Light-emitting diode package structure with an improved structure, light-emitting device using the same, and method of making the same

Patent metadata

Field	Value
Publication number	US-10062822-B1
Application number	US-201715828609-A
Country	US
Kind code	B1
Filing date	Dec 1, 2017
Priority date	Dec 1, 2017
Publication date	Aug 28, 2018
Grant date	Aug 28, 2018

Abstract

A light-emitting diode package structure, a light-emitting device and a method of making the same are provided. The light-emitting diode package structure includes an insulating base, a first conductive unit, a second conductive unit and at least one light-emitting diode chips. The first conductive unit is disposed on the insulating base. The second conductive unit is disposed on the insulating base and separated from the first conductive unit. The at least one light-emitting diode chips is electrically connected to the first conductive unit and the second conductive unit. Further, the first conductive unit has a first groove, and an outer surface thereof is divided by the first groove into two separated parts. In addition, the second conductive unit has a second groove, and the outer surface thereof is divided by the second groove into two separated parts.

First claim

What is claimed is:

1. A light-emitting diode package structure, comprising:
an insulating base;
a first conductive unit disposed on the insulating base;
a second conductive unit disposed on the insulating base and separated from the first conductive unit; and
at least one light-emitting diode chips electrically connected to the first conductive unit and the second conductive unit;
wherein the first conductive unit has a first groove, and an outer surface thereof is divided by the first groove into two first parts separated from each other, in which the outer surface of the first conductive unit is conductive;
wherein the second conductive unit has a second groove, and an outer surface thereof is divided by the second groove into two second parts separated from each other, in which the outer surface of the second conductive unit is conductive.

2. The light-emitting diode package structure according to claim 1 , wherein the first conductive unit and the second conductive unit respectively cover two sides of the insulating base and extend to the bottom thereof.

3. The light-emitting diode package structure according to claim 1 , wherein the first conductive unit includes a first copper layer, a first nickel layer disposed on the first copper layer, and a first gold layer disposed on the first nickel layer, in which the first groove is formed on the first gold layer, dividing the first gold layer into the two first parts and exposing the first nickel layer, wherein the second conductive unit includes a second copper layer, a second nickel layer disposed on the second copper layer, and a second gold layer disposed on the second nickel layer, in which the second groove is formed on the second gold layer, dividing the second gold layer into the two second parts and exposing the second nickel layer.

4. A light-emitting device, comprising:
a circuit board; and
a light-emitting diode package structure soldered on the circuit board by a solder, wherein the light-emitting diode package structure includes: an insulating base;
a first conductive unit disposed on the insulating base;
a second conductive unit disposed on the insulating base and separated from the first conductive unit; and
at least one light-emitting diode chips electrically connected to the first conductive unit and the second conductive unit;

wherein the first conductive unit has a first groove, an outer surface of the first conductive unit being divided by the first groove into two first parts that are separated from each other, in which the outer surface of the first conductive unit is conductive, and the solder being stopped by the first groove so as to prevent the solder from migrating from one of the two first parts to the other one of the two first parts;
wherein the second conductive unit has a second groove, an outer surface of the second conductive unit being divided by the second groove into two second parts that are separated from each other, in which the outer surface of the second conductive unit is conductive, and the solder being stopped by the second groove so as to prevent the solder from migrating from one of the two second parts to the other one of the two second parts.

5. The light-emitting device according to claim 4 , wherein the first conductive unit and the second conductive unit respectively cover two sides of the insulating base and extend to the bottom thereof.

6. The light-emitting device according to claim 4 , wherein the first conductive unit includes a first copper layer, a first nickel layer disposed on the first copper layer, and a first gold layer disposed on the first nickel layer, in which the first groove is formed on the first gold layer, dividing the first gold layer into the two first parts and exposing the first nickel layer; wherein the second conductive unit includes a second copper layer, a second nickel layer disposed on the second copper layer, and a second gold layer disposed on the second nickel layer, in which the second groove is formed on the second gold layer, dividing the second gold layer into the two second parts and exposing the second nickel layer.

7. A method of making a light-emitting diode package structure, comprising:
providing a light-emitting diode package, including:
an insulating base;
a first conductive unit disposed on the insulating base;
a second conductive unit disposed on the insulating base and separated from the first conductive unit; and
at least one light-emitting diode chips electrically connected to the first conductive unit and the second conductive unit;

forming a first groove on the first conductive unit, wherein an outer surface of the first conductive unit is divided by the first groove into two first parts that are separated from each other, in which the outer surface of the first conductive unit is conductive; and
forming a second groove on the second conductive unit, wherein an outer surface of the second conductive unit is divided by the second groove into two second parts that are separated from each other, in which the outer surface of the second conductive unit is conductive.

8. The method according to claim 7 , wherein the first conductive unit includes a first copper layer, a first nickel layer disposed on the first copper layer, and a first gold layer disposed on the first nickel layer, in which the first groove is formed on the first gold layer, dividing the first gold layer into the two first parts and exposing the first nickel layer, wherein the second conductive unit includes a second copper layer, a second nickel layer disposed on the second copper layer, and a second gold layer disposed on the second nickel layer, in which the second groove is formed on the second gold layer, dividing the second gold layer into the two second parts and exposing the second nickel layer; and wherein the first groove and the second groove are formed by a laser-etching process.

9. A method of making a light-emitting device, comprising:
providing a light-emitting diode package, including:
an insulating base;
a first conductive unit disposed on the insulating base;

a second conductive unit disposed on the insulating base and separated from the first conductive unit; and
at least one light-emitting diode chips electrically connected to the first conductive unit and the second conductive unit;
forming a first groove on the first conductive unit, wherein an outer surface of the first conductive unit is divided by the first groove into two first parts that are separated from each other, in which the outer surface of the first conductive unit is conductive;
forming a second groove on the second conductive unit, wherein an outer surface of the second conductive unit is divided by the second groove into two second parts, in which the outer surface of the second conductive unit is conductive;
electrically connecting the light-emitting diode package to a circuit board by soldering.

10. The method according to claim 9 , wherein the light-emitting diode package is soldered onto the circuit board through a solder, wherein the first conductive unit includes a first copper layer, a first nickel layer disposed on the first copper layer, and a first gold layer disposed on the first nickel layer, and the first groove is formed on the first gold layer, in which the first groove divides the first gold layer into the two first parts and exposes the first nickel layer, and the second conductive unit includes a second copper layer, a second nickel layer disposed on the second copper layer, and a second gold layer disposed on the second nickel layer, and the second groove is formed on the second gold layer, in which the second groove divides the second gold layer into the two second p

Assignees

• Lite On Singapore Pte Ltd

Inventors

• Nijaguna Suresh Basoor

Classifications

• H10W70/682

  comprising holes having chips therein · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07554

  changes in dispositions · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07553

  changes in shapes · CPC title