Conductivity sensor, and a pump comprising such sensor

US10060429B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10060429-B2
Application numberUS-201415106654-A
CountryUS
Kind codeB2
Filing dateDec 19, 2014
Priority dateDec 20, 2013
Publication dateAug 28, 2018
Grant dateAug 28, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A conductivity sensor is provided. The sensor comprises at least one electrode being embedded in a cylindrical non-conductive body such that one end of each one of the at least one electrode is exposed to a sample volume, wherein the sensor further comprises a support body to which the cylindrical body is engagable with, which support body comprises means for attaching said support body to a frame structure in a fluid tight manner.

First claim

Opening claim text (preview).

The invention claimed is: 1. A homogenizer comprising: a high pressure pump including a membrane assembly for transmitting pressure from a hydraulic side to a product side, the membrane assembly including a frame structure being sealed on opposite sides by two separate membranes, wherein the frame structure includes a radial through hole that is configured to receive a cylindrical non-conductive body; and a conductivity sensor that is received in the radial through hole and has at least one electrode being embedded in the cylindrical non-conductive body such that one end of each one of the at least one electrode is exposed to a sample volume, and a support body to which the cylindrical non-conductive body is engagable with, which support body includes means for attaching said support body to the frame structure in a fluid tight manner, wherein the sample volume is formed as a recess in the non-conductive body. 2. The homogenizer according to claim 1 , wherein said non-conductive body is formed by a sintering process. 3. The homogenizer according to claim 1 , wherein said at least one electrode is made of platinum. 4. The homogenizer according to claim 1 , wherein said support body is formed by a cylindrical body in which the non-conductive body is insertable. 5. The homogenizer according to claim 1 , wherein said sample volume is formed as a recess in said non-conductive body. 6. The homogenizer according to claim 1 , wherein said frame structure has a circular shape. 7. The homogenizer according to claim 1 , further comprising a control unit being connected to said conductivity sensor for determining any leakage from the hydraulic side and/or the product side into the membrane assembly. 8. A homogenizer comprising: a pump block that includes a piston producing pressure in the pump block during operation of the homogenizer and communicating with a hydraulic oil chamber that is configured to contain hydraulic oil; first and second spaced apart membranes in the pump block, the first and second membranes being spaced apart so that a membrane interior space exists between the first and second membranes, the membrane interior space being configured to contain a liquid or gel which transmits a pressure and changes conductivity when mixed with the hydraulic fluid or a product, the membrane interior space being separated from the hydraulic oil chamber by way of the first membrane; a product chamber separated from the membrane interior space by the second membrane; a frame structure positioned between and secured to both the first membrane and the second membrane; a conductivity sensor positioned in a hole in the frame structure in a fluid-tight manner at a position so that when the liquid or gel is in the membrane interior space the conductivity sensor contacts the liquid or gel; the conductivity sensor comprising a support body and a plurality of electrodes embedded in a cylindrical non-conductive body, one end of each of the electrodes being exposed to a sample volume in the cylindrical non-conductive body, the sample volume in the cylindrical non-conductive body communicating with the membrane interior space, the support body including an interior volume that accommodates the cylindrical non-conductive body, the support body and the hole in the frame structure possessing structure by which the support body engages and is held in hole in the frame structure. 9. The homogenizer according to claim 8 , wherein the frame structure possesses a cylindrical shape. 10. The homogenizer according to claim 8 , wherein the hole in the frame structure is a through hole. 11. The homogenizer according to claim 8 , wherein the structure by which the support body engages and is held in hole in the frame structure includes outer threads on an outer surface of the support body and inner threads inside the hole, the outer threads engaging the inner threads to hold the support body in the hole in the frame structure. 12. The homogenizer according to claim 8 , wherein the sample volume is a recess. 13. The homogenizer according to claim 8 , wherein the plurality of electrodes includes more than two electrodes.

Assignees

Inventors

Classifications

  • Construction of measuring vessels; Electrodes therefor · CPC title

  • Investigation or analysis specially adapted for controlling or monitoring operations or for signalling · CPC title

  • having tubular flexible members (F04B43/12 takes precedence) · CPC title

  • F04B51/00Primary

    Testing machines, pumps, or pumping installations · CPC title

  • F04B43/009Primary

    leakage control; pump systems with two flexible members; between the actuating element and the pumped fluid · CPC title

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What does patent US10060429B2 cover?
A conductivity sensor is provided. The sensor comprises at least one electrode being embedded in a cylindrical non-conductive body such that one end of each one of the at least one electrode is exposed to a sample volume, wherein the sensor further comprises a support body to which the cylindrical body is engagable with, which support body comprises means for attaching said support body to a fr…
Who is the assignee on this patent?
Tetra Laval Holdings & Finance
What technology area does this patent fall under?
Primary CPC classification F04B51/00. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Aug 28 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).