Semiconductor integrated circuit, variable gain amplifier, and sensing system

Patent metadata

Field	Value
Publication number	US-10063201-B2
Application number	US-201715820169-A
Country	US
Kind code	B2
Filing date	Nov 21, 2017
Priority date	Oct 1, 2014
Publication date	Aug 28, 2018
Grant date	Aug 28, 2018

Abstract

A semiconductor integrated circuit includes a first pad provided on one end side of a first resistive element and one end side of a second resistive element externally provided, a second pad provided on a different end side of the first resistive element, a third pad provided on a different end side of the second resistive element and one end side of a third resistive element externally provided, an operation amplifier, a first signal line, wired between an output terminal of the operation amplifier and the first pad, a second signal line wired between an inverting input terminal of the operation amplifier and the second pad, a third signal line wired between the inverting input terminal of the operational amplifier and the third pad, a first ESD protection element, provided to the first signal line, a fourth signal line, through which a voltage signal of the first pad.

First claim

What is claimed is:

1. A semiconductor integrated circuit comprising:
a first pad provided on one end side of a first resistive element and one end side of a second resistive element externally provided;
a second pad provided on a different end side of the first resistive element;
a third pad provided on a different end side of the second resistive element and one end side of a third resistive element externally provided;
an operation amplifier;
a first signal line wired between an output terminal of the operation amplifier and the first pad;
a second signal line wired between an inverting input terminal of the operation amplifier and the second pad;
a third signal line wired between the inverting input terminal of the operational amplifier and the third pad;
a first ESD (Electrostatic Discharge) protection element provided to the first signal line;
a fourth signal line, through which a voltage signal of the first pad is transmitted, the fourth signal line being connected to the first pad,
a first switch provided on the first signal line;
a second switch provided on the second signal line; and
a third switch provided on the third signal line,
wherein a reference voltage is supplied to a non-inverting input terminal of the operation amplifier.

2. The semiconductor integrated circuit according to claim 1 ,
wherein an input current is supplied to the second pad and an input voltage is supplied to the third pad.

3. The semiconductor integrated circuit according to claim 1 ,
wherein at least one of the first switch, the second switch and the third switch is set by a register.

4. A variable gain amplifier comprising:
the first resistive element;
the second resistive element;
the third resistive element; and
the semiconductor integrated circuit according to claim 1 .

5. A semiconductor integrated circuit comprising:
a first pad provided on one end side of a first resistive element and one end side of a second resistive element and one end side of a fourth resistive element and one end side of a fifth resistive element externally provided;
a second pad provided on a different end side of the first resistive element;
a third pad provided on a different end side of the second resistive element and one end side of a third resistive element externally provided;
a fourth pad provided on a different end side of the fourth resistive element;
a fifth pad provided on a different end side of the fifth resistive element and one end side of a sixth resistive element externally provided;
an operation amplifier;
a first signal line wired between an output terminal of the operation amplifier and the first pad;
a second signal line wired between an inverting input terminal of the operation amplifier and the second pad;
a third signal line wired between the inverting input terminal of the operational amplifier and the third pad;
a fifth signal line wired between the inverting input terminal of the operational amplifier and the fourth pad;
a sixth signal line wired between the inverting input terminal of the operational amplifier and the fifth pad;
a first ESD (Electrostatic Discharge) protection element provided to the first signal line;
a fourth signal line, through which a voltage signal of the first pad is transmitted, the fourth signal line being connected to the first pad,
a first switch provided on the first signal line;
a second switch provided on the second signal line;
a third switch provided on the third signal line;
a fourth switch provided on the fifth signal line; and
a fifth switch provided on the sixth signal line,
wherein a reference voltage is supplied to a non-inverting input terminal of the operation amplifier.

6. The semiconductor integrated circuit according to claim 5 ,
wherein a first input current is supplied to the second pad and a second input current is supplied to the fourth pad and a first input voltage is supplied to the third pad and a second input voltage is supplied to the fifth pad.

7. The semiconductor integrated circuit according to claim 5 ,
at least one of the first switch, the second switch, the third switch, the fourth switch, the fifth switch is set by a register.

8. A variable gain amplifier comprising:
the first resistive element;
the second resistive element;
the third resistive element;
the fourth resistive element;
the fifth resistive element;
the sixth resistive element; and
the semiconductor integrated circuit according to claim 5 .

Assignees

• Renesas Electronics Corp

Inventors

• Kiritani Masahide

Classifications

• H03G3/02 Primary

  Manually-operated control {(H03G3/001 and H03G3/002 take precedence)} · CPC title

• H03F2203/45601

  the IC comprising one or more passive resistors by feedback · CPC title

• H03F2203/45138

  Two or more differential amplifiers in IC-block form are combined, e.g. measuring amplifiers · CPC title

• H03F3/45475

  using IC blocks as the active amplifying circuit · CPC title

• H03F2203/45528

  the FBC comprising one or more passive resistors and being coupled between the LC and the IC · CPC title