Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, manufacturing method of electronic device, and electronic device
US-9213237-B2 · Dec 15, 2015 · US
US10073343B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10073343-B2 |
| Application number | US-201514950342-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 24, 2015 |
| Priority date | Nov 26, 2014 |
| Publication date | Sep 11, 2018 |
| Grant date | Sep 11, 2018 |
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A compound which is non-ionic compound, the compound has a group represented by formula (Ia): wherein R 2 represents a group having a C 3 to C 18 alicyclic hydrocarbon group where a methylene group may be replaced by an oxygen atom or a carbonyl group, Rf 1 and Rf 2 each independently represent a C 1 to C 4 perfluoroalkyl group, and * represents a binding site.
Opening claim text (preview).
What is claimed is: 1. A resin consisting of a structural unit derived from a compound represented by formula (I): wherein R 1 represents a hydrogen atom, a halogen atom or a C 1 to C 6 alkyl group that may have a halogen atom, R 2 represents a group having a C 3 to C 18 polycyclic alicyclic hydrocarbon group where a methylene group may be replaced by an oxygen atom or a carbonyl group, Rf 1 and Rf 2 each independently represent a C 1 to C 4 perfluoroalkyl group, A 1 represents **-A 2 -O—, **-A 2 -O—CO—, **-A 2 -CO—O-A 3 -CO—O—, **-A 2 -CO—O-A 3 -CO—O-A 4 -, **-A 2 -O—CO-A 3 -O—, **-A 2 -O—A 3 -CO—O—, **-A 2 -CO—or **-A 2 -O—CO-A 3 O—CO—, where ** represents a binding site to an oxygen atom, A 2 , A 3 and A 4 each independently represent a C 1 to C 6 alkanediyl group; or comprising the structural unit and a structural unit represented by formula (a5-1): wherein, R 51 represents a hydrogen atom or a methyl group, R 52 represents a C 3 to C 18 alicyclic hydrocarbon group where a hydrogen atom may be replaced by a C 1 to C 8 aliphatic hydrocarbon group or a hydroxy group, provided that the carbon atom directly bonded to L 51 has no aliphatic hydrocarbon group by which a hydrogen atom has been replaced, and L 51 represents a single bond or a C 1 to C 18 divalent saturated hydrocarbon group where a methylene group may be replaced by an oxygen atom or a carbonyl group. 2. The resin according to claim 1 , wherein R 2 is a group having an adamantyl group where a methylene group may be replaced by an oxygen atom or a carbonyl group. 3. The resin according to claim 1 , wherein R 2 is an adamantyl group. 4. The resin according to claim 1 , wherein A 1 is **-A 2 -O—CO—. 5. A resist composition comprising the resin according to claim 1 , a resin having an acid-labile group, and an acid generator. 6. The resist composition according to claim 5 , further comprising a salt which generates an acid weaker in acidity than an acid generated from the acid generator. 7. A method for producing a resist pattern comprising steps (1) to (5); (1) applying the resist composition according to claim 5 onto a substrate; (2) drying the applied composition to form a composition layer; (3) exposing the composition layer; (4) heating the exposed composition layer, and (5) developing the heated composition layer. 8. The resin according to claim 1 , consisting of the structural unit derived from the compound represented by formula (I). 9. The resin according to claim 1 , comprising the structural unit derived from the compound represented by formula (I) and the structural unit represented by formula (a5-1).
having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, [IMAGE cpc-sch-C07C-0958.gif] groups,[IMAGE cpc-sch-C07C-0959.gif] groups, or[IMAGE cpc-sch-C07C-0960.gif] in the acid moiety · CPC title
the macromolecular compound being present in a chemically amplified negative photoresist composition · CPC title
with perfluoro compounds, e.g. for dry lithography (G03F7/0048 takes precedence) · CPC title
of acids with a six-membered ring · CPC title
Treatment before imagewise removal, e.g. prebaking {(G03F7/265 takes precedence)} · CPC title
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