Stacked microfeature devices and associated methods

Patent metadata

Field	Value
Publication number	US-10062667-B2
Application number	US-201615368158-A
Country	US
Kind code	B2
Filing date	Dec 2, 2016
Priority date	Aug 29, 2003
Publication date	Aug 28, 2018
Grant date	Aug 28, 2018

Abstract

Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.

First claim

We claim:

1. A method for forming a microfeature device package, comprising:
forming a first microfeature device having a first bond pad surface, wherein the first microfeature device includes
a plurality of first bond pads at the first bond pad surface,
a plurality of first wirebond pads positioned outwardly from the first bond pads, and
a plurality of first couplers electrically coupling individual first bond pads to corresponding first wirebond pads and extending along at least a portion of the first bond pad surface;

positioning a second microfeature device at least proximate to the first microfeature device, wherein the second microfeature device includes a second bond pad surface and a plurality of second wirebond pads at the second bond pad surface, wherein the second bond pad surface faces at least partially toward the first bond pad surface;
electrically coupling, via an electrically conductive member, an individual first wirebond pad and an individual second wirebond pad; and
disposing a wirebond between the individual first wirebond pad and a package connection site,
wherein the individual second wirebond pad is electrically coupled to the package connection site via the electrically conductive member and the wirebond.

2. The method of claim 1 wherein positioning the second microfeature device includes aligning the second microfeature device such that at least a portion of the first wirebond pads are over at least a portion of corresponding second wirebond pads of the second microfeature device.

3. The method of claim 1 wherein the first microfeature device is generally similar to the second microfeature device, and wherein positioning the second microfeature device includes stacking the second microfeature device on top of the first microfeature device.

4. The method of claim 1 wherein the plurality of first wirebond pads includes a first plurality of first wirebond pads at a first side of the first bond pad surface and a second plurality of first wirebond pads at a second side of the first bond pad surface.

5. The method of claim 4 wherein the first plurality of first wirebond pads and the second plurality of first wirebond pads are electrically connected to one another via corresponding first couplers.

6. The method of claim 1 wherein individual first wirebond pads and corresponding first bond pads are spaced apart from one another by corresponding first couplers.

7. The method of claim 1 , further comprising disposing an encapsulant to at least partially cover the first microfeature device and the second microfeature device.

8. The method of claim 1 wherein the plurality of first bond pads are arranged along a center line of the first bond pad surface.

9. The method of claim 1 , further comprising electrically coupling each of the second wirebond pads to corresponding second bond pads via second couplers extending along at least a portion of the second bond pad surface.

10. A method for forming a microfeature device package, comprising:
stacking a first microfeature device with a second microfeature device, wherein the first microfeature device includes a plurality of first bond pads at a first bond pad surface, a plurality of first wirebond pads positioned outwardly from the first bond pads, and a plurality of first couplers electrically coupling individual first bond pads to corresponding first wirebond pads, wherein the plurality of first couplers extend along at least a portion of the first bond pad surface, and wherein the second microfeature device includes a second bond pad surface and a plurality of second wirebond pads at the second bond pad surface, the second bond pad surface facing at least partially toward the first bond pad surface;
electrically coupling, via an electrically conductive member, an individual first wirebond pad and an individual second wirebond pad; and
disposing a wirebond between the individual first wirebond pad and a package connection site,
wherein the individual second wirebond pad is electrically coupled to the package connection site via the electrically conductive member and the wirebond.

11. The method of claim 10 , further comprising aligning individual first wirebond pads with corresponding second wirebond pads of the second microfeature device such that at least a portion of the first wirebond pads are over at least a portion of the corresponding bond pads of the second microfeature device.

12. The method of claim 10 wherein the plurality of first wirebond pads includes a first plurality of first wirebond pads at a first side of the first bond pad surface and a second plurality of first wirebond pads at a second side of the first bond pad surface.

13. The method of claim 12 wherein the first plurality of individual first wirebond pads and the second plurality of individual first wirebond pads are electrically connected to one another via corresponding first bond pads.

14. The method of claim 12 wherein the first plurality of first wirebond pads and the second plurality of first wirebond pads are not electrically connected.

15. The method of claim 12 , further comprising:
coupling one or more individual first wirebonds between the first plurality of individual first wirebond pads and a first package connection site; and
coupling one or more individual second wirebonds between the second plurality of individual first wirebond pads and a second package connection site.

16. The method of claim 10 wherein the second microfeature device is generally similar to the first microfeature device.

17. The method of claim 10 wherein individual first wirebond pads and corresponding first bond pads are spaced apart from one another by corresponding first couplers.

18. The method of claim 10 , further comprising disposing an encapsulant to cover the first microfeature device and a portion of the second microfeature device such that an outermost surface of the second microfeature device is exposed.

19. The method of claim 10 , further comprising electrically coupling each of the second wirebond pads to corresponding second bond pads via individual second couplers extending along at least a portion of the second bond pad surface.

20. The method of claim 19 wherein at least a portion of the individual second couplers are positioned between adjacent individual first couplers in an alternating arrangement.

Assignees

• Micron Technology Inc

Inventors

• Heng Mung Suan
• Tan Kok Chua
• Leong Vince Chan Seng
• Johnson Mark S

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/752

  between stacked chips · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/721

  of bump connectors · CPC title