Metal or ceramic component comprising at least one multi-dimensionally structured connection portion and method for the production thereof

US10059089B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10059089-B2
Application numberUS-201615141085-A
CountryUS
Kind codeB2
Filing dateApr 28, 2016
Priority dateApr 29, 2015
Publication dateAug 28, 2018
Grant dateAug 28, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A metal or ceramic component includes at least one multi-dimensionally structured connection portion, wherein the connection portion is intended for forming an adhesive bond to fiber-reinforced polymer laminate, and wherein the metal or ceramic component has a milliscale structure, in particular formed by anchoring elements, and a microscale structure on the connection portion and the anchoring elements, over which microscale structure an additional nanoscale structure is formed.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for multi-dimensionally structuring at least one connection portion of a metal component, wherein the connection portion is intended for forming an adhesive bond to fiber-reinforced polymer laminate, and wherein the method comprises: producing a milliscale structure by forming anchoring elements on the connection portion which protrude from the connection portion substantially perpendicularly or at a predetermined angle by stamping-and-bending processes, high-speed metal machining, electron beam machining, additive layer production processes, deposit welding or welding on of anchoring elements; producing a microscale structure on the connection portion and the anchoring elements by sandblasting or electromagnetic radiation; producing a nanoscale structure over the microscale structure on the connection portion and the anchoring elements. 2. The method of claim 1 , wherein the electromagnetic radiation is laser irradiation. 3. The method of claim 2 , wherein the laser irradiation is carried out by a short-pulse laser that is moved at a defined feed rate relative to the connection portion. 4. The method of claim 3 , wherein the short-pulse laser comprises a femtosecond, picosecond or nanosecond laser having a high pulse repetition frequency. 5. The method of claim 1 , wherein the laser for producing the microscale structure and the laser for producing the nanoscale structure are arranged one behind the other such that the microstructure over which the nanostructure is formed is produced in one feed flow path. 6. The method of claim 1 , wherein the nanoscale structure is produced over the microscale structure on the connection portion and the anchoring elements by laser irradiation or anodization. 7. The method of claim 6 , wherein the laser irradiation is carried out by a short-pulse laser that is moved at a defined feed rate relative to the connection portion. 8. The method of claim 7 , wherein the short-pulse laser comprises a femtosecond, picosecond or nanosecond laser having a high pulse repetition frequency. 9. A metal component comprising: at least one multi-dimensionally structured connection portion for forming an adhesive bond to fiber-reinforced polymer laminate, the metal component having a milliscale structure formed by anchoring elements which are formed by stamping-and-bending processes, high-speed metal machining, electron beam machining, additive layer production processes, deposit welding or welding on of anchoring elements, which anchoring elements protrude from the connection portion substantially perpendicularly or at a predetermined angle; and a microscale structure on the connection portion and the anchoring elements formed by sandblasting or electromagnetic radiation, over which microscale structure an additional nanoscale structure is formed. 10. The metal component of claim 9 , wherein connection portions are provided on all sides. 11. The metal component of claim 9 , wherein the component is produced from an alloy of titanium, aluminum, steel or magnesium, or from another metal alloy. 12. A method of using a metal component as a z-reinforcement of fiber-reinforced polymer laminates, wherein the metal component is completely surrounded by polymer laminate, the metal component comprising: at least one multi-dimensionally structured connection portion for forming an adhesive bond to fiber-reinforced polymer laminate, the metal or ceramic component having a milliscale structure formed by anchoring elements which are formed by stamping-and-bending processes, high-speed metal machining, electron beam machining, additive layer production processes, deposit welding or welding on of anchoring elements, which anchoring elements protrude from the connection portion substantially perpendicularly or at a predetermined angle; and a microscale structure on the connection portion and the anchoring elements formed by sandblasting or electromagnetic radiation, over which microscale structure an additional nanoscale structure is formed. 13. The method of claim 12 , wherein the metal component is used as a connection element in a co-bonding method.

Assignees

Inventors

Classifications

  • Ceramics · CPC title

  • Increasing rugosity, i.e. roughening · CPC title

  • by combined operations {or combined techniques}, e.g. welding and stitching · CPC title

  • non-integral with the parts to be joined, e.g. making use of extra elements (B29C65/562 takes precedence) · CPC title

  • by heating, with or without pressure · CPC title

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What does patent US10059089B2 cover?
A metal or ceramic component includes at least one multi-dimensionally structured connection portion, wherein the connection portion is intended for forming an adhesive bond to fiber-reinforced polymer laminate, and wherein the metal or ceramic component has a milliscale structure, in particular formed by anchoring elements, and a microscale structure on the connection portion and the anchoring…
Who is the assignee on this patent?
Airbus Defence & Space Gmbh
What technology area does this patent fall under?
Primary CPC classification B32B37/12. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 28 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).