Mechanism for seamlessly splicing nozzles

US10059105B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10059105-B2
Application numberUS-201314778382-A
CountryUS
Kind codeB2
Filing dateDec 4, 2013
Priority dateMar 20, 2013
Publication dateAug 28, 2018
Grant dateAug 28, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention provides a nozzle seamless splice mechanism and an adjustment method for the same, and belongs to a field of printing machinery technology. The nozzle seamless splice mechanism and the adjustment method for the same may solve the problems of nozzles orifices stagger, reduced printing width or blankness exposed in the middle caused by the causes such as the fabrication error, the personal error, etc with respect to the existing nozzles. The nozzle seamless splice mechanism of the present invention comprises: splice mechanism comprising: a micro-device for detecting coordinates of orifices of nozzles; a nozzle adjustment base for fixing nozzles; a nozzle bottom plate connected with said nozzle adjustment base adjustably. The nozzle seamless splice mechanism of the present invention has a low cost, high adjustment efficiency, and achieves digitized adjustment.

First claim

Opening claim text (preview).

What is claimed is: 1. A mechanism for seamless splicing nozzles, comprising: a microscope for detecting coordinates of orifices of the nozzles within a field of view of the microscope; a nozzle adjustment base for fixing the nozzles; a nozzle bottom plate adjustably connected with said nozzle adjustment base; wherein said nozzle adjustment base is connected with the nozzle bottom plate by a pin screw, said nozzle adjustment base is provided with a long hole through which the pin screw extends, the diameter of said long hole matches the diameter of the pin screw, the direction of said long hole is the same as the arrangement direction of the orifices of the nozzles, said nozzle adjustment base is movable on the nozzle bottom plate in an arrangement direction of said orifices of the nozzles by moving said pin screw in the direction of said long hole, such that a transverse adjustment is performed on said nozzle, and said nozzle adjustment base is rotatable on the nozzle bottom plate with said pin screw as a rotating center, such that a longitudinal adjustment is performed on said nozzle. 2. The mechanism according to claim 1 , wherein said long hole is provided in a middle position on the nozzle adjustment base in the arrangement direction of the orifices of the nozzles. 3. The mechanism according to claim 1 , wherein said nozzle bottom plate is provided with a micrometer head for the transverse adjustment and a micrometer head for the longitudinal adjustment of the nozzle adjustment base. 4. The mechanism according to claim 3 , wherein said micrometer head for the transverse adjustment is arranged on a transverse fixation base, said transverse fixation base is arranged on the nozzle bottom plate; and said micrometer head for the longitudinal adjustment is arranged on an angle adjustment base, said angle adjustment base is arranged on the nozzle bottom plate. 5. The mechanism according to claim 4 , wherein the adjustment accuracy of said micrometer head is 0.01 mm.

Assignees

Inventors

Classifications

  • Arrangements for adjusting the position of spray heads (B05B15/628, B05B15/652, B05B15/656 take precedence) · CPC title

  • Production of nozzles · CPC title

  • B41J25/001Primary

    Mechanisms for bodily moving print heads or carriages parallel to the paper surface · CPC title

  • B41J2/145Primary

    Arrangement thereof · CPC title

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Frequently asked questions

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What does patent US10059105B2 cover?
The present invention provides a nozzle seamless splice mechanism and an adjustment method for the same, and belongs to a field of printing machinery technology. The nozzle seamless splice mechanism and the adjustment method for the same may solve the problems of nozzles orifices stagger, reduced printing width or blankness exposed in the middle caused by the causes such as the fabrication erro…
Who is the assignee on this patent?
Univ Peking Founder Group Co, Beijing Founder Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification B41J25/001. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 28 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).