Multilayer polymer dielectric film

US10068706B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10068706-B2
Application numberUS-201715403838-A
CountryUS
Kind codeB2
Filing dateJan 11, 2017
Priority dateOct 16, 2008
Publication dateSep 4, 2018
Grant dateSep 4, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A multilayer polymer dielectric film includes a stack of coextruded, alternating first dielectric layers and second dielectric layers that receive electrical charge. The first dielectric layers include a first polymer material and the second dielectric layers include a second polymer material different from the first polymer material. The first polymer material has a permittivity greater than the second polymer material. The second polymer material has a breakdown strength greater than the first polymer material. Adjoining first dielectric layers and second dielectric layers define an interface between the layers that delocalizes electrical charge build-up in the layers. The stack has substantially the crystallographic symmetry before and during receiving electrical charge.

First claim

Opening claim text (preview).

Having described the invention, the following is claimed: 1. A capacitor comprising: a stack of coextruded, alternating first dielectric layers and second dielectric layers, the capacitor receiving and storing an electrical charge, the first dielectric layers comprising a first polymer material and the second dielectric layers comprising a second polymer material different from the first polymer material, the first polymer material having a permittivity greater than the second polymer material, and the second polymer material having a breakdown strength greater than the first polymer material, the stack having substantially the same crystallographic symmetry before and during the capacitor receiving the electrical charge. 2. The capacitor of claim 1 , the stack comprising about 4 to about 500,000 alternating first dielectric layers and second dielectric layers. 3. The capacitor of claim 1 , the first dielectric layers and second dielectric layers being fabricated by multilayer coextrusion forced assembly processes. 4. The capacitor of claim 1 , the stack being axially oriented in at least one direction substantially parallel to a surface of the film at a ratio effective to increase the breakdown strength of the film. 5. The capacitor of claim 1 , at least one of the first polymer layers and the second polymer layers further comprising a filler to improve the dielectric properties of the first polymer material and/or the second polymer material. 6. The capacitor of claim 1 , the stack of coextruded first dielectric layers and second dielectric layers having a breakdown voltage that is greater than the breakdown voltage of the first dielectric layers and the breakdown voltage of the second dielectric layers. 7. The capacitor of claim 1 , the stack of coextruded first dielectric layers and second dielectric layers having an electrical conductivity that is greater than the electrical conductivity of the first dielectric layers and the electrical conductivity of the second dielectric layers. 8. The capacitor of claim 1 , the stack of coextruded first dielectric layers and second dielectric layers having an energy density that is greater than the energy density of the first dielectric layers and the energy density of the second dielectric layers. 9. The capacitor of claim 1 , the stack further comprising tie layers interposed between the first and second dielectric layers. 10. The capacitor of claim 9 , wherein the first dielectric layers and the tie layers define first interfaces between the layers and the second dielectric layers and tie layers define second interfaces between the layers such that the stack exhibits at least one of a higher breakdown strength and a higher energy density than the breakdown strength and energy density of the first and second dielectric layers. 11. The capacitor of claim 10 , wherein the first interfaces and the second interfaces constitute interphase regions in which the tie layers are interdiffused into the first dielectric layers and the second dielectric layers, respectively.

Assignees

Inventors

Classifications

  • Dielectric · CPC title

  • H01G4/18Primary

    of synthetic material, e.g. derivatives of cellulose (H01G4/16 takes precedence) · CPC title

  • of synthetic resin · CPC title

  • the layers being joined at their surfaces · CPC title

  • Wide strips, e.g. films, webs · CPC title

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What does patent US10068706B2 cover?
A multilayer polymer dielectric film includes a stack of coextruded, alternating first dielectric layers and second dielectric layers that receive electrical charge. The first dielectric layers include a first polymer material and the second dielectric layers include a second polymer material different from the first polymer material. The first polymer material has a permittivity greater than t…
Who is the assignee on this patent?
Univ Case Western Reserve, Us Navy
What technology area does this patent fall under?
Primary CPC classification H01G4/18. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 04 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).