Ultra-small camera module with wide field of view, and associate lens systems and methods

Patent metadata

Field	Value
Publication number	US-10075636-B2
Application number	US-201615138568-A
Country	US
Kind code	B2
Filing date	Apr 26, 2016
Priority date	Apr 26, 2016
Publication date	Sep 11, 2018
Grant date	Sep 11, 2018

Abstract

An ultra-small camera module with wide field of view includes (a) a wafer-level lens system for forming, on an image plane, an image of a wide field-of-view scene, wherein the wafer-level lens system includes (i) a distal planar surface positioned closest to the scene and no more than 2.5 millimeters away from the image plane in direction along optical axis of the wafer-level lens system, and (ii) a plurality of lens elements optically coupled in series along the optical axis, each of the lens elements having a curved surface, and (b) an image sensor mechanically coupled to the wafer-level lens system and including a rectangular array of photosensitive pixels, positioned at the image plane, for capturing the image, wherein cross section of the ultra-small camera module, orthogonal to the optical axis, is rectangular with side lengths no greater than 1.5 millimeters.

First claim

What is claimed is:

1. An ultra-small camera module with wide field of view, comprising:
a wafer-level lens system for forming, on an image plane, an image of a wide field-of-view scene, the wafer-level lens system including
(a) a distal planar surface positioned closest to the scene and no more than 2.5 millimeters away from the image plane in direction along optical axis of the wafer-level lens system, and
(b) a plurality of lens elements optically coupled in series along the optical axis, each of the lens elements having a curved surface; and

an image sensor mechanically coupled to the wafer-level lens system and including a rectangular array of photosensitive pixels, positioned at the image plane, for capturing the image;
wherein cross section of the ultra-small camera module, orthogonal to the optical axis, is rectangular with side lengths no greater than 1.5 millimeters; and
wherein the plurality of lens elements comprise:
a one-sided wafer-level lens including:
(i) a first substrate implementing the distal planar surface, and
(ii) a first lens element disposed on side of the first substrate facing the image sensor, and

a two-sided wafer-level lens disposed between the one-sided wafer-level lens and the image sensor and including:
(i) a second substrate,
(ii) a second lens element disposed on side of the second substrate facing the one-sided wafer-level lens, and
(iii) a third lens element disposed on side of the second substrate facing the image sensor.

2. The ultra-small camera module of claim 1 , the wafer-level lens system further comprising an aperture disposed on the distal planar surface and configured to block light incident on the distal planar surface outside a central area that is shaped as a rounded rectangle.

3. The ultra-small camera module of claim 2 , the rounded rectangle having same aspect ratio as the cross section.

4. The ultra-small camera module of claim 1 ,
the image sensor further comprising a cover glass; and
the wafer-level lens system further comprising a transparent substrate disposed on the cover glass to reduce angles, relative to the optical axis, of light from the scene, to reduce extent of image sensor transverse to the optical axis necessary to capture the image.

5. The ultra-small camera module of claim 4 , the transparent substrate having thickness, along the optical axis, in range from 0.3 to 0.5 millimeters.

6. The ultra-small camera module of claim 4 , the transparent substrate being bonded to the cover glass.

7. The ultra-small camera module of claim 4 , the wafer-level lens system further comprising a wavelength filter coated onto side of the transparent substrate facing the scene.

8. The ultra-small camera module of claim 7 , the wafer-level lens system further comprising:
a wafer-level lens implementing at least one of the lens elements; and
a spacer bonded to the wafer-level lens and side of the transparent substrate associated with the wavelength filter, to couple the wafer-level lens to the image sensor.

9. The ultra-small camera module of claim 1 , the second substrate being a composite substrate comprising:
a first sub-substrate coupled with the second lens element;
a second sub-substrate coupled with the third lens element; and
a stop aperture disposed at interface between the first sub-substrate and the second sub-substrate.

10. The ultra-small camera module of claim 1 ,
the first lens element including a concave lens surface, facing the image sensor, and a first planar surface surrounding the concave lens surface and facing the image sensor; and
the second lens element including a convex lens surface, facing away from the second substrate, and a second planar surface surrounding the convex lens surface and facing away from the image sensor, the second planar surface being bonded to the first planar surface.

11. The ultra-small camera module of claim 10 , the second planar surface being in direct contact with the first planar surface.

12. The ultra-small camera module of claim 10 ,
the image sensor further comprising a cover glass; and
the wafer-level lens system further comprising a transparent substrate disposed on the cover glass to reduce angles, relative to the optical axis, of light from the scene, to reduce extent of image sensor transverse to the optical axis necessary to capture the image.

13. The ultra-small camera module of claim 12 , the wafer-level lens system further comprising:
a wavelength filter coated onto side of the transparent substrate facing the scene; and
a spacer bonded to the third lens element and side of the transparent substrate associated with the wavelength filter, to couple the wafer-level lens to the image sensor.

14. The ultra-small camera module of claim 13 , the second substrate being a composite substrate comprising:
a first sub-substrate coupled with the second lens element;
a second sub-substrate coupled with the third lens element; and
a stop aperture disposed at interface between the first sub-substrate and the second sub-substrate.

15. The ultra-small camera module of claim 1 , the wafer-level lens system further comprising an aperture disposed on the distal planar surface and configured to block light incident on the distal planar surface outside a central area that is shaped as a rounded rectangle, to optimize (a) protection from stray light reaching the photosensitive pixels and (b) proper transmission of light through the wafer-level lens system to the photosensitive pixels.

16. The ultra-small camera module of claim 1 , having field-of-view angle of at least 110 degrees.

Assignees

• Omnivision Tech Inc

Inventors

• Wan Tsung Wei
• Cheng Ting-Yu
• Chen Wei-Ping
• Yin Chuen-Yi

Classifications

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/555

  for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• B29K2709/08

  Glass · CPC title