Sealing assembly, method for preparing sealing assembly, and battery comprising the sealing assembly

US10062874B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10062874-B2
Application numberUS-201214368929-A
CountryUS
Kind codeB2
Filing dateDec 26, 2012
Priority dateDec 27, 2011
Publication dateAug 28, 2018
Grant dateAug 28, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A sealing assembly, a method of preparing the sealing assembly and a battery are provided. The sealing assembly comprises a metal ring having a mounting hole therein; a ceramic ring having a connecting hole therein and disposed in the mounting hole; and a core column disposed in the connecting hole, wherein at least one of an inner circumferential wall surface of the metal ring, an outer circumferential wall surface of the ceramic ring, an inner circumferential wall surface of the ceramic ring and an outer circumferential wall surface of the core column is configured as an inclined surface, and an inclination angle of the inclined surface relative to a vertical plane is about 1 degree to about 45 degrees.

First claim

Opening claim text (preview).

What is claimed is: 1. A sealing assembly, comprising: a metal ring having a mounting hole therein; a ceramic ring having a connecting hole therein and disposed in the mounting hole; and a core column disposed in the connecting hole, wherein each of an inner circumferential wall surface of the metal ring, an outer circumferential wall surface of the ceramic ring, an inner circumferential wall surface of the ceramic ring and an outer circumferential wall surface of the core column is configured as an inclined surface so that the metal ring is configured to be soldered to the ceramic ring and the ceramic ring is configured to be soldered to the core column, and an inclination angle of the inclined surface relative to a vertical plane is about 2 degrees to about 30 degrees, wherein a second soldering layer is disposed between the inner circumferential wall surface of the ceramic ring and the outer circumferential wall surface of the core column, wherein when the sealing assembly is configured as a sealing assembly for at least one of a positive electrode and a negative electrode of a battery, the core column is made of Ti and the second soldering layer is formed by a Ti-based solder material, wherein the Ti-based solder material comprises Ti, and at least one of Zr, Ni, and Cu. 2. The sealing assembly of claim 1 , wherein the inner circumferential wall surface of the metal ring and the outer circumferential wall surface of the ceramic ring form a first pair of jointing surfaces, the inner circumferential wall surface of the ceramic ring and the outer circumferential wall surface of the core column form a second pair of jointing surfaces, both the first and second pairs of jointing surfaces are configured as the inclined surface. 3. The sealing assembly of claim 1 , wherein a first soldering layer is disposed between the inner circumferential wall surface of the metal ring and the outer circumferential wall surface of the ceramic ring. 4. The sealing assembly of claim 3 , wherein the first soldering layer is formed by an Al-based solder material comprising Al and at least one of Si and Mg. 5. The sealing assembly of claim 1 , wherein the ceramic ring is made of a material that remains solid at a soldering temperature of at least 580° C. 6. A method for preparing a sealing assembly, comprising steps of: preparing a metal ring having a mounting hole therein, a ceramic ring having a connecting hole therein, and a core column; disposing the core column in the connecting hole of the ceramic ring; and disposing the ceramic ring in the mounting hole of the metal ring, wherein each of an inner circumferential wall surface of the metal ring, an outer circumferential wall surface of the ceramic ring, an inner circumferential wall surface of the ceramic ring and an outer circumferential wall surface of the core column is configured as an inclined surface so that the metal ring is soldered to the ceramic ring and the ceramic ring is soldered to the core column, and an inclination angle of the inclined surface relative to a vertical plane is about 2 degrees to about 30 degrees, wherein a soldering layer is disposed between the inner circumferential wall surface of the ceramic ring and the outer circumferential wall surface of the core column, wherein when the sealing assembly is configured as a sealing assembly for at least one of a positive electrode and a negative electrode of a battery, the core column is made of Ti and the soldering layer is formed by a Ti-based solder material, wherein the Ti-based solder material comprises Ti, and at least one of Zr, Ni, and Cu, wherein the ceramic ring is mounted in the mounting hole of the metal ring via a first soldering process, wherein the first soldering process is performed at a temperature of about 580 to about 630° C. for about 1 minute to about 5 minutes under vacuum or an inert gas and is performed by using a solder material. 7. The method of claim 6 , wherein the inner circumferential wall surface of the metal ring and the outer circumferential wall surface of the ceramic ring form a first pair of jointing surfaces, the inner circumferential wall surface of the ceramic ring and the outer circumferential wall surface of the core column form a second pair of jointing surfaces, both the first and second pairs of jointing surfaces are configured as the inclined surface. 8. The method of claim 6 , wherein the core column is mounted in the connecting hole of the ceramic ring via a second soldering process. 9. The method of claim 8 , wherein the second soldering process is performed at a temperature lower than a melting point of the core column for about 1 minute to about 10 minutes under vacuum or an inert gas. 10. The method of claim 6 , wherein a gap width between the core column and the ceramic ring is adjusted by a deadweight of the core column and the ceramic ring during soldering. 11. A battery, comprising: a shell having at least one open end; an electrode core and electrolyte solution received in the shell; and at least one sealing assembly configured to seal the at least one open end of the shell, wherein the sealing assembly comprises: a metal ring having a mounting hole therein, a ceramic ring having a connecting hole therein and disposed in the mounting hole, a core column disposed in the connecting hole, wherein each of an inner circumferential wall surface of the metal ring, an outer circumferential wall surface of the ceramic ring, an inner circumferential wall surface of the ceramic ring and an outer circumferential wall surface of the core column is configured as an inclined surface so that the metal ring is soldered to the ceramic ring and the ceramic ring is soldered to the core column, and an inclination angle of the inclined surface relative to a vertical plane is about 2 degrees to about 30 degrees, wherein a second soldering layer is disposed between the inner circumferential wall surface of the ceramic ring and the outer circumferential wall surface of the core column, wherein when the sealing assembly is configured as a sealing assembly for at least one of a positive electrode and a negative electrode of a battery, the core column is made of Ti and the second soldering layer is formed by a Ti-based solder material, wherein the Ti-based solder material comprises Ti, and at least one of Zr, Ni, and Cu; and wherein the metal ring of the sealing assembly is connected with the shell and the core column is connected with the electrode core.

Assignees

Inventors

Classifications

  • B23K1/19Primary

    taking account of the properties of the materials to be soldered · CPC title

  • characterised by their shape or structure · CPC title

  • the sealing members being arranged between the lid and terminal · CPC title

  • Electricity · mapped topic

  • consisting of metals or metal salts · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10062874B2 cover?
A sealing assembly, a method of preparing the sealing assembly and a battery are provided. The sealing assembly comprises a metal ring having a mounting hole therein; a ceramic ring having a connecting hole therein and disposed in the mounting hole; and a core column disposed in the connecting hole, wherein at least one of an inner circumferential wall surface of the metal ring, an outer circum…
Who is the assignee on this patent?
Shenzhen Byd Auto R&D Co Ltd, Byd Co Ltd
What technology area does this patent fall under?
Primary CPC classification B23K1/19. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 28 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).