Wafer laminate and making method

Patent metadata

Field	Value
Publication number	US-10074626-B2
Application number	US-201715596146-A
Country	US
Kind code	B2
Filing date	May 16, 2017
Priority date	Jun 6, 2016
Publication date	Sep 11, 2018
Grant date	Sep 11, 2018

Abstract

A wafer laminate has an adhesive layer ( 2 ) sandwiched between a support ( 1 ) and a wafer ( 3 ), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer ( 2 ) includes a light-shielding resin layer ( 2 a ), an epoxy-containing siloxane skeleton resin layer ( 2 b ), and a non-silicone thermoplastic resin layer ( 2 c ).

First claim

The invention claimed is:

1. A wafer laminate comprising a support, an adhesive layer formed on the support, and a wafer disposed on the adhesive layer, with a circuit-forming surface of the wafer facing the adhesive layer,
the adhesive layer including a resin layer (A) having light-shielding properties, a resin layer (B), and a resin layer (C) stacked on the support in an order, the resin layer (A) has a transmittance of up to 20% with respect to light of wavelength 500 nm,
the resin layer (B) being a cured product of a resin composition (B) comprising a resin containing a siloxane skeleton and an epoxy group, the cured product having a resin modulus of 10 to 1000 MPa at 25 deg. C., and the resin layer (C) comprising a non-silicone thermoplastic resin.

2. The wafer laminate of claim 1 wherein the non-silicone thermoplastic resin has a glass transition temperature of −80° C. to 120° C.

3. The wafer laminate of claim 1 wherein the resin layer (A) is a cured product of a resin composition (A) comprising a resin (A) comprising repeating units of the formula (1) and having a weight average molecular weight of 500 to 500,000,

wherein R 1 to R 3 are each independently hydrogen, hydroxyl, or a C 1 -C 20 monovalent organic group, at least one of R 1 to R 3 being hydroxyl, and R 4 is hydrogen or an optionally substituted C 1 -C 30 monovalent organic group.

4. The wafer laminate of claim 3 wherein the resin composition (A) further contains a crosslinker.

5. The wafer laminate of claim 3 wherein the resin composition (A) further contains an acid generator.

6. The wafer laminate of claim 3 wherein the resin composition (A) further contains an organic solvent.

7. The wafer laminate of claim 1 wherein the resin composition (B) is a composition comprising 100 parts by weight of an epoxy-modified silicone resin comprising repeating units of the formula (2) and optionally repeating units of the formula (3), having a weight average molecular weight of 3,000 to 500,000, and 0.1 to 50 parts by weight of at least one crosslinker selected from phenol compounds having on average at least two phenol groups per molecule and epoxy compounds having on average at least two epoxy groups per molecule,

wherein R 5 to R 8 are each independently a C 1 -C 8 monovalent hydrocarbon group, m is an integer of 1 to 100, A and B are numbers in the range: 0<A≤1, 0≤B≤1, and A+B=1, Y is a divalent organic group having the formula (4):

wherein Z is a single bond or a divalent organic group selected from the following:

R 9 and R 10 each are C 1 -C 4 alkyl or alkoxy, and h is 0, 1 or 2.

Assignees

• Shinetsu Chemical Co

Inventors

• Yasuda Hiroyuki
• Sugo Michihiro

Classifications

• H10P72/7448

  the bond interface between the auxiliary support and the wafer comprising two or more, e.g. multilayer adhesive or adhesive and release layer · CPC title

• H10P72/7422

  used to protect an active side of a device or wafer · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title