A process for electrochemical deposition of copper with different current densities
US-2024183052-A1 · Jun 6, 2024 · US
Electroless copper plating compositions
US10060034B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10060034-B2 |
| Application number | US-201715412464-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 23, 2017 |
| Priority date | Jan 23, 2017 |
| Publication date | Aug 28, 2018 |
| Grant date | Aug 28, 2018 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
Electroless copper plating compositions including (a) copper ions, (b) a complexing agent for copper ions, (c) a reducing agent, (d) a pH adjustor and (e) a stabilizer is disclosed. The stabilizer has a specific chemical structure, and contributes to stable an electroless copper plating composition from decomposition.
First claim
Opening claim text (preview).
What is claimed is: 1. An electroless copper plating composition comprising (a) a copper ion, (b) a complexing agent for copper ion, (c) a reducing agent, (d) a pH adjustor and (e) a stabilizer compound chosen from one or more of 3 ethyl-2-thioxo-4-oxazolidinone and 5-(4-pyridyl)-1,3,4-oxadiazole-2-thiol. 2. The electroless copper plating composition of claim 1 , wherein the amount of the stabilizer compound is from 0.01 to 1000 ppm. 3. The electroless copper plating composition of claim 1 , wherein the complexing agent is tartrate. 4. A method for forming a copper film on a substrate comprising the step of: contacting a substrate with a composition comprising (a) a copper ion, (b) a complexing agent for copper ion, (c) a reducing agent, (d) a pH adjustor and (e) a stabilizer compound chosen from one or more of 3-ethyl-2-thioxo-4-oxazolidinone and 5-(4-pyridyl)-1,3,4-oxadiazole-2-thiol.
Assignees
Inventors
Classifications
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10060034B2 cover?
- Electroless copper plating compositions including (a) copper ions, (b) a complexing agent for copper ions, (c) a reducing agent, (d) a pH adjustor and (e) a stabilizer is disclosed. The stabilizer has a specific chemical structure, and contributes to stable an electroless copper plating composition from decomposition.
- Who is the assignee on this patent?
- Rohm & Haas Elect Mat
- What technology area does this patent fall under?
- Primary CPC classification C23C18/40. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Aug 28 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).