Stretchable polymer thick film compositions for thermoplastic substrates and wearables electronics

US10072177B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10072177-B2
Application numberUS-201514929498-A
CountryUS
Kind codeB2
Filing dateNov 2, 2015
Priority dateNov 6, 2014
Publication dateSep 11, 2018
Grant dateSep 11, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

This invention is directed to stretchable polymer thick film compositions useful for wearable garments. More specifically, the polymer thick film may be used in applications where significant stretching is required, particularly on substrates that can be highly elongated. A particular type of substrate is a thermoplastic polyurethane substrate.

First claim

Opening claim text (preview).

What is claimed is: 1. A polymer thick film encapsulant paste composition comprising: (a) fumed silica; and (b) an organic medium comprising 5-50 wt % thermoplastic polyurethane resin dissolved in an organic solvent, said thermoplastic polyurethane resin having a per cent elongation of at least 200% and a tensile stress necessary to achieve 100% elongation of less than 1000 psi, wherein the weight percent is based on the total weight of said organic medium. 2. The polymer thick film encapsulant paste composition of claim 1 , said polymer thick film encapsulant paste composition comprising 0.1 to 3 wt % fumed silica and 97 to 99.9 wt % organic medium, wherein the wt % are based on the total weight of said composition and wherein said thermoplastic polyurethane resin is selected from the group consisting of a polyester-based polymer, a urethane homopolymer and a predominantly linear hydroxyl polyurethane.

Assignees

Inventors

Classifications

  • Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer · CPC title

  • for polymer thick films, i.e. having a permanent organic polymeric binder · CPC title

  • Use of materials for the {conductive, e.g. } metallic pattern · CPC title

  • containing N · CPC title

  • containing O · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10072177B2 cover?
This invention is directed to stretchable polymer thick film compositions useful for wearable garments. More specifically, the polymer thick film may be used in applications where significant stretching is required, particularly on substrates that can be highly elongated. A particular type of substrate is a thermoplastic polyurethane substrate.
Who is the assignee on this patent?
Du Pont
What technology area does this patent fall under?
Primary CPC classification H01B1/22. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 11 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).