component and connect the first protruding portion and the second electronic component thermally, wherein
the first cover includes a first portion, a second portion, and a fin, the first portion that covers the at least one first electronic component, the second portion that is separate from the first portion and covers the second electronic component, the fin provided on the second portion,
the first protruding portion is provided on the second portion and protrudes in an opposite direction to a direction where the fin protrudes,
the opening is a cutout that is open in an end face of the first substrate,
the end face faces in a first direction,
the second portion includes a first heat radiating portion and a second heat radiating portion,
the first heat radiating portion extends in a second direction intersecting with the first direction,
the second heat radiating portion extends from the first portion in the first direction and covers the second electronic component, and
the first protruding portion is provided on the second heat radiating portion.

2. The electronic apparatus of claim 1 , wherein
when seen in a plan view from the direction in which the third face faces, the second electronic component is configured to be surrounded by edges of the first substrate, which form the opening.

3. The electronic apparatus of claim 2 , further comprising
a second heat transfer member, wherein
the housing further includes a second cover configured to cover the fourth face of the second substrate,
at least one of the first electronic components is configured to be mounted on the fourth face of the second substrate, and
the second heat transfer member is configured to connect the second cover and the at least one of the first electronic components mounted on the fourth face thermally.

4. The electronic apparatus of claim 3 , further comprising
a third heat transfer member, wherein
at least one of the first electronic components is configured to be mounted on the first face of the first substrate, and
the third heat transfer member is configured to connect the first portion and the at least one of the first electronic components mounted on the first face thermally.

5. The electronic apparatus of claim 4 , further comprising:
a first connector mounted on the second face of the first substrate and configured to protrude toward the third face of the second substrate;
a second connector mounted on the third face of the second substrate and configured to protrude toward the second face of the first substrate, be connected to the first connector, and connect the first and second substrates electrically; and
a second protruding portion provided in the first portion and configured to protrude toward the first face of the first substrate and be thermally connected to a position of the first face overlapping the first connector in a direction in which the first face faces.

6. The electronic apparatus of claim 5 , wherein
the first substrate and the first connector are configured to be held between the second protruding portion and the second connector.

7. The electronic apparatus of claim 6 , wherein
the first connector is configured to be disposed in a central portion of the first substrate in a direction in which the first substrate extends.

8. The electronic apparatus of claim 7 , wherein
at least one of the first electronic components is configured to be mounted at a position of the fourth face of the second substrate overlapping the second connector in a direction in which the fourth face faces.

9. The electronic apparatus of claim 8 , wherein
the housing comprises a frame,
the first substrate is configured to be attached to the frame,
the second substrate is configured to be attached to the frame at a position separated from the first substrate in the direction in which the third face faces, and
the first cover is configured to be attached to the frame.

10. The electronic apparatus of claim 9 , wherein
the frame includes a fifth face supporting the first heat radiating portion.

11. The electronic apparatus of claim 10 , wherein
the frame is provided with a concave portion on the fifth face,
the first heat radiating portion includes a convex portion protruding toward the concave portion,
the convex portion is fitted to the concave portion.

12. The electronic apparatus of claim 1 , wherein
the housing comprises a frame,
the first substrate is configured to be attached to the frame,
the second substrate is configured to be attached to the frame at a position separated from the first substrate in the direction in which the third face faces, and
the first cover is configured to be attached to the frame.

13. The electronic apparatus of claim 12 , wherein
the frame includes a fifth face supporting the first heat radiating portion.

14. The electronic apparatus of claim 13 , wherein
the frame is provided with a concave portion on the fifth face,
the first heat radiating portion includes a convex portion protruding toward the concave portion,
the convex portion is fitted to the concave portion.

15. The electronic apparatus of claim 1 , wherein
the housing is provided with a gap between the first portion and the second portion.

16. The electronic apparatus of claim 1 , wherein
the second electronic component is longer than the first electronic components in the direction in which the third face of the second substrate faces.

17. The electronic apparatus of claim 1 , wherein
the housing further includes a second cover configured to cover the fourth face of the second substrate, and
the second cover is configured to be thermally connected to a position of the fourth face overlapping the second electronic component in a direction in which the third face faces.

18. The electronic apparatus of claim 1 , wherein the first heat radiating portion is away from the end face in the first direction.

19. The electronic apparatus of claim 18 , wherein the first protruding portion is fitted in the opening, with an end protruding outside the opening in the first direction.

Assignees

• Toshiba Memory Corp

Inventors

• Matsuda Yoshiharu
• Yoshida Kazuhiro
• Sawanaka Kenichi

Classifications

• G11B33/128

  of the plurality of recording/reproducing devices, e.g. disk drives, onto a chassis · CPC title

• G11B33/1406

  Reducing the influence of the temperature · CPC title

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

• H05K7/1427

  Housings · CPC title

• H05K7/20445 Primary

  the coupling element being an additional piece, e.g. thermal standoff · CPC title