Method of manufacturing a waveguide

Patent metadata

Field	Value
Publication number	US-10067291-B2
Application number	US-201715499261-A
Country	US
Kind code	B2
Filing date	Apr 27, 2017
Priority date	Oct 13, 2016
Publication date	Sep 4, 2018
Grant date	Sep 4, 2018

Abstract

A method of manufacturing a waveguide in a glass plate is disclosed. The glass plate is scanned with a laser beam directed orthogonally to the glass plate to form a trench according to a pattern of the waveguide to be formed. The scanning is performed by pulses of the laser beam having a duration between 2 and 500 femtoseconds. The glass plate with the trench is treated with hydrofluoric acid. After treating the glass plate, the trench is filled with a material having an index different from that of glass, and, after filling the trench, a cladding layer is deposited.

First claim

What is claimed is:

1. A method of manufacturing a waveguide in a glass plate, the method comprising:
scanning the glass plate with a laser beam directed orthogonally to the glass plate to form a trench according to a pattern of the waveguide to be formed, the scanning being performed by pulses of the laser beam having a duration between 2 and 500 femtoseconds, wherein the scan of the laser beam according to the pattern forms exactly one trench in the glass plate, wherein scanning the glass plate comprises forming cracks in sidewalls of the trench;
treating the glass plate with the trench with hydrofluoric acid to remove the cracks in the sidewalls of the trench;
after treating the glass plate, filling the trench with a material having an index different from that of glass; and
after filling the trench, depositing a cladding layer.

2. The method of claim 1 , wherein the trench has a depth between 5 μm and 10 μm and a width between 5 μm and 10 μm.

3. The method of claim 1 , wherein the filled trench is a single-mode waveguide.

4. The method of claim 1 , wherein the material is a polymer.

5. The method of claim 4 , further comprising performing a cross-linking and after filling the trench.

6. The method of claim 1 , further comprising performing a planarization step after filling the trench.

7. The method of claim 6 , wherein the planarization step is carried out by chemical-mechanical polishing.

8. The method of claim 1 , wherein filling the trench with the material comprises laminating the material in the trench.

9. The method of claim 1 , wherein the trench has a semi-circular, rectangular, or rounded-angle rectangular cross-section.

10. The method of claim 1 , wherein the pulses are emitted at a frequency between 10 and 500 kHz.

11. The method of claim 1 , wherein the cladding layer comprises silicon oxide.

12. The method of claim 1 , wherein the cracks extend from the sidewalls into the glass plate, and wherein the cracks extend parallel to the pattern of the waveguide.

13. The method of claim 1 , wherein the cladding layer directly contacts the material in the filled trench.

14. A method of manufacturing an optical device, the method comprising:
scanning a glass plate with a first laser beam directed orthogonally to a first surface of the glass plate to form a trench according to a pattern of a waveguide to be formed, the scanning being performed by pulses of the first laser beam having a duration between 2 and 500 femtoseconds;
treating the glass plate with the trench with hydrofluoric acid;
filling the treated trench with a fill material having an index different from that of glass;
scanning the glass plate with a second laser beam directed at an acute angle with respect to the first surface to form a mirror trench in the glass plate, the mirror trench being deeper than the filled trench, wherein scanning the glass plate with the second laser beam comprises pulses of the second laser beam having a duration between 2 and 500 femtoseconds;
filling the mirror trench with a reflective material; and
depositing a cladding layer over the filled trench and mirror trench.

15. The method of claim 14 , wherein the filled trench has a depth between 5 μm and 10 μm and a width between 5 μm and 10 μm.

16. The method of claim 14 , wherein the fill material is a polymer.

17. The method of claim 14 , further comprising performing a chemical-mechanical polishing step to planarize the trench.

18. An apparatus comprising:
a glass plate;
a cladding layer disposed on a first surface of the glass plate;
a single-mode waveguide extending from the cladding layer into the glass plate, the waveguide being made of a material having an index greater than that of glass, wherein the waveguide comprises a depth between 5 μm and 10 μm and a width between 5 μm and 10 μm; and
an inclined mirror extending from the cladding layer into the glass plate and terminating in the glass plate, the inclined mirror forming an acute angle with the first surface, wherein the inclined mirror is disposed entirely within the glass plate.

19. The apparatus of claim 18 , wherein the material is a polymer.

20. The apparatus of claim 18 , wherein the waveguide is disposed in a trench of the glass plate, the trench having a semi-circular, rectangular, or rounded-angle rectangular cross-section.

21. The apparatus of claim 18 , wherein the cladding layer comprises silicon oxide.

Assignees

• St Microelectronics Sa

Inventors

• Durand Cédric
• Gianesello Frédéric
• Ayi-Yovo Folly Eli

Classifications

• C03C17/09

  by deposition from the vapour phase · CPC title

• G02B2006/12104

  Mirror; Reflectors or the like · CPC title

• G02B6/138

  by using polymerisation · CPC title

• G02B6/136

  by etching · CPC title

• B23K2103/54

  Glass · CPC title