Conductive structure and preparation method therefor

Patent metadata

Field	Value
Publication number	US-10073572-B2
Application number	US-201515037583-A
Country	US
Kind code	B2
Filing date	May 7, 2015
Priority date	May 12, 2014
Publication date	Sep 11, 2018
Grant date	Sep 11, 2018

Abstract

The present application relates to a conductive structure body and a method for manufacturing the same. A conductive structure body according to an exemplary embodiment of the present application includes a transparent conductive layer, a metal layer which is provided on the transparent conductive layer and includes aluminum, and an aluminum oxynitride layer which is provided on the metal layer.

First claim

The invention claimed is:

1. A conductive structure body comprising:
a transparent conductive layer having a thickness of 15 nm or more and 20 nm or less;
a metal layer provided on the transparent conductive layer and including aluminum; and
an aluminum oxynitride layer provided on the metal layer, wherein at a high-temperature and humidity atmosphere of 85° C. and relative humidity of 85%, after 210 hours, a rate of increase in surface resistance of the conductive structure body is 1% or less.

2. The conductive structure body of claim 1 , wherein the aluminum oxynitride layer includes aluminum oxynitride represented by AlOxNy, x is more than 0 and 1.5 or less and y is 0.1 or more and 1 or less, x is a content ratio of oxygen atoms in aluminum oxynitride, and y is a content ratio of nitrogen atoms in aluminum oxynitride.

3. The conductive structure body of claim 1 , wherein the thickness of the aluminum oxynitride layer is 10 nm or more and 100 nm or less.

4. The conductive structure body of claim 1 , wherein the transparent conductive layer includes one or more kinds selected from a group consisting of indium oxide, zinc oxide, indium tin oxide, indium zinc oxide, and a transparent conductive polymer.

5. The conductive structure body of claim 1 , wherein the thickness of the metal layer is 0.01 μm or more and 30 μm or less.

6. The conductive structure body of claim 1 , wherein the aluminum oxynitride layer is provided on at least one surface of the conductive line.

7. The conductive structure body of claim 1 , wherein a line width of the metal pattern layer is 0.1 μm or more and 100 μm or less.

8. A conductive structure body comprising:
a transparent conductive layer;
a metal layer comprising aluminum provided on the transparent conductive layer, wherein the metal layer is a metal pattern layer including one or more conductive lines, wherein a line distance between adjacent conductive lines of the metal pattern layer is 0.1 μm or more and 100 μm or less; and
an aluminum oxynitride layer provided on the metal layer.

9. The conductive structure body of claim 1 , wherein surface resistance of the conductive structure body is 0.1 Ω/sq or more and 300 Ω/sq or less.

10. A method for manufacturing the conductive structure body of claim 1 , comprising:
preparing a transparent conductive layer;
forming a metal layer including aluminum on the transparent conductive layer; and
forming an aluminum oxynitride layer on the metal layer.

11. The method of claim 10 , further comprising:
individually or simultaneously patterning the metal layer and the aluminum oxynitride layer.

12. The method of claim 10 , wherein in the patterning, the metal layer and the aluminum oxynitride layer are integrally etched by using an etchant.

13. A display device including the conductive structure body of claim 1 .

14. The display device of claim 13 , wherein the conductive structure body is a wire portion of a bezel area.

Assignees

• Lg Chemical Ltd

Inventors

• Lim Jin Hyong
• Jang Song Ho
• Kim Ki-Hwan
• Kim Yong Chan
• Yoon Junghwan
• Park Chan Hyoung
• Lee Ilha

Classifications

• H05K2201/00

  Indexing scheme relating to printed circuits covered by H05K1/00 · CPC title

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

• H05K3/00

  Apparatus or processes for manufacturing printed circuits · CPC title

• B81B7/0006

  Interconnects · CPC title

• G06F3/0412

  Digitisers structurally integrated in a display · CPC title