Hybrid component and method for producing a hybrid component

US10072690B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10072690-B2
Application numberUS-201214342773-A
CountryUS
Kind codeB2
Filing dateJun 14, 2012
Priority dateSep 5, 2011
Publication dateSep 11, 2018
Grant dateSep 11, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A hybrid component is formed by a profiled component of a first material, which is materially bonded in certain sections to a component made of a second material, and is connected by a form-fit and/or force-fit connection outside the sections with a material bond. This creates sections that relieve the strains resulting from differing thermal expansion.

First claim

Opening claim text (preview).

The invention claimed is: 1. A hybrid component for a structural element of vehicle seats, comprising: a profiled component made of a first material; and a component made of a second material, wherein the first material and the second material are different, wherein the profiled component is partially connected by a material connection to the component and is connected by a form-fitting connection and/or frictional connection outside the portions with the material connection, wherein the profiled component, which has a U-shaped cross section and a substantially planar flange region on both sides, is placed with its flange regions on a planar portion of the component, such that an internal space is formed between the profiled component and the component, wherein between the component and the flange regions an adhesive material is partially arranged as the material connection, wherein riveted connections are formed as the form-fitting connection and/or frictional connection outside the portions provided with the adhesive material in the flange regions, wherein, outside of the portions with the material connection and outside of the portions with the riveted connections, openings are formed on the profiled component and/or the component to allow for thermal compensation and/or to reduce the weight of the hybrid component, wherein riveted connections do not extend through the openings; and wherein the openings are elongated holes, wherein the portions of the flange regions provided with adhesive material are interrupted by regions in which the elongated holes are arranged, wherein the elongated holes are formed in the component and/or in the flange region of the profiled component, and wherein the elongated holes are aligned in their longitudinal extent according to the longitudinal extent of the flange region, such that the openings, the adhesive material, and the riveted connections are arranged alternately at the flange regions along the longitudinal extent of the hybrid component. 2. The hybrid component as claimed in claim 1 , wherein the openings are formed on the component. 3. The hybrid component as claimed in claim 1 , wherein the openings are through-holes.

Assignees

Inventors

Classifications

  • including mechanical interlock · CPC title

  • Connections by glue bonding (in general F16B11/00; processes C09J5/00) · CPC title

  • preformed metal and synthetic material elements being joined together, e.g. by adhesives · CPC title

  • Assembling or joining · CPC title

  • Joining means · CPC title

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Frequently asked questions

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What does patent US10072690B2 cover?
A hybrid component is formed by a profiled component of a first material, which is materially bonded in certain sections to a component made of a second material, and is connected by a form-fit and/or force-fit connection outside the sections with a material bond. This creates sections that relieve the strains resulting from differing thermal expansion.
Who is the assignee on this patent?
Fleischheuer Simon, Ndagijimana Robin, Mund Harald, and 3 more
What technology area does this patent fall under?
Primary CPC classification F16B11/006. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Sep 11 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).