Semiconductor laser module

US10061092B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10061092-B2
Application numberUS-201715653954-A
CountryUS
Kind codeB2
Filing dateJul 19, 2017
Priority dateSep 12, 2013
Publication dateAug 28, 2018
Grant dateAug 28, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A semiconductor laser module includes a package; a plurality of semiconductor laser elements provided in the package; a member having a plurality of mounting surfaces on which the semiconductor laser elements are mounted, the mounting surfaces being separated from a bottom surface of the package by respective distances, the distances being gradually different from each other in a manner that the mounting surfaces as a whole form a step-like form; a plurality of lenses collimating respective laser beams emitted from the semiconductor laser elements; a plurality of reflection mirrors reflecting the respective laser beams; a condenser lens unit condensing the laser beams; an optical fiber where the optical beams condensed by the condenser lenses are optically coupled; and an optical filter disposed on optical lines of the respective laser beams reflected by the reflection mirrors and reflecting light having wavelengths different from the wavelengths of the laser beams.

First claim

Opening claim text (preview).

What is claimed is: 1. A semiconductor laser module comprising: a package; a plurality of semiconductor laser elements provided in the package; a member having a plurality of mounting surfaces on which the semiconductor laser elements are mounted, the mounting surfaces being separated from a bottom surface of the package by respective distances, the distances being gradually different from each other in a manner that the mounting surfaces form a step-like form; a plurality of lenses configured to collimate respective laser beams emitted from the semiconductor laser elements; a plurality of reflection mirrors configured to reflect the respective laser beams; a condenser lens unit configured to condense the laser beams; an optical fiber where the optical beams condensed by the condenser lens unit are optically coupled; and an optical filter disposed on optical lines of the respective laser beams reflected by the reflection mirrors and configured to reflect light having wavelengths different from the wavelengths of the laser beams. 2. The semiconductor laser module according to claim 1 , wherein the condenser lens unit include two or more independent condenser lenses which condense the laser beams in a vertical direction and in a horizontal direction, respectively. 3. The semiconductor laser module according to claim 2 , wherein the optical filter is disposed between two of the independent condenser lenses included in the condenser lens unit. 4. The semiconductor laser module according to claim 1 , wherein the optical filter is tilted relative to optical axes of the laser beams reflected by the reflection mirrors. 5. The semiconductor laser module according to claim 1 , wherein the optical filter is configured to reflect light having a wavelength greater than wavelength of the laser beams.

Assignees

Inventors

Classifications

  • for beam steering, e.g. using a mirror outside the cavity to change the beam direction · CPC title

  • Fixing or mounting methods of the aligned elements · CPC title

  • having a supporting carrier or a mounting substrate or a mounting plate (G02B6/3648 takes precedence) · CPC title

  • with vertically stacked active layers · CPC title

  • Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms · CPC title

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What does patent US10061092B2 cover?
A semiconductor laser module includes a package; a plurality of semiconductor laser elements provided in the package; a member having a plurality of mounting surfaces on which the semiconductor laser elements are mounted, the mounting surfaces being separated from a bottom surface of the package by respective distances, the distances being gradually different from each other in a manner that th…
Who is the assignee on this patent?
Furukawa Electric Co Ltd
What technology area does this patent fall under?
Primary CPC classification G02B6/4206. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 28 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).