Screen-printing mask, related packaging method, display panel, display apparatus, and method for fabricating the same

Patent metadata

Field	Value
Publication number	US-10074821-B2
Application number	US-201515107346-A
Country	US
Kind code	B2
Filing date	Dec 28, 2015
Priority date	Jul 27, 2015
Publication date	Sep 11, 2018
Grant date	Sep 11, 2018

Abstract

The present disclosure provides a screen-printing mask for packaging organic light-emitting diode (OLED) products. The screen-printing mask includes a screen and a masking layer on the screen, the screen including a plurality of grids, and the masking layer including a plurality of blocking regions and a plurality of opening regions, the blocking regions being filled with a first blocking material, the opening regions corresponding to regions of an OLED substrate to be filled with a packaging material. In the opening regions, a first portion of the grids is exposed and a second portion of the grids is filled with a second blocking material, the first portion being a substantial portion of the grids.

First claim

What is claimed is:

1. A screen-printing mask for packaging organic light-emitting diode (OLED) products, comprising:
a screen and a masking layer on the screen, the screen including a plurality of grids, and the masking layer including a plurality of blocking regions and a plurality of opening regions, the blocking regions being filled with a first blocking material, the opening regions corresponding to regions of an OLED substrate to be filled with a packaging material,
wherein the grids in one of the opening regions include exposed grids that are exposed and filled grids that are filled with a second blocking material and randomly distributed.

2. The screen-printing mask according to claim 1 , wherein the first blocking material and the second blocking material are a same material.

3. The screen-printing mask according to claim 1 , wherein the filled grids are used for forming bubble structures in a packaging material printed onto the OLED substrate through the opening regions.

4. The screen-printing mask according to claim 1 , wherein:
a metal layer is on the regions of the OLED substrate to be filled with the packaging materials, the metal layer having a plurality of openings therein, and a pattern of the filled grids corresponding to a pattern of the openings in the metal layer.

5. A method for fabricating a screen-printing mask for packaging organic light-emitting diode (OLED) products, comprising:
providing a screen, the screen including a plurality of grids; and
forming a masking layer on the screen, the masking layer including opening regions and blocking regions, the blocking regions being filled with a first blocking material, the opening regions corresponding to regions to be filled with a packaging material on an OLED substrate;
in one of the opening regions where the screen and the opening regions overlap, forming exposed grids that are exposed and forming filled grids that are filled with a second blocking material and randomly distributed.

6. The method according to claim 5 , wherein the first blocking material and the second blocking material are a same material.

7. The method according to claim 5 , further including:
forming the filled grids in the one of the opening regions with the blocking region in the masking layer through one photolithography process.

8. The method according to claim 5 , wherein the filled grids are formed by filling corresponding grids with the second blocking material.

9. The method according to claim 5 , wherein the filled girds are used to prevent a packaging material from passing through during a packaging process.

10. The method according to claim 8 , wherein an adhesive, a gel, or a combination thereof are used to fill the corresponding grids for forming the filled grids.

11. A packaging method using a screen-printing mask according to claim 1 , comprising:
forming a frit pattern on a first substrate using the screen-printing mask, the frit pattern including a plurality of bubble structures; and
aligning and bonding the first substrate with the OLED substrate, and irradiating the frit pattern with a laser.

12. The packaging method according to claim 11 , wherein the bubble structures are formed by the filled grids filled with the second blocking material during a packaging process.

13. A display panel, comprising:
a first substrate and an OLED substrate being aligned to each other, and a frit pattern between the first substrate and the OLED substrate for bonding the first substrate and the OLED substrate,
wherein the frit pattern is formed using a screen-printing mask according to claim 1 .

14. A display apparatus, including one or more of the display panels according to claim 13 .

Assignees

• Boe Technology Group Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Li Yi

Classifications

• H01L51/56

  Electricity · mapped topic

• B41N1/24

  Stencils; Stencil materials; Carriers therefor (stencilling apparatus for office or other commercial use B41L13/00) · CPC title

• H01L51/4246 Primary

  Electricity · mapped topic

• H01L51/524

  Electricity · mapped topic

• H10K30/211

  comprising multiple junctions, e.g. double heterojunctions · CPC title