Wiring layout to reduce magnetic field

Patent metadata

Field	Value
Publication number	US-10067201-B2
Application number	US-201615099561-A
Country	US
Kind code	B2
Filing date	Apr 14, 2016
Priority date	Apr 14, 2016
Publication date	Sep 4, 2018
Grant date	Sep 4, 2018

Abstract

A magnetic sensor has a circuit segment with a quadrupole region. The quadrupole region includes a supply line, a first return line and a second return line, all in a conductor layer. The first supply line is laterally adjacent to the supply line on a first side, and the second return line is laterally adjacent to the supply line on a second, opposite side. A space between the supply line and the first return line is free of the conductor layer; similarly, a space between the supply line and the second return line is free of the conductor layer. The first return line and the second return line are electrically coupled to the supply line at a terminus of the circuit segment.

First claim

What is claimed is:

1. A magnetic sensor, comprising:
a substrate; and
a circuit segment having a quadrupole region disposed on the substrate, comprising:
a supply line disposed in a conductor layer;
a first return line disposed in the conductor layer adjacent to the supply line, wherein a space between the first return line and the supply line is free of the conductor layer; and
a second return line disposed in the conductor layer adjacent to the supply line opposite from the first return line, wherein a space between the second return line and the supply line is free of the conductor layer;
wherein the first return line and the second return line are electrically coupled to the supply line at a terminus of the circuit segment.

2. The magnetic sensor of claim 1 , wherein a width of the first return line is equal to a width of the second return line.

3. The magnetic sensor of claim 1 , wherein a width of the supply line is equal to a sum of a width of the first return line and a width of the second return line.

4. The magnetic sensor of claim 1 , wherein the substrate is a plate of an alkali metal vapor cell of the magnetic sensor.

5. The magnetic sensor of claim 1 , wherein the substrate is a support substrate of a vertical cavity surface emitting laser (VCSEL) of the magnetic sensor.

6. The magnetic sensor of claim 1 , wherein the circuit segment has a serpentine configuration, wherein the circuit segment has a turn so that two portions of the circuit segment are immediately adjacent to each other, and a space between the adjacent portions of the circuit segment are free of the conductor layer.

7. The magnetic sensor of claim 6 , wherein the circuit segment is a first circuit segment of a plurality of circuit segments, the supply line is a first supply line, and the terminus is a first terminus, the magnetic sensor further comprising a second circuit segment of the plurality of circuit segments, the second circuit segment having a quadrupole region, the second circuit segment being disposed over the substrate, the second circuit segment comprising:
a second supply line disposed in the conductor layer;
a third return line disposed in the conductor layer adjacent to the second supply line, wherein a space between the third return line and the second supply line is free of the conductor layer; and
a fourth return line disposed in the conductor layer adjacent to the second supply line opposite from the third return line, wherein a space between the fourth return line and the second supply line is free of the conductor layer;
wherein the third return line and the fourth return line are electrically coupled to the second supply line at a terminus of the second circuit segment, and the second circuit segment has a serpentine configuration; and wherein a portion of the first return line parallel to a portion of the third return line, and a space between the portion of the first return line and the portion of the third return line is free of the first circuit segment and the second circuit segment.

8. The magnetic sensor of claim 1 , wherein the supply line, the first return line and the second return line are recessed below a surface of the substrate.

9. The magnetic sensor of claim 8 , wherein the terminus has an enlarged pattern, wherein a space between the first return line and the supply line proximate to the terminus is larger than a space between the first return line and the supply line proximate to a connection end of the circuit segment at an opposite end of the circuit segment from the terminus.

10. The magnetic sensor of claim 1 , wherein the first return line and the second return line are electrically coupled to the supply line outside of the conductor layer at the terminus.

11. A method of forming a magnetic sensor, comprising:
providing a substrate;
forming a circuit segment having a quadrupole region in a conductor layer on the substrate, the circuit segment comprising:
forming a supply line disposed in the conductor layer;
forming a first return line disposed in the conductor layer adjacent to the supply line, wherein a space between the first return line and the supply line is free of the conductor layer;
forming a second return line disposed in the conductor layer adjacent to the supply line opposite from the first return line, wherein a space between the second return line and the supply line is free of the conductor layer;
forming an electrical connection between the supply line and the first return line at a terminus of the circuit segment; and
forming an electrical connection between the supply line and the second return line at the terminus; and

forming electrical connections to the supply line, the first return line and the second return line at a connection end of the circuit segment opposite from the terminus.

12. The method of claim 11 , wherein forming the first return line and forming second return line are performed so that a width of the first return line is equal to a width of the second return line.

13. The method of claim 11 , wherein forming the supply line, forming the first return line and forming second return line are performed so that a width of the supply line is equal to a sum of a width of the first return line and a width of the second return line.

14. The method of claim 11 , wherein forming the supply line, forming the first return line and forming second return line are performed so that the circuit element has a serpentine configuration, wherein the circuit segment has a turn so that two portions of the circuit segment are immediately adjacent to each other, and a space between the adjacent portions of the circuit segment are free of the conductor layer.

15. The method of claim 11 , further comprising singulating the substrate after forming the circuit segment.

16. The method of claim 11 , wherein forming the supply line, forming the first return line and forming second return line comprise:
forming the conductor layer as a continuous conductor layer over the substrate;
forming an etch mask over the layer of metal which covers areas for the supply line, the first return line and second return line;
removing the conductor layer where exposed by the etch mask; and
subsequently removing the etch mask.

17. The method of claim 11 , wherein forming the supply line, forming the first return line and forming second return line comprise:
forming a thick film paste pattern having the quadrupole region over the substrate by a screen print process; and
heating the thick film paste pattern to form the conductor layer, thereby forming the supply line, the first return line and second return line in the conductor layer.

18. The method of claim 11 , wherein the supply line, the first return line and the second return line are recessed below a surface of the substrate, and further comprising assembling the substrate into an alkali metal vapor cell of the magnetic sensor.

19. The method of claim 18 , wherein the substrate is composed of transparent material.

20. The method of claim 11 , further comprising assembling a VCSEL of the magnetic sensor onto the substrate proximate to the circuit segment.

Assignees

• Texas Instruments Inc

Inventors

• Mirgorodski Iouri N
• Parsa Roozbeh
• French William
• Lee Dok Won
• Gabrys Ann

Classifications

• G01R33/0052

  Manufacturing aspects; Manufacturing of single devices, i.e. of semiconductor magnetic sensor chips (devices based on galvano-magnetic effect or the like H10N50/85) · CPC title

• H05K2201/083

  Magnetic materials · CPC title

• H05K3/064

  Photoresists · CPC title

• H05K1/0296

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title

• G01R33/02 Primary

  Measuring direction or magnitude of magnetic fields or magnetic flux (G01R33/20 takes precedence) · CPC title