Coil component

Patent metadata

Field	Value
Publication number	US-10074473-B2
Application number	US-201615229329-A
Country	US
Kind code	B2
Filing date	Aug 5, 2016
Priority date	Dec 18, 2015
Publication date	Sep 11, 2018
Grant date	Sep 11, 2018

Abstract

A coil component includes a body in which a coil portion is embedded. The coil portion includes a support member; first insulators formed on first and second main surfaces of the support member, respectively, and having an opening having a planar coil shape; coils filling the openings; and second insulators covering the coils.

First claim

What is claimed is:

1. A coil component comprising:
a body in which a coil portion is embedded,
wherein the coil portion includes
a support member;
first insulators formed on first and second main surfaces of the support member, respectively, and having an opening having a planar coil shape;
coils filling the openings; and
second insulators covering the coils,
wherein the second insulators are in direct contact with the coil and outer side surfaces of the first insulators.

2. The coil component of claim 1 , wherein an aspect ratio of the coils is between 3:1 and 9:1.

3. The coil component of claim 1 , wherein the coils include
a seed portion formed on a surface of the support member; and
a plating portion formed on the seed portion to fill the opening.

4. The coil component of claim 1 , wherein the coils include
a seed portion formed on a surface of the support member and side surfaces of the first insulators; and
a plating portion formed on the seed portion to fill the opening.

5. The coil component of claim 1 , wherein an aspect ratio of the first insulators is between 5:1 and 25:1.

6. The coil component of claim 1 , wherein the first insulators are formed of a photosensitive material.

7. The coil component of claim 1 , wherein the first insulators include a photo acid generator (PAG) and one or more epoxy based resins.

8. The coil component of claim 1 , wherein the second insulators include one or more selected from the group consisting of an epoxy based resin, a polyimide based resin, and a liquid crystalline polymer (LCP) based resin.

9. The coil component of claim 1 , wherein thicknesses of the first insulators and thicknesses of the coils are the same as each other.

10. The coil component of claim 1 , wherein a thickness of the first insulators is greater than a thickness of the coils.

11. The coil component of claim 1 , wherein the coils formed on the first and second main surfaces of the support member, respectively, are electrically connected to each other by a via electrode penetrating through the support member.

12. The coil component of claim 1 , wherein the support member is a polypropylene glycol (PPG) substrate, a ferrite substrate, or a metal soft magnetic substrate.

13. The coil component of claim 1 , wherein the body includes a ferrite powder or metallic magnetic powder dispersed in an epoxy resin or a polyimide resin.

14. The coil component of claim 1 , wherein the second insulators are formed on the first and second main surfaces of the support member such that the support member is not enclosed within the second insulators.

15. The coil component of claim 1 , wherein the outer side surfaces of the first insulators are perpendicular to the first and second main surfaces of the support member.

Assignees

• Samsung Electro Mech

Inventors

• Kim Jae Hun
• Hwang Hwa Sung
• Lyu Young Ku
• Kim Boum Seock

Classifications

• H01F27/255

  made from particles (H01F27/26 takes precedence) · CPC title

• H01F41/041 Primary

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title

• H01F17/04

  with magnetic core · CPC title

• H01F41/122

  Insulating between turns or between winding layers · CPC title

• H01F41/0233

  Manufacturing of magnetic circuits made from sheets (magnetic cores made from sheets H01F27/245; soft magnetic alloys in the form of sheets H01F1/16) · CPC title