Light apparatus with control board thermally insulated from light source

Patent metadata

Field	Value
Publication number	US-10072833-B2
Application number	US-201314911765-A
Country	US
Kind code	B2
Filing date	Aug 13, 2013
Priority date	Aug 13, 2013
Publication date	Sep 11, 2018
Grant date	Sep 11, 2018

Abstract

A light apparatus includes a first carrier with an optoelectronic component for generating electromagnetic radiation, a second carrier with at least one electronic component for controlling the optoelectronic component, and a thermally insulating layer arranged between, and attached to, the first and second carriers.

First claim

The invention claimed is:

1. A light apparatus comprising:
a first carrier having a shape of a circular ring plate with a central opening;
a second carrier;
an optoelectronic component for generating electromagnetic radiation, the optoelectronic component attached to the second carrier;
at least one electronic component for controlling the optoelectronic component, the at least one electronic component attached to the first carrier;
a thermally insulating layer arranged between the first and second carriers, wherein the first and second carriers are attached to the insulating layer, wherein the insulating layer has a circular shape, wherein the insulating layer comprises several pieces or one ring shape, wherein the insulating layer is arranged around a central area, wherein the optoelectronic component is arranged in the central area, and wherein the insulating layer surrounds the optoelectronic component; and
a casing comprising a circular disc with a central light-emitting opening, wherein the circular disc is defined by two circular side walls, wherein the first carrier is arranged within the casing between the two side walls, wherein the casing comprises an inner rim at the second side wall, and wherein the inner rim bears on the insulating layer.

2. The apparatus of claim 1 , wherein the casing is arranged on the first carrier and covers the first carrier, and wherein the casing is attached to the insulating layer.

3. The apparatus of claim 1 , wherein the insulating layer has a thermal conductivity that is lower than 0.1 W/mK.

4. The apparatus of claim 1 , further comprising a heat sink that is in contact with the second carrier.

5. The apparatus of claim 1 , further comprising a glue layer arranged between the first carrier and the insulating layer.

6. The apparatus of claim 1 , wherein the insulating layer has a thickness smaller than 0.5 mm.

7. The apparatus of claim 1 , wherein the second carrier comprises a first electric contact and a second electric contact configured to electrically connect the optoelectronic component of the second carrier with the electronic component of the first carrier, and wherein the insulating layer comprises recesses for providing free areas for the first and second contacts.

8. The apparatus of claim 1 , wherein the second carrier has a rectangular shape with a central light-emitting area, wherein the optoelectronic component is arranged in the light-emitting area, and wherein the light-emitting area is surrounded by a rim.

9. The apparatus of claim 1 , further comprising a glue layer arranged between the second carrier and the insulating layer.

10. A light apparatus comprising:
a first carrier having a shape of a circular ring plate with a central opening;
a second carrier;
an optoelectronic component for generating electromagnetic radiation, the optoelectronic component attached to the second carrier;
at least one electronic component for controlling the optoelectronic component, the at least one electronic component attached to the first carrier;
a thermally insulating layer arranged between the first and second carriers, wherein the first and second carriers are attached to the insulating layer, wherein the insulating layer has a circular shape, wherein the insulating layer comprises several pieces or one ring shape, wherein the insulating layer is arranged around a central area, wherein the optoelectronic component is arranged in the central area, and wherein the insulating layer surrounds the optoelectronic component; and
a casing comprising a circular disc with a central light-emitting opening, wherein the circular disc is defined by two circular side walls, wherein the first carrier is arranged within the casing between the two side walls, wherein the casing comprises an inner rim at the second side wall, and wherein the inner rim of the casing bears directly on an upper face of the second carrier.

11. The apparatus of claim 10 , wherein the casing is arranged on the first carrier and covers the first carrier, and wherein the casing is attached to the insulating layer.

12. The apparatus of claim 10 , wherein the insulating layer has a thermal conductivity that is lower than 0.1 W/mK.

13. The apparatus of claim 10 , further comprising a heat sink that is in contact with the second carrier.

14. The apparatus of claim 10 , further comprising a glue layer arranged between the first carrier and the insulating layer.

15. The apparatus of claim 10 , wherein the insulating layer has a thickness smaller than 0.5 mm.

16. The apparatus of claim 10 , wherein the second carrier comprises a first electric contact and a second electric contact configured to electrically connect the optoelectronic component of the second carrier with the electronic component of the first carrier, and wherein the insulating layer comprises recesses for providing free areas for the first and second contacts.

17. The apparatus of claim 10 , wherein the second carrier has a rectangular shape with a central light-emitting area, wherein the optoelectronic component is arranged in the light-emitting area, and wherein the light-emitting area is surrounded by a rim.

18. The apparatus of claim 10 , wherein the insulating layer surrounds the inner rim and bears on an upper side at an outer rim area of the second carrier.

19. The apparatus of claim 10 , further comprising a glue layer arranged between the second carrier and the insulating layer.

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Ng Kok Eng
• Lim Choo Kean
• Ong Eu Liong
• Yap Boon Liang

Classifications

• F21V17/101 Primary

  permanently, e.g. welding, gluing or riveting · CPC title

• F21V29/15 Primary

  Thermal insulation · CPC title

• F21V29/70

  characterised by passive heat-dissipating elements, e.g. heat-sinks · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title