Indirect evaporator cooler heat exchanger manufacturing method

US10072901B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10072901-B2
Application numberUS-201314898287-A
CountryUS
Kind codeB2
Filing dateJun 28, 2013
Priority dateJun 28, 2013
Publication dateSep 11, 2018
Grant dateSep 11, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method for constructing a module of a modular cooling unit includes acquiring a plurality of tubes, each tube having a first end and a second end, and overmolding a first header onto the first ends of the plurality of tubes to form a watertight connection between the first header and the first ends of the plurality of tubes, the first header having a plurality of parallel first slots, each slot of the parallel first slots having an extended surface configured to receive and retain the first end of the tube.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for constructing a module of a modular cooling unit, the method comprising: acquiring a plurality of tubes, each tube having a first end and a second end, an interior surface, an exterior surface, and a support member operatively connected to the interior surface; and overmolding a first header onto at least a portion of the first ends of the plurality of tubes, the first header configured to have a plurality of parallel first slots, each slot of the parallel first slots configured to have an extended surface configured to receive and retain the first end of the tube, wherein overmolding allows the extended surfaces of the plurality of parallel first slots to form over the first ends of the plurality of tubes to create a watertight connection between the first header and the first ends of the plurality of tubes. 2. The method of claim 1 , further comprising overmolding a second header onto at least a portion of the second ends of the plurality of tubes, the second header configured to have a plurality of parallel second slots, each slot of the parallel second slots configured to have an extended surface configured to receive and retain the second end of the tube, wherein overmolding allows the extended surfaces of the plurality of parallel second slots to form over the second ends of the plurality of tubes to create a watertight connection between the second header and the second ends of the plurality of tubes. 3. The method of claim 1 , further comprising performing an air and leak test on the module. 4. The method of claim 1 , wherein the first header further includes a top groove, a bottom groove, a first side groove, and a second side groove, the method further comprising applying an adhesive in at least one of the top, bottom, first side, and second side grooves. 5. The method of claim 4 , further comprising: acquiring at least one spline; and positioning a spline into at least one of the top, bottom, first side, and second side grooves containing the applied adhesive, wherein the at least one spline is dimensioned to be received and retained by and extend across at least a portion of the top, bottom, first side, and second side grooves. 6. The method of claim 5 , further comprising assembling one or more modules into a modular cooling unit. 7. The method of claim 6 , wherein assembling one or more modules comprises arranging at least two modules to be adjacent one another in a horizontal configuration, the at least two modules being arranged such that a spline is positioned in the first side and the second side grooves between the at least two modules and a spline is positioned in the top grooves of the at least two horizontally adjacent modules. 8. The method of claim 7 , further comprising positioning a spline in the bottom grooves of the at least two horizontally adjacent modules. 9. The method of claim 6 , wherein assembling one or more modules comprises arranging at least two modules to be adjacent one another in a vertical configuration, the at least two modules being arranged such that a spline is positioned in the top and bottom grooves between the at least two vertically adjacent modules. 10. The method of claim 6 , wherein assembling one or more modules comprises: acquiring at least one gasket; and positioning a gasket onto at least one of a top and a bottom of the one or more modules such that the gasket extends horizontally across at least a portion of the top and the bottom of the one or more modules. 11. The method of claim 6 , wherein assembling one or more modules comprises applying adhesive onto at least one of a top, a bottom, a first side, and a second side of the one or more modules. 12. A module of a modular cooling unit, the module comprising: a plurality of tubes, each tube having a first end and a second end, and an interior surface and an exterior surface; a support member operatively connected to the interior surface of each of the plurality of tubes; and a first header positioned at the first ends of the plurality of tubes to form a watertight connection between the first header and the first ends of the plurality of tubes, the first header having a top groove, a bottom groove, a first side groove, and a second side groove, and a plurality of parallel first slots, wherein each slot of the parallel first slots has an extended surface configured to receive and retain the first end of the tube. 13. The module of claim 12 , further comprising a second header positioned at the second ends of the plurality of tubes to form a watertight connection between the second header and the second ends of the plurality of tubes, the second header having a top groove, a bottom groove, a first side, and a second side groove, and a plurality of parallel second slots, wherein each of the parallel second slots has an extended surface configured to receive and retain the second end of the tube. 14. The module of claim 12 , further comprising at least one spline, wherein the at least one spline is dimensioned to be received and retained by and extend across at least a portion of the top, bottom, first side, and second side grooves. 15. The module of claim 14 , further comprising at least two modules configured to be adjacent in a horizontal configuration, the at least two modules configured such that a spline is positioned in the first side and the second side grooves between the at least two horizontally adjacent modules and a spline is positioned in the top grooves of the at least two horizontally adjacent modules. 16. The module of claim 15 , further comprising a spline positioned in the bottom grooves of the at least two horizontally adjacent modules. 17. The module of claim 15 , wherein at least one module has a different number of plurality of hollow tubes than another module, such that one or more horizontally arranged modules have a staggered configuration. 18. The modular cooling unit of claim 14 , further comprising at least two modules configured to be adjacent in a vertical configuration, the at least two modules configured such that a spline is positioned in the top and bottom grooves between the at least two vertically adjacent modules. 19. The module of claim 18 , wherein at least one module has a different number of plurality of hollow tubes than another module, such that one or more vertically arranged modules have a staggered configuration. 20. A method of retrofitting a cooling unit, comprising: replacing at least one component of the cooling unit with one or more modules, wherein the module includes a plurality of tubes, each tube having a first end and a second end, and an interior surface and an exterior surface; a support member operatively connected to the interior surface of each of the plurality of tubes; and a first header positioned at the first ends of the plurality of tubes to form a watertight connection between the first header and the first ends of the plurality of tubes, the first header having a top groove, a bottom groove, a first side groove, and a second side groove, and a plurality of parallel first slots, wherein each slot of the parallel first slots has an extended surface configured to receive and retain the first end of the tube.

Assignees

Inventors

Classifications

  • within server blades for removing heat from heat source · CPC title

  • for cooling heat generating elements, e.g. for cooling electronic components or electric devices · CPC title

  • the heat-exchange apparatus employing tubular conduits · CPC title

  • with multiple rows of conduits or with multi-channel conduits (F28D1/05391 takes precedence) · CPC title

  • by permanent joints, e.g. by rolling (metal-working procedures in general B21, B32; particularly B21D39/06, B23K) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10072901B2 cover?
A method for constructing a module of a modular cooling unit includes acquiring a plurality of tubes, each tube having a first end and a second end, and overmolding a first header onto the first ends of the plurality of tubes to form a watertight connection between the first header and the first ends of the plurality of tubes, the first header having a plurality of parallel first slots, each sl…
Who is the assignee on this patent?
Schneider Electric It Corp
What technology area does this patent fall under?
Primary CPC classification B21D53/08. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 11 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).