Underfill material and method for manufacturing semiconductor device using the same

Patent metadata

Field	Value
Publication number	US-10062625-B2
Application number	US-201715486663-A
Country	US
Kind code	B2
Filing date	Apr 13, 2017
Priority date	Sep 27, 2013
Publication date	Aug 28, 2018
Grant date	Aug 28, 2018

Abstract

An underfill material enabling voidless packaging and excellent solder bonding properties, and a method for manufacturing a semiconductor device using the same are provided. An underfill material is used which contains an epoxy resin and a curing agent, and a time for a reaction rate to reach 20% at 240° C. calculated by Ozawa method using a differential scanning calorimeter is 2.0 sec or less and a time for the reaction rate to reach 60% is 3.0 sec or more. This enables voidless packaging and excellent solder connection properties.

First claim

The invention claimed is:

1. An underfill material applied to a semiconductor chip having a solder-tipped electrode formed thereon before mounting the semiconductor chip onto an electronic component having a counter electrode facing the solder-tipped electrode, wherein
the underfill material contains a phenoxy resin, an acrylic rubber polymer having a glycidyl group, an epoxy resin, a curing agent, an (meth) acrylate resin and an organic peroxide,
the underfill material exhibiting a time for a degree of conversion to reach 20% at 240° C. calculated by Ozawa method based on data obtained by increasing temperature of samples at constant rates of 5° C./min, 10° C./min and 20° C./min using a differential scanning calorimeter is 2.0 sec or less and a time for the degree of conversion to reach 60% is 3.0 sec or more, and
the time to reach a predetermined degree of conversion is calculated by creating a reaction simulation chart on the basis of an activation energy, a frequency factor and a reaction order obtained by creating Ozawa-plots that has a vertical axis represented common logarithm values of a rate of temperature increase and a horizontal axis represented reciprocal values of a peak temperature calculated based on the data.

2. The underfill material according to claim 1 , wherein
a viscosity at the degree of conversion of 20% is 0.2×10 4 Pa*s or more and a viscosity at the degree of conversion of 60% is 500×10 4 Pa*s or less.

3. The underfill material according to claim 1 , wherein
the epoxy resin is a dicyclopentadiene type epoxy resin, and
the curing agent is a aliphatic acid anhydride or imidazole-based curing agent.

4. The underfill material according to claim 1 , wherein
the (meth) acrylate resin is a bifunctional (meth)acrylate and
the organic peroxide is a peroxy ester.

5. The underfill material according to claim 3 , wherein
the acrylate resin is a bifunctional (meth)acrylate and
the organic peroxide is a peroxy ester.

6. The underfill material according to claim 1 , wherein
the acrylic rubber polymer has a glass transition temperature of −30° to 20° C.

Assignees

• Dexerials Corp

Inventors

• Moriyama Hironobu

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08L33/10

  Homopolymers or copolymers of methacrylic acid esters · CPC title

• C08K5/14

  Peroxides · CPC title

• C08G59/686

  containing nitrogen · CPC title