Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier

Patent metadata

Field	Value
Publication number	US-10070520-B2
Application number	US-201514998263-A
Country	US
Kind code	B2
Filing date	Dec 26, 2015
Priority date	Dec 26, 2015
Publication date	Sep 4, 2018
Grant date	Sep 4, 2018

Abstract

In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a magnetic particle embedded flexible substrate, a printed flexible substrate for a magnetic tray, or an electro-magnetic carrier for magnetized or ferromagnetic flexible substrates. For instance, in accordance with one embodiment, there are means disclosed for fabricating a flexible substrate having one or more electrical interconnects to couple with leads of an electrical device; integrating magnetic particles or ferromagnetic particles into the flexible substrate; supporting the flexible substrate with a carrier plate during one or more manufacturing processes for the flexible substrate, in which the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the magnetic particles or ferromagnetic particles integrated with the flexible substrate and a complementary magnetic attraction of the carrier plate; and removing the flexible substrate from the carrier plate subsequent to completion of the one or more manufacturing processes for the flexible substrate. Other related embodiments are disclosed.

First claim

What is claimed is:

1. A method comprising:
fabricating a flexible substrate having one or more electrical interconnects to couple with leads of an electrical device;
integrating particles with the flexible substrate, wherein the particles comprise a non-magnetic ferrous material;
supporting the flexible substrate with a carrier plate during one or more manufacturing processes for the flexible substrate, wherein the carrier plate is a magnetic carrier plate, and wherein the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the particles integrated with the flexible substrate and a complementary magnetic attraction of the carrier plate; and
removing the flexible substrate from the carrier plate subsequent to completion of the one or more manufacturing processes for the flexible substrate.

2. The method of claim 1 , wherein supporting the flexible substrate with the carrier plate during the one or more manufacturing processes for the flexible substrate comprises:
supporting the flexible substrate with the carrier plate during one or more of assembly processing operations, semi-conductor manufacturing processes, substrate manufacturing processes, or flexible substrate thermal curing processes, flexible substrate build-up and lamination processes, flexible substrate soldering processes, and flexible substrate functional testing processes.

3. The method of claim 1 , wherein the flexible substrate for the electrical device lacks sufficient rigidity and biaxial strength to hold its shape within a horizontal plane when unsupported by the carrier plate.

4. The method of claim 1 , wherein the flexible substrate for the electrical device is sufficiently thin that it does not maintain its shape within a horizontal plane when removed from the carrier plate.

5. The method of claim 1 , wherein particles with the flexible substrate comprises one of:
integrating adhesives between laminates of the fabricated flexible substrate;
integrating laminates into the fabricated flexible substrate;
integrating sheets into the fabricated flexible substrate;
integrating filler particles into the fabricated flexible substrate;
integrating tape into the fabricated flexible substrate;
integrating ceramics into the fabricated flexible substrate;
or
integrating tabs, strips, or buttons into the fabricated flexible substrate.

6. The method of claim 1 , wherein integrating particles with the flexible substrate comprises one of:
printing ink onto the flexible substrate, the ink comprising the particles;
painting the flexible substrate with paint, the paint comprising the particles;
coating the flexible substrate with a laminate, the laminate comprising the particles;
coating the flexible substrate with a adhesive, the adhesive comprising the particles;
coating the flexible substrate with a tape, the tape comprising the particles;
coating the flexible substrate with a polymer, the polymer comprising the particles;
coating the flexible substrate with a elastomer, the elastomer comprising the particles;
coating the flexible substrate with a plastic, the plastic comprising the particles;
coating the flexible substrate in a solder resist layer, the solder resist layer comprising the particles;
coating the flexible substrate in a solder mask, the solder mask comprising the particles;
coating the flexible substrate in a solder stop mask, the solder stop mask comprising the particles; or
coating the flexible substrate in a lacquer, the lacquer comprising the particles.

7. The method of claim 1 , further comprising:
electrically coupling the leads of the electrical device with the one or more electrical interconnects fabricated into the flexible substrate while the flexible substrate remains held flat against the carrier plate by the magnetic attraction between the carrier plate and the flexible substrate.

8. The method of claim 7 :
wherein the flexible substrate for the electrical device comprises a compliant and stretchable dielectric material substrate having a plurality of stretchable electrical interconnects integrated therein as the one or more electrical interconnects;
wherein the stretchable electrical interconnects electrically couple the electrical device with one or more electrical components via the one or more stretchable electrical interconnects; and
wherein the stretchable electrical interconnects provide an electrical and communications interface between the electrical device and the one or more electrical components through the dielectric material.

9. The method of claim 1 , wherein supporting the flexible substrate with the carrier plate during the one or more manufacturing processes for the flexible substrate comprises:
attaching the electrical device to the flexible substrate, wherein the electrical device comprises an integrated circuit, a processor, a die, or a central processor unit (CPU);
attaching one or more electrical components to the flexible substrate, wherein the one or more electrical components comprise any one of:
a battery, a sensor, a transceiver, a memory, and a system on a chip (SOC); and
electrically interfacing the electrical device attached to the flexible substrate with the one or more electrical components attached to the flexible substrate while the flexible substrate remains held flat against the carrier plate by the attractive magnetic force.

10. The method of claim 1 , wherein the flexible substrate and electrical device comprises a module package comprising at least a microelectronic die embedded in a processor and a memory and one or more communication circuits.

11. The method of claim 1 :
wherein the flexible substrate comprises an uncured elastomer comprising an elastomer mix and ferrous particles which respond to stimuli of a magnetic field;
wherein the method further comprises:
curing the elastomer mix and ferrous particles forming the flexible substrate; and electrically coupling the leads of the electrical device with the one or more electrical interconnects fabricated into the flexible substrate subsequent to curing the elastomer mix and ferrous particles, wherein the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the ferrous particles cured into the flexible substrate and the complementary magnetic attraction of the carrier plate.

12. The method of claim 1 :
wherein the flexible substrate comprises a compliant and stretchable substrate for the electrical device and one or more electrically connected electrical components, sensors, or functional modules;
wherein the stretchable substrate comprises at least one of a stretchable polydimethylsiloxane (PDMS) substrate, a stretchable Polyisoprene substrate, a stretchable polybutadiene substrate, a stretchable polyisobutylene substrate, a stretchable polyurethanes substrate, a stretchable thermoplasticpolyurethanes substrate, a stretchable butyl rubber substrate, a stretchable nitrile rubber substrate, or a stretchable woven fabric substrate.

13. The method of claim 1 , wherein the flexible substrate comprises one of:
a flex circuit;
a flexible plastic substrate;
a stretchable electronic substrate;
a stretchable dielectric material;
a compliant, bendable, or flexible dielectric substrate;
a polyimide substrate;
a PolyEther Ether Ketone (PEEK) substrate;
a PolyDiMethylSiloxane(PDMS) substrate;
a Flexible Printed Circuit (FPC) substrate;
a photolithographic exposed substrate;
a flexible foil circuit and substrate;
a Flexible Flat Cable (FFC) substrate;
a copper strip laminated between two layers of Polyethylene terephthalate (PETE

Assignees

• Intel Corp

Inventors

• Tomita Yoshihiro
• Heppner Joshua D
• Liff Shawna M
• Malatkar Pramod

Classifications

• H05K2201/0129

  Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer · CPC title

• A41D1/002

  adapted to accommodate electronic equipment (patients' garments for medical monitoring A41D13/1281; luminous ornaments A41D27/085) · CPC title

• H05K2201/08

  Magnetic details · CPC title

• H05K3/32

  electrically connecting electric components or wires to printed circuits · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title