Amorphous metal overmolding

Patent metadata

Field	Value
Publication number	US-10065396-B2
Application number	US-201414537384-A
Country	US
Kind code	B2
Filing date	Nov 10, 2014
Priority date	Jan 22, 2014
Publication date	Sep 4, 2018
Grant date	Sep 4, 2018

Abstract

An embodiment relates to a method comprising overmolding a bulk-solidifying amorphous alloy on a preform of another material than the bulk-solidifying amorphous alloy to form a bulk-solidifying amorphous alloy overmolded preform. Another embodiment relates to an article comprising an overmolded shell comprising the bulk-solidifying amorphous alloy on a preform of another material than the bulk-solidifying amorphous alloy. The preform could be made of a crystalline or amorphous metal or alloy such as aluminum, stainless steel, copper or beryllium.

First claim

What is claimed is:

1. A method comprising:
overmolding a bulk-solidifying amorphous alloy on an outer surface of a preform of another material to form a bulk-solidifying amorphous alloy overmolded article comprising an overmolded shell,
the preform comprising:
a bottom surface;
an exposed top surface; and
a sidewall extending from the bottom surface to the top surface and positioned around a periphery of the bottom surface to define a side of the preform; and

the overmolded shell defining a shelf extending towards the sidewall of the preform and defining an exposed shelf surface that is flush with the top surface of the preform.

2. The method of claim 1 , wherein the another material is a metal or ceramic.

3. The method of claim 1 , wherein:
overmolding the bulk-solidifying amorphous alloy comprises injecting the bulk-solidifying amorphous alloy into a mold; and
the method further comprises placing the preform directly into the mold prior to the injecting the bulk-solidifying amorphous alloy into the mold.

4. The method of claim 1 , wherein the bulk-solidifying amorphous alloy surrounds and bonds to at least a portion of the preform.

5. The method of claim 1 , wherein a wall of the overmolded shell is thinner than the sidewall of the preform.

6. The method of claim 1 , further comprising placing the preform into a mold and closing the mold, wherein when the mold is closed the preform becomes clamped and immovable inside the mold.

7. The method of claim 6 , wherein the preform remains in place during subsequent injection of the bulk-solidifying amorphous alloy into the mold.

8. The method of claim 7 , wherein upon completion of the injection, the bulk-solidifying amorphous alloy overmolded article is removed from the mold.

9. The method of claim 8 , wherein the bulk-solidifying amorphous alloy overmolded article is not post-processed by machining equipment.

10. The method of claim 8 , wherein the bulk-solidifying amorphous alloy overmolded article is post-processed by machining equipment.

11. An article comprising
a preform defining:
a bottom surface;
an exposed top surface; and
a sidewall extending from the bottom portion and defining a side of the preform; and

a bulk-solidifying amorphous alloy shell overmolded on the bottom surface and the sidewall of the preform and secured to the preform by at least one of a mechanical bond or a chemical bond, the bulk-solidifying amorphous alloy shell comprising:
a first portion having a first thickness; and
a second portion having a second thickness greater than the first thickness and defining a shelf extending towards the sidewall of the preform, the shelf defining an exposed shelf surface that is flush with the exposed top surface of the preform;

wherein the preform is formed from a crystalline metal or a ceramic material.

12. The article of claim 11 , wherein the preform is formed from the crystalline metal.

13. The article of claim 11 , wherein the preform defines an undercut and the bulk-solidifying amorphous alloy shell mechanically engages with the undercut.

14. The article of claim 11 , wherein the bulk-solidifying amorphous alloy shell has a thickness from about 0.5 mm to less than about 2 mm.

15. A housing for an electronic device comprising:
a crystalline interior member defining an internal cavity configured to receive an internal component of the electronic device and defining:
a bottom outer surface;
a top outer surface; and
a side outer surface; and

a shell of a bulk-solidifying amorphous alloy forming an exterior surface of the housing and affixed to the side outer surface of the crystalline interior member and the bottom outer surface of the crystalline interior member and defining a flange extending above the top outer surface of the crystalline interior member.

16. The housing of claim 15 , wherein the crystalline interior member is formed of a metal.

17. The housing of claim 16 , wherein the crystalline interior member is formed of aluminum.

18. The housing of claim 15 , wherein:
the housing comprises a wall defined by the shell and the crystalline interior member; and
a thickness of a portion of the wall defined by the shell is less than a thickness of a portion of the wall defined by the crystalline interior member.

19. The housing of claim 18 , wherein the portion of the wall defined by the shell has a thickness greater than about 0.5 mm and less than about 5 mm.

20. The housing of claim 15 , wherein the shell has an amorphous content of more than 90% by volume.

Assignees

• Crucible Intellectual Prop Llc

Inventors

• Verreault Adam A
• O'Keeffe Sean T
• Jelbert Glenton R

Classifications

• B32B2250/02

  2 layers · CPC title

• Y10T428/12736

  Al-base component · CPC title

• Y10T428/12979

  Containing more than 10% nonferrous elements [e.g., high alloy, stainless] · CPC title

• B32B15/01 Primary

  all layers being exclusively metallic {(making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00)} · CPC title

• B32B15/20

  comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title