Silver-plated product

US10072348B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10072348-B2
Application numberUS-201414777706-A
CountryUS
Kind codeB2
Filing dateFeb 18, 2014
Priority dateMar 18, 2013
Publication dateSep 11, 2018
Grant dateSep 11, 2018

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

There is provided a silver-plated product wherein a surface layer of silver is formed on the surface of an underlying layer of nickel formed on a base material, the silver-plated product having a good bendability. In a silver-plated product which comprises a base material of copper or a copper alloy, an underlying layer of nickel formed on the base material, and a surface layer of silver formed on the surface of the underlying layer, the surface layer having a thickness of 10 μm or less, the thickness of the underlying layer is 2 μm or less, preferably 1.5 μm or less, and the area fraction in {200} orientation of the surface layer is 15% or more, preferably 25% or more.

First claim

Opening claim text (preview).

The invention claimed is: 1. A silver-plated product comprising: a base material of copper or a copper alloy; an underlying layer of nickel which is formed on the base material; and a surface layer of silver which is formed on a surface of the underlying layer, wherein the underlying layer has a thickness of 2 μm or less, and an area fraction in {200} orientation of the surface layer is 41.2% or more. 2. A silver-plated product as set forth in claim 1 , wherein said surface layer has a thickness of 10 μm or less. 3. A contact or terminal part which is made of a silver-plated product as set forth in claim 1 or 2 .

Assignees

Inventors

Classifications

  • C25D5/14Primary

    two or more layers being of nickel or chromium, e.g. duplex or triplex layers · CPC title

  • of nickel or cobalt · CPC title

  • Pretreatment of metallic surfaces to be electroplated · CPC title

  • C25D7/00Primary

    Electroplating characterised by the article coated · CPC title

  • of silver · CPC title

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Frequently asked questions

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What does patent US10072348B2 cover?
There is provided a silver-plated product wherein a surface layer of silver is formed on the surface of an underlying layer of nickel formed on a base material, the silver-plated product having a good bendability. In a silver-plated product which comprises a base material of copper or a copper alloy, an underlying layer of nickel formed on the base material, and a surface layer of silver formed…
Who is the assignee on this patent?
Dowa Metaltech Co Ltd
What technology area does this patent fall under?
Primary CPC classification C25D5/14. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 11 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).