Semiconductor wafer, implantation apparatus for implanting protons and method for forming a semiconductor device

Patent metadata

Field	Value
Publication number	US-10074715-B2
Application number	US-201615259446-A
Country	US
Kind code	B2
Filing date	Sep 8, 2016
Priority date	Sep 9, 2015
Publication date	Sep 11, 2018
Grant date	Sep 11, 2018

Abstract

A method for forming a semiconductor device includes determining at least one electrical parameter for each semiconductor device of a plurality of semiconductor devices to be formed in a semiconductor wafer. The method further includes implanting doping ions into device areas of the semiconductor wafer used for forming the plurality of semiconductor devices with laterally varying implantation doses based on the at least one electrical parameter of the plurality of semiconductor devices.

First claim

What is claimed is:

1. A method for forming a semiconductor device, the method comprising:
determining at least one electrical parameter for each semiconductor device of a plurality of semiconductor devices to be formed in a semiconductor wafer; and
implanting doping ions into device areas of the semiconductor wafer used for forming the plurality of semiconductor devices with laterally varying implantation doses based on the at least one electrical parameter of the plurality of semiconductor devices,
wherein the at least one electrical parameter is an electrical breakdown voltage of at least one semiconductor device of the plurality of semiconductor devices.

2. The method of claim 1 , wherein the doping ions are implanted into a device area of a first semiconductor device of the plurality of semiconductor devices with a first implantation dose, and into a device area of a second semiconductor device of the plurality of semiconductor devices with a second different implantation dose, wherein the first semiconductor device and the second semiconductor device are located at different lateral portions of the semiconductor wafer.

3. The method of claim 1 , wherein the doping ions are implanted into a device area of at least one semiconductor device of the plurality of semiconductor devices to adjust the at least one electrical parameter related to the semiconductor device to vary by less than 10% from a predefined nominal electrical parameter value.

4. The method of claim 1 , wherein the doping ions are implanted into the device areas of the semiconductor devices of the plurality of semiconductor devices such that the at least one electrical parameter of more than 70% of the semiconductor devices of the plurality of semiconductor devices are individually adjusted to vary by less than 10% from a predefined nominal electrical parameter value.

5. The method of claim 1 , wherein the doping ions are implanted into the device areas of the semiconductor devices with laterally varying implantation doses of between 1*10 13 ions per cm 2 and 8*10 14 ions per cm 2 .

6. The method of claim 1 , wherein the doping ions are protons.

7. The method of claim 1 , wherein the doping ions are implanted into the device areas of the semiconductor devices with laterally varying implantation doses by varying a speed of motion, an angle, or a distance of the semiconductor wafer with respect to an ion beam implanting the doping ions.

8. The method of claim 1 , further comprising forming device doping regions of an electrical device structure in each device area of the plurality of semiconductor devices before implanting the doping ions into the device areas of the plurality of semiconductor devices with laterally varying implantation doses.

9. The method of claim 8 , wherein the device doping regions are formed in the semiconductor wafer within a trench and/or by ion implantation before implanting the doping ions.

10. The method of claim 8 , wherein the device doping regions comprise a plurality of drift regions having a first conductivity type and a plurality of compensation regions having a second conductivity type arranged alternatingly in a lateral direction.

11. The method of claim 1 , further comprising forming a source/drain or emitter/collector contact structure on at least one side of the semiconductor wafer after implanting the doping ions into the device areas of the plurality of semiconductor devices.

12. The method of claim 1 , further comprising annealing the semiconductor wafer after implanting doping ions into the device areas of the plurality of semiconductor devices with laterally varying implantation doses.

13. The method of claim 12 , wherein the semiconductor wafer is annealed at a temperature of between 380° C. and 500° C.

14. The method of claim 12 , wherein the semiconductor wafer is annealed for between 0.5 hours and 10 hours.

15. The method of claim 1 , wherein each semiconductor device to be formed comprises at least one electrical device structure from the following group of electrical device structures, the group of electrical device structures consisting of: a metal oxide semiconductor field effect transistor device structure; an insulated gate bipolar transistor device structure; a charge compensation transistor device structure; a diode structure; and a thyristor structure.

16. The method of claim 1 , wherein each semiconductor device to be formed has a blocking voltage of greater than 10 V.

17. An implantation apparatus for implanting protons, the apparatus comprising:
a proton implantation module configured to implant protons into a semiconductor substrate; and
a control module configured to control the proton implantation module so as to vary an implantation dose of protons laterally based on a measured electrical parameter value of a semiconductor device in the semiconductor substrate, such that the protons are implanted with different implantation doses at different lateral portions of the semiconductor substrate,
wherein the measured electrical parameter value is an electrical breakdown voltage of the semiconductor device.

18. The implantation apparatus of claim 17 , wherein the proton implantation module is configured to implant the protons into the semiconductor substrate at implantation energies of greater than 300 keV.

19. A semiconductor wafer, comprising:
a plurality of compensation devices, wherein each compensation device comprises a plurality of device drift regions having a first conductivity type and a plurality of compensation regions having a second conductivity type arranged alternatingly in a lateral direction,
wherein a breakdown voltage of more than 70% of the plurality of compensation devices varies by less than 10% from a nominal breakdown voltage of the plurality compensation devices.

Assignees

• Infineon Technologies Austria Ag

Inventors

• Schustereder Werner
• Schulze Hans-Joachim
• Weber Hans

Classifications

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P74/207

  Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics · CPC title

• H10P74/23

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• H10P34/40

  with high-energy radiation · CPC title

• H10P30/208

  of electrically inactive species · CPC title