Receptacle connector having insert molded lead-frame wafers each with upper contacts transversely offset from lower contacts

Patent metadata

Field	Value
Publication number	US-10069262-B2
Application number	US-201715588717-A
Country	US
Kind code	B2
Filing date	May 8, 2017
Priority date	May 7, 2016
Publication date	Sep 4, 2018
Grant date	Sep 4, 2018

Abstract

A receptacle connector for two types of plug includes an insulative housing defining a front mating port and a rear connecting port along the front-to-back direction, the front mating port defining a plurality of upper passageways and a plurality of lower passageways with a receiving slot therebetween in the vertical direction, the upper passageways being respectively offset from the corresponding lower passageways in a transverse direction. An IMLA (Insert Molded Lead-Frame Assembly) assembled within a space of the rear connecting port and including a plurality of wafers stacked with one another along the transverse direction, each of said wafers including an insulator equipped with a front upper contact disposed in the corresponding upper passageway, a rear upper contact located behind the corresponding upper passageway, a front lower contact disposed in the corresponding lower passageway, and a rear lower contact located behind the corresponding lower passageway.

First claim

What is claimed is:

1. A receptacle connector for two different type plugs comprising:
an insulative housing defining a front mating port and a rear connecting port along the front-to-back direction, the front mating port defining a plurality of upper passageways and a plurality of lower passageways with a receiving slot therebetween in the vertical direction perpendicular to said front-to-back direction, the upper passageways being respectively offset from the corresponding lower passageways in a transverse direction perpendicular to both said front-to-back direction and said vertical direction;
an IMLA (Insert Molded Lead-Frame Assembly) assembled within a space of the rear connecting port and including a plurality of wafers stacked with one another along the transverse direction, each of said wafers including an insulator equipped with a front upper contact disposed in the corresponding upper passageway, a rear upper contact located behind the corresponding upper passageway, a front lower contact disposed in the corresponding lower passageway, and a rear lower contact located behind the corresponding lower passageway; wherein
on one hand, the front upper contacts and the front lower contacts are mated with one of the two type plugs when said one of the two different type plugs is inserted into the receiving slot; on the other hand, all the front upper contacts, the front lower contacts, the rear upper contacts and the rear lower contacts are mated with the other of said two different type plugs when said other of said two different type plugs is received within the receiving slot.

2. The receptacle connector as claimed in claim 1 , wherein each of the insulators comprises an engagement rib with an embossment in one side, and a engagement groove with a recession in an opposite side, the engagement rib and the embossment of one insulator mated with the engagement groove and the recession of adjacent insulator.

3. The receptacle connector as claimed in claim 2 , wherein the insulative housing comprises a pair of side walls, at least one of the side walls defining an engagement groove with a recession in an inner side, and the corresponding one of the outermost insulator of the IMLA comprises an engagement rib with an embossment mated with the engagement groove and the recession.

4. The receptacle connector as claimed in claim 1 , wherein the IMLA comprises a protruding structure received within a recess in the front mating port of the housing for retaining the IMLA in position in the housing in the vertical direction.

5. The receptacle connector as claimed in claim 1 , wherein each of the front upper contacts and the rear upper contacts is equipped with a jogged structure to be offset from the corresponding front lower contact and rear lower contact in the transverse direction.

6. The receptacle connector as claimed in claim 5 , wherein the front upper contact and the corresponding rear upper contact of each wafers are aligned with each other in the front-to-back direction, and the front lower contact and the correspond lower contact of each wafers are as well.

7. The receptacle connector as claimed in claim 1 , wherein each of the contacts comprises a tail, the tails of each of the wafers aligned in a line.

8. The receptacle connector as claimed in claim 1 , wherein each of the tails of one of the wafers is offset with the corresponding one of the tail of adjacent wafer along the front-to-back direction.

9. A double-deck receptacle connector, comprising:
an insulative housing defining a front upper mating port, a front lower mating port, and a rear connecting port along the front-to-back direction, both of the front upper mating port and the front lower mating port defining a plurality of upper passageways and a plurality of lower passageways with a receiving slot therebetween in the vertical direction perpendicular to said front-to-back direction, the upper passageways being respectively offset from the corresponding lower passageways in a transverse direction perpendicular to both said front-to-back direction and said vertical direction;
a lower IMLA (Insert Molded Lead-Frame Assembly) assembled within the rear connecting port and including a plurality of lower wafers stacked with one another along the transverse direction, each of said lower wafers including a lower insulator equipped with a front upper contact disposed in the corresponding upper passageway of the lower mating port, a rear upper contact located behind the corresponding upper passageway, a front lower contact disposed in the corresponding lower passageway of the lower mating port, and a rear lower contact located behind the corresponding lower passageway;
an upper IMLA assembled within the rear connecting port and stacked with the lower IMLA, the upper lower IMLA including a plurality of upper wafers stacked with one another along the transverse direction, each of said upper wafers including an upper insulator equipped with a front upper contact disposed in the corresponding upper passageway of the upper mating port, a rear upper contact located behind the corresponding upper passageway, a front lower contact disposed in the corresponding lower passageway of the lower mating port, and a rear lower contact located behind the corresponding lower passageway.

10. The double-deck receptacle connector as claimed in claim 9 , wherein the insulative housing defines a space opening at a front of the insulative housing and between the front upper mating port and the front lower mating port.

11. The double-deck receptacle connector as claimed in claim 10 , wherein the space is in communication with the rear connecting port.

12. The double-deck receptacle connector as claimed in claim 9 , wherein each of the front upper/lower contacts and rear upper/lower contacts of the lower IMLA and the upper IMLA comprises a tail, a mating portion, and a body portion connected therebetween, each of the front upper contacts and the rear upper contacts of the lower IMLA and the upper IMAL further equipped with a jogged structure connected between the mating portion and the body portion that make the mating portions of the front upper contact and the rear upper contacts to be offset from the mating portions of corresponding front lower contact and rear lower contact in the transverse direction.

13. The double-deck receptacle connector as claimed in claim 12 , wherein the mating portions of the front upper contact and the rear upper contact of one of the upper spacers and the mating portions of the front upper contact and the rear upper contact of corresponding one lower spacer are disposed at a same vertical plane, and the mating portions of the front lower contact and the rear lower contact of one of the upper spacers and the mating portions of the front lower contact and the rear lower contact of corresponding one lower spacer are disposed at another same vertical plane.

14. The double-deck receptacle connector as claimed in claim 13 , wherein the body portions and the tails of the front upper contact, the rear upper contact, the front lower contacts, and the rear lower contact of the upper and the lower spacers are disposed at the another same vertical plane.

15. A receptacle connector comprising:
an insulative housing defining a front mating port and a rear connecting port along the front-to-back direction, the front mating port defining a plurality of upper passageways and a plurality of lower passageways with a receiving slot therebetween in the vertical direction perpendicular to said front-to-back direction, the upper passageways being respectively offset from the corresponding lower

Assignees

• Foxconn Interconnect Technology Ltd

Inventors

• Little Terrance F

Classifications

• H01R2107/00

  Four or more poles · CPC title

• H01R13/665

  with built-in electronic circuit (H01R13/70, H01R13/719 take precedence) · CPC title

• H01R25/006

  the coupling part being secured to apparatus or structure, e.g. duplex wall receptacle · CPC title

• H01R27/00 Primary

  Coupling parts adapted for co-operation with two or more dissimilar counterparts ({for dissimilar contact members H01R13/35}; supported only by co-operation with a counterpart H01R31/00; with a holder adapted for supporting apparatus to which its counterpart is attached H01R33/90) · CPC title

• H01R13/502

  composed of different pieces (H01R13/514 takes precedence) · CPC title