Direct liquid deposition

US10066287B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10066287-B2
Application numberUS-201514849818-A
CountryUS
Kind codeB2
Filing dateSep 10, 2015
Priority dateOct 21, 2011
Publication dateSep 4, 2018
Grant dateSep 4, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Liquid precursor material of a coating substance and a solvent is provided in a reservoir (STEP 1 , STEP 1 ′). In one variant the liquid precursor material is distilled (STEP 2 ), the resultant liquid coating substance is vaporized (STEP 3 ) and ejected through a vapor distribution nozzle arrangement ( 7 ) into a vacuum recipient ( 3 ) and onto substrate 5 to be coated. Alternatively, the liquid precursor material is directly vaporized (STEP 3 ′). From the two-component vapor coating substance vapor is applied to substrate 5 ′ to be coated. In this variant separation of solvent vapor and coating substance vapor is performed especially downstream vaporizing (STEP 2 ′).

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of manufacturing a coated substrate, comprising: a) providing a vapour distribution nozzle arrangement in a vacuum recipient, said nozzle arrangement comprising a vapour ejection opening arrangement; b) providing an arrangement of at least one substrate in the vacuum recipient; c) evacuating the vacuum recipient at the latest when said substrate arrangement is provided therein; d) providing a vaporising compartment; e) heating said vaporising compartment; f) injecting a predetermined portion of a liquid precursor material comprising a coating substance dissolved in a solvent in said vaporising compartment and vaporising said portion by said heating thereby raising the pressure in at least one of in said vaporising compartment and of in said vacuum recipient; g) ejecting a result of said vaporising said predetermined portion through said vapour ejection opening arrangement into the vacuum recipient; h) establishing in at least one of said vaporising compartment and of said vacuum recipient a pressure course rising to a maximum due to said vaporising and ejecting and dropping by half of the value of said rising in the respective one of said at least one of said vaporising compartment and of said vacuum recipient within at most 10 seconds from reaching said maximum; i) establishing a coating of said coating substance on the arrangement of at least one substrate; and j) removing said arrangement of at least one substrate from said vacuum recipient after said coating. 2. The method according to claim 1 , further comprising ejecting the result of said vaporising in a single shot. 3. The method according to claim 1 , further comprising ejecting the result of said vaporising in more than one time-discrete shots. 4. The method according to claim 1 , wherein said coating is performed by a single or by more than one of said predetermined portions. 5. The method according to claim 4 , wherein said coating is performed by ejecting one or more than one time discrete shots out of the result of said vaporising. 6. The method according to claim 1 , further comprising establishing a flow of a gas superimposed to said ejecting. 7. The method according to claim 6 , further comprising establishing said flow in an uninterrupted manner at least during said coating. 8. The method according to claim 1 , further comprising conveying the result of said vaporizing in a laminar flow of a gas towards said ejecting. 9. The method according to claim 1 , further comprising expanding the result of said vaporising into said vacuum recipient, at least one of: through a flow resistance element, preferably a flow channel arrangement or a flow diffuser element; in a substantially laminar flow towards said expanding; thereby performing pumping of said vacuum recipient at least during said coating. 10. The method according to claim 1 , wherein said ejecting is performed at least one of: coaxially to an axis; coaxially to an axis and comprising an ejecting direction component radially outwards from said axis, said component being the predominant component of direction of said ejecting; and in a ring-shaped ejection pattern about an axis. 11. The method according to claim 1 , wherein the surface of said at least one substrate is pre-treated by at least one of by reactive ion etching and of by depositing a transparent layer. 12. The method according to claim 1 , further comprising establishing in the respective one of said at least one of said vaporizing compartment and of said vacuum recipient a pressure course rising to said maximum due to said vaporising and ejecting and dropping by half of the value of said rising in the respective one of said at least one of said vaporising compartment and of said vacuum recipient within at least 0.5 seconds from reaching said maximum. 13. The method according to claim 1 , further comprising selecting said predetermined portion to be between 5×10 −5 μl and 5×10 −2 μl per cm 2 of surface of said arrangement to be coated. 14. The method according to claim 1 , further comprising providing said predetermined portion to the said vaporising within at most 30 milliseconds. 15. The method according to claim 1 , further comprising sensing a pressure dependent from a pressure in said vaporising compartment and exploiting the result of said sensing for at least one of process monitoring and of process control, in a negative feedback control loop, thereby sensing said dependent pressure in said vacuum recipient and feeding a result of said vaporising in said vaporising compartment to said vacuum recipient via a flow resistance element. 16. The method according to claim 1 , wherein the arrangement of at least one substrate is kept centralised with respect to said ejection opening arrangement during said coating. 17. The method according to claim 1 , further comprising subsequently providing further arrangements of at least one substrate in said vacuum recipient at a rate of one every at most 20 seconds. 18. The method according to claim 1 , further comprising heating said result of said vaporising at least one of before, of during and of after said ejecting, before said coating. 19. The method according to claim 1 , further comprising flow communication between said vaporising and said vacuum recipient during said vaporising via at least one flow resistance element. 20. The method according to claim 1 , wherein the opening arrangement comprises a distribution element and a deflection element, the distribution element comprising an input for vapour, an output for vapour, and a recess that becomes enlarged in the direction of the output for vapour, the input for vapour being situated at an apex of the recess, the deflection element being configured to direct vapour from the input for vapour towards walls of the recess, the deflection element comprising a single deflection element facing the input for vapour. 21. A method of manufacturing a portable device, comprising: a) providing a vapour distribution nozzle arrangement in a vacuum recipient, said nozzle arrangement comprising a vapour ejection opening arrangement; b) providing an arrangement of at least one substrate in the vacuum recipient; c) evacuating the vacuum recipient at the latest when said substrate arrangement is provided therein; d) providing a vaporising compartment; e) heating said vaporising compartment; f) injecting a predetermined portion of a liquid precursor material comprising a coating substance dissolved in a solvent in said vaporising compartment and vaporising said portion by said heating thereby raising the pressure in at least one of in said vaporising compartment and of in said vacuum recipient; g) ejecting a result of said vaporising said predetermined portion through said vapour ejection opening arrangement into the vacuum recipient; h) establishing in at least one of said vaporising compartment and of said vacuum recipient a pressure course rising to a maximum due to said vaporising and ejecting and dropping by half of the value of said rising in the respective one of said at least one of said vaporising compartment and of said vacuum recipient within at most 10 seconds from reaching said maximum; i) establishing a coating of said coating substance on the arrangement of at least one substrate; and j) removing said arrangement of at least one substrate from said vacuum recipient after said coating, the coated substrate being a screen of the portable device.

Assignees

Inventors

Classifications

  • Substrate holders · CPC title

  • C23C14/228Primary

    Gas flow assisted PVD deposition · CPC title

  • Cleaning or etching treatments · CPC title

  • in annular, tubular or hollow conical form · CPC title

  • Organic material · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10066287B2 cover?
Liquid precursor material of a coating substance and a solvent is provided in a reservoir (STEP 1 , STEP 1 ′). In one variant the liquid precursor material is distilled (STEP 2 ), the resultant liquid coating substance is vaporized (STEP 3 ) and ejected through a vapor distribution nozzle arrangement ( 7 ) into a vacuum recipient ( 3 ) and onto substrate 5 to be coated. Alternatively, the liq…
Who is the assignee on this patent?
Oerlikon Advanced Tech Ag, Evatec Ag
What technology area does this patent fall under?
Primary CPC classification C23C14/228. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 04 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).