Metallic copper dispersion, process for producing the metallic copper dispersion, electrode, wiring pattern, and coating film formed using the metallic copper dispersion, decorative article and antimicrobial article with the coating film formed thereon, and processes for producing the decorative article and the antimicrobial article

Patent metadata

Field	Value
Publication number	US-10071419-B2
Application number	US-200913060898-A
Country	US
Kind code	B2
Filing date	Aug 28, 2009
Priority date	Aug 29, 2008
Publication date	Sep 11, 2018
Grant date	Sep 11, 2018

Abstract

A dispersion comprising at least metallic copper particles with gelatin provided on the surface thereof, a polymeric dispersant, and an organic solvent. The dispersion is produced by reducing copper oxide in an aqueous solvent in the presence of gelatin having an amine number and an acid number wherein the difference (amine number−acid number) is 0 or less, then subjecting the reaction solution to solid-liquid separation, and then mixing the resultant metallic copper particles with gelatin provided on the surface thereof and a polymeric dispersant having an amine number and an acid number wherein the difference (amine number−acid number) is 0 to 50, into an organic solvent. The dispersion maintains dispersion stability of the metallic copper particles for a long time, is suitable for inkjet printing and spray coating and can be used to make microelectrodes and circuit wiring patterns.

First claim

The invention claimed is:

1. A process for producing a metallic copper-containing film having a volume resistivity value of 0.5×10 −5 Ω·cm to 9.6×10 −5 Ω·cm, comprising a step (a) and a step (b):
step (a) of applying a metallic copper dispersion comprising at least metallic copper particles having a gelatin on a surface thereof, a polymer dispersing agent, and an organic solvent, onto a surface of a base material, and drying the metallic copper dispersion by heating at a temperature not more than 150° C. to remove the organic solvent and form the metallic copper-containing film adhered to the base material, wherein
the base material comprises an organic material,
a difference between an amine value and an acid value (amine value−acid value) of the gelatin is not more than 0, and
a difference between an amine value and an acid value (amine value−acid value) of the polymer dispersing agent is 0 to 50; and

step (b) comprising
a step (b1) of heating the metallic copper-containing film produced in step (a) at 100 to 300° C. for 10 minutes to 48 hours under a gaseous oxygen-containing atmosphere having oxygen concentration of 10 to 10000 ppm to decompose or vaporize the gelatin and polymer dispersing agent and remove the gelatin and polymer dispersing agent from the metallic copper-containing film, and
a step (b2) of heating a metallic copper-containing film produced in step (b1) under a reducing gas atmosphere at the heating temperature of 100 to 300° C. to reduce any copper oxide formed in the step (b1) to copper and produce the metallic copper-containing film having a volume resistivity value of 0.5×10 −5 Ω·cm to 9.6×10 −5 Ω·cm.

2. The process for producing a metallic copper-containing film according to claim 1 , wherein the organic solvent is at least one selected from the group consisting of hydrocarbons, alcohols, ketones, esters, ethers, glycols, glycol esters, and glycol esters.

3. The process for producing a metallic copper-containing film according to claim 1 , wherein a blending amount of the polymer dispersing agent is 0.1 to 20 parts by weight based on 100 parts by weight of the metallic copper particles.

4. The process for producing a metallic copper-containing film according to claim 1 , wherein a viscosity of the metallic copper dispersion is not more than 100 mPa·s.

5. The process for producing a metallic copper-containing film according to claim 1 , wherein a median size of the metallic copper particles is 1 to 200 nm.

6. The process for producing a metallic copper-containing film according to claim 1 , wherein a concentration of the metallic copper particles in the metallic copper dispersion is not less than 15% by weight, a median size of the metallic copper particles is 1 to 200 nm, and a viscosity of the metallic copper dispersion is not more than 100 mPa·s.

7. The process for producing a metallic copper-containing film according to claim 1 , wherein
a difference between an amine value and an acid value (amine value−acid value) of the gelatin is −50 to 0, and the gelatin is an alkali-treated gelatin, and
a difference between an amine value and an acid value (amine value−acid value) of the polymer dispersing agent is 0 to 50, and a base site and an acid site of the polymer dispersing agent is electrostatically bonded to an acid site and a base site of the gelatin on the surface of the metallic copper particles.

8. The process for producing a metallic copper-containing film according to claim 7 , wherein
the metallic copper particles have a median size of 1 to 200 nm;
the organic solvent is selected from the group consisting of hydrocarbons, alcohols, ketones, esters, ethers, glycols, glycol ethers, and glycol esters; and
the polymer dispersing agent is present in a ratio of 0.1 to 20 parts by weight based on 100 parts by weight of the metallic copper particles.

9. The process for producing a metallic copper-containing film according to claim 1 , wherein the organic material is at least one selected from the group consisting of polyimides, polyethylene terephthalate (PET), and polyethylene naphthalate (PEN).

10. The process for producing a metallic copper-containing film according to claim 1 , wherein the base material in Step (a) has a foundation layer thereon and the Step (a) comprises adhering the metallic copper-containing film to the foundation layer so that the metallic copper-containing film is adhered to the base material by the foundation layer.

11. The process for producing a metallic copper-containing film according to claim 1 , further comprising using inkjet printing to apply the metallic copper dispersion to the base material.

12. The process for producing a metallic copper-containing film according to claim 1 , further comprising heating the metallic copper dispersion at a temperature not more than 120° C. to form the metallic copper-containing film in step (a), heating the metallic copper-containing film produced in step (a) at 100 to 200° C. in step (b1), and heating the metallic copper-containing film produced in step (b1) at 100 to 200° C. in step (b2).

13. A process for producing a metallic copper-containing film having a volume resistivity value of 0.5×10 −5 Ω·cm to 9.6×10 −5 Ω·cm, comprising a step (a) and a step (b):
step (a) of applying a metallic copper dispersion comprising at least metallic copper particles having a gelatin on a surface thereof, a polymer dispersing agent, and an organic solvent, onto a surface of a base material, and drying the metallic copper dispersion by heating at a temperature not more than 150° C. to form the metallic copper-containing film adhered on the base material, wherein
the base material comprises an organic material,
a difference between an amine value and an acid value (amine value −acid value) of the gelatin is substantially −6, and
a difference between an amine value and an acid value (amine value −acid value) of the polymer dispersing agent is 3 to 20; and

step (b) comprising:
a step (b1) of heating the metallic copper-containing film produced in step (a) at 100 to 300° C. for 10 minutes to 48 hours under a gaseous oxygen-containing atmosphere having oxygen concentration of 10 to 1000 ppm to decompose or vaporize the gelatin and the polymer dispersing agent and remove the gelatin and the polymer dispersing agent from the metallic copper-containing film, and
a step (b2) of heating a metallic copper-containing film produced in step (b1) under a reducing gas atmosphere at the heating temperature of 100 to 300° C. to reduce any copper oxide formed in the step (b1) to copper and produce the metallic copper-containing film having a volume resistivity value of 0.5×10 −5 Ω·cm to 9.6×10 −5 Ω·cm.

14. The process for producing a metallic copper-containing film according to claim 13 , wherein the organic material is at least one selected from the group consisting of polyimides, polyethylene terephthalate (PET), and polyethylene naphthalate (PEN).

15. The process for producing a metallic copper-containing film according to claim 13 , wherein the base material in Step (a) has a foundation layer thereon and the Step (a) comprises adhering the metallic copper-containing film to the foundation layer so that the metallic copper-containing film is adhered to the base material by the foundation layer.

16. The process for producing a metallic copper-containing film according to claim 13 , further comprising using inkjet printing to apply the metallic copper dispersion to the base material.

17. The process for producing a metallic copper-containing film according to claim 13 , further comprising he

Assignees

• Tomonari Masanori
• Ida Kiyonobu
• Ishihara Sangyo Kaisha

Inventors

• Tomonari Masanori
• Ida Kiyonobu

Classifications

• B22F1/102

  Metallic powder coated with organic material · CPC title

• B22F1/0545

  Dispersions or suspensions of nanosized particles · CPC title

• B22F1/18

  Non-metallic particles coated with metal · CPC title

• C08K9/08

  Ingredients agglomerated by treatment with a binding agent · CPC title

• B22F1/0062

  Operations & Transport · mapped topic