Conductive adhesive film and method of attaching electronic device using the same

Patent metadata

Field	Value
Publication number	US-10064274-B2
Application number	US-201615287591-A
Country	US
Kind code	B2
Filing date	Oct 6, 2016
Priority date	Nov 5, 2015
Publication date	Aug 28, 2018
Grant date	Aug 28, 2018

Abstract

A conductive adhesive film includes a first adhesive member including a first insulating adhesive layer having a first viscosity, a plurality of first conductive balls being in the first insulating adhesive layer, and a second adhesive member including a second insulating adhesive layer having a second viscosity greater than the first viscosity, a plurality of second conductive balls being in the second insulating adhesive layer.

First claim

What is claimed is:

1. A conductive adhesive film comprising:
a first adhesive member comprising a first insulating adhesive layer having a first viscosity, a plurality of first conductive balls being in the first insulating adhesive layer; and
a second adhesive member comprising a second insulating adhesive layer having a second viscosity greater than the first viscosity, a plurality of second conductive balls being in the second insulating adhesive layer,
wherein the first viscosity is in a range equal to or greater than about 15,000 Pa·s and less than or equal to about 20,000 Pa·s, and the second viscosity is in a range equal to or greater than about 30,000 Pa·s and less than or equal to about 50,000 Pa·s.

2. The conductive adhesive film of claim 1 , wherein the first adhesive member is adjacent to the second adhesive member.

3. The conductive adhesive film of claim 2 , wherein the second insulating adhesive layer has a thickness that is substantially equal to a diameter of each of the second conductive balls.

4. The conductive adhesive film of claim 1 , wherein the first insulating adhesive layer has a thickness equal to or greater than about 4.5 micrometers and less than or equal to about 5.5 micrometers, and the second insulating adhesive layer has a thickness equal to or greater than about 2.5 micrometers and less than or equal to about 3.5 micrometers.

5. The conductive adhesive film of claim 4 , wherein each of the first conductive balls and each of the second conductive balls have a diameter equal to or greater than about 2.5 micrometers and less than or equal to about 3.5 micrometers.

6. The conductive adhesive film of claim 1 , wherein each of the first and second insulating adhesive layers comprises an epoxy resin or an acrylic resin.

7. The conductive adhesive film of claim 1 , wherein the first and second conductive balls comprise a metal material.

8. The conductive adhesive film of claim 7 , wherein the metal material comprises at least one of nickel (Ni), cobalt (Co), chromium (Cr), and iron (Fe).

9. The conductive adhesive film of claim 1 , wherein the second conductive balls are spaced from each other at regular intervals.

10. A conductive adhesive film comprising:
a first adhesive member comprising a first insulating adhesive layer having a first viscosity, a plurality of first conductive balls being in the first insulating adhesive layer; and
a second adhesive member comprising a second insulating adhesive layer having a second viscosity greater than the first viscosity, a plurality of second conductive balls being in the second insulating adhesive layer; and
a third adhesive member comprising a third insulating adhesive layer having a third viscosity less than the first viscosity.

11. The conductive adhesive film of claim 10 , wherein the third insulating adhesive layer has a thickness equal to or greater than about 11.5 micrometers and less than or equal to about 12.5 micrometers.

12. The conductive adhesive film of claim 10 , wherein the third viscosity is in a range equal to or greater than about 800 Pa·s and less than or equal to about 1,000 Pa·s.

Assignees

• Samsung Display Co Ltd

Inventors

• Kim Euttum
• Jung Chulho

Classifications

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K2201/10128

  Display · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K3/361

  Assembling flexible printed circuits with other printed circuits · CPC title

• H05K1/11 Primary

  Printed elements for providing electric connections to or between printed circuits · CPC title