Display substrate, display device thereof, and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-10074698-B2
Application number	US-201515503230-A
Country	US
Kind code	B2
Filing date	Jan 27, 2015
Priority date	Oct 29, 2014
Publication date	Sep 11, 2018
Grant date	Sep 11, 2018

Abstract

A display substrate, an Organic Light Emitting Diode (OLED) display device and a manufacturing method for the display substrate. The display substrate includes a plurality of pixel units located on a substrate and filter functional units corresponding to the pixel units. Each filter functional unit includes at least three micro-cavity structures, wherein the cavity lengths of the three micro-cavity structures in the direction of a vertical substrate are different, only light with a specific wavelength can penetrate through the micro-cavity structures with different cavity lengths, and the cavity lengths of micro-cavity structures corresponding to similar sub-pixel units of the pixel units are the same.

First claim

The invention claimed is:

1. A display substrate, comprising:
a plurality of pixel units disposed on a substrate,
a filter functional unit, wherein each of the pixel units is correspondingly provided with the filter functional unit; the filter functional unit includes at least three microcavity structures; the three microcavity structures are different in cavity length along a direction perpendicular to the substrate; only light with specific wavelength is capable of running through the microcavity structures with different cavity lengths; and the cavity length of the microcavity structures corresponding to subpixel units of a same type in the pixel unit is the same,
a luminous unit configured to emit white light, wherein the white light is emitted along a first direction, and
a reflecting structure being arranged on an opposite side of a light-emitting side of the luminous unit and allowing light in an opposite direction of the first direction to be reflected towards the first direction,
wherein the microcavity structures are disposed on the light-emitting side of the luminous unit; the three microcavity structures with different cavity lengths include isolation layers with different thicknesses; an isolated space is disposed between the isolation layers and the luminous unit; and each of the isolation layers includes Al material layers and SiO x material layers alternately arranged.

2. The display substrate according to claim 1 , wherein the cavity length of each of the microcavity structures is adjusted by adjusting a thickness of the isolation layer.

3. The display substrate according to claim 1 , wherein the cavity length of each of the microcavity structures is equal to a distance from one surface of the isolation layer close to the luminous unit to the reflecting structure.

4. The display substrate according to claim 1 , wherein the cavity length of each of the microcavity structures corresponds to a wavelength of transmitted light, so that the Fabry-Perot resonance equation can be satisfied.

5. The display substrate according to claim 1 , wherein the isolation layers in the microcavity structures for different colors of light are formed of sequentially and alternately arranged Al material layers and SiOx material layers with different layer numbers.

6. The display substrate according to claim 1 , wherein the luminous unit includes a cathode, an anode and an organic emission functional layer disposed between the cathode and the anode.

7. The display substrate according to claim 6 , wherein the organic emission functional layer includes a hole transportation layer, a light emitting layer and an electron transportation layer.

8. The display substrate according to claim 6 , wherein the cathode is disposed on one side of the organic emission functional layer away from the microcavity structure compared with the anode; and the cathode is taken as the reflecting structure.

9. The display substrate according to claim 6 , wherein the display substrate further comprises a thin-film transistors (TFT) configured to drive the luminous unit to emit light; and the TFT includes a gate electrode, an insulating layer, a semiconductor layer, source/drain electrodes and a protective layer which are sequentially arranged along a direction towards the luminous units from the substrate.

10. The display substrate according to claim 1 , wherein the three microcavity structures with different wavelengths respectively correspond to a blue subpixel unit, a red subpixel unit and a green subpixel unit in the pixel unit.

11. A display device, comprising the display substrate according to claim 1 .

12. A method for manufacturing a display substrate, comprising:
forming a pattern of a filter functional unit on a substrate, wherein
the filter functional unit is arranged corresponding to a pixel unit and includes at least three microcavity structures; the microcavity structures being different in cavity length along a direction perpendicular to the substrate; only light with specific wavelength is capable of running through the microcavity structures with different wavelengths; and the cavity length of the microcavity structures corresponding to subpixel units of a same type in the pixel unit is the same, and
forming the pattern of the filter functional unit includes: forming isolation layers with different thicknesses corresponding to the three microcavity structures with different cavity lengths, and each of the isolation layers includes Al material layers and SiO x material layers alternately arranged.

13. The manufacturing method according to claim 12 , wherein a pattern of a luminous unit is formed on a basis of forming the pattern of the filter functional unit; the luminous unit is configured to emit white light; and
forming the pattern of the luminous unit includes forming an anode, an organic emission functional layer and a cathode in sequence.

14. The manufacturing method according to claim 13 , wherein the manufacturing method further comprises forming a TFT for driving the luminous unit to emit light on the substrate before forming the pattern of the filter functional unit.

15. The manufacturing method according to claim 12 , wherein the isolation layer of a first microcavity structure, among the three microcavity structures, includes three Al material layers and two SiO x material layers, and the Al material layers and the SiO x material layers are alternately arranged; the isolation layer of a second microcavity structure, among the three microcavity structures, includes two Al material layers and one SiO x material layer, and the Al material layers and the SiO x material layer are alternately arranged; and the isolation layer of a third microcavity structure, among the three microcavity structures, includes one Al material layer.

16. The manufacturing method according to claim 15 , wherein forming the isolation layers with different thicknesses includes:
depositing a structure of the isolation layer corresponding to the first microcavity structure on an area corresponding to an entirety of the filter functional unit;
coating photoresist on the formed isolation layer, performing complete ashing on the photoresist corresponding to the third microcavity structure, and performing ashing on the photoresist corresponding to the second microcavity structure by one half in height;
etching the Al material layer of the isolation layer corresponding to the third microcavity structure, etching the SiO x material layer of the isolation layer corresponding to the third microcavity structure, and meanwhile, etching the photoresist corresponding to the second microcavity structure and etching the photoresist corresponding to the first microcavity structure by a portion in thickness;
etching the Al material layer of the isolation layer corresponding to the third microcavity structure, and meanwhile, etching the Al material layer of the isolation layer corresponding to the second microcavity structure;
etching the SiO x material layers of the isolation layers corresponding to the third microcavity structure and the second microcavity structure; and
stripping off the photoresist on the first microcavity structure.

17. The manufacturing method according to claim 15 , wherein forming the pattern of the filter functional unit further comprises:
depositing a planarization layer after forming the isolation layers.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Shen Wulin
• Li Yanzhao
• Cui Jian

Classifications

• H01L51/5265

  Electricity · mapped topic

• H01L27/322

  Electricity · mapped topic

• H01L51/5221

  Electricity · mapped topic

• H01L51/56

  Electricity · mapped topic

• H01L27/3258

  Electricity · mapped topic