Membrane bonding

US10058892B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10058892-B2
Application numberUS-201615077734-A
CountryUS
Kind codeB2
Filing dateMar 22, 2016
Priority dateMay 20, 2015
Publication dateAug 28, 2018
Grant dateAug 28, 2018

How to read this patent

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Systems and techniques are provided for membrane bonding. A bonding agent may be applied to one or both of an ultrasonic device and membrane. The membrane may be placed on the ultrasonic device such that the membrane is in contact with the ultrasonic device through the bonding agent. The membrane and the ultrasonic device may be placed in between a first flat plate and a second flat plate, such that the second flat plate rests on top of the membrane. Light pressure may be applied to the membrane. The light pressure may be applied by one or more of the weight of the second flat plate and a pressure providing device applying pressure to either or both of the first flat plate and the second flat plate.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method comprising: applying a bonding agent to one or both of an ultrasonic device and membrane; placing the membrane on the ultrasonic device such that the membrane is in contact with the ultrasonic device through the bonding agent; placing the membrane and the ultrasonic device in between a first flat plate and a second flat plate, such that the second flat plate rests on top of the membrane; and applying light pressure to the membrane, wherein the light pressure is applied by one or more of the weight of the second flat plate and a pressure providing device applying pressure to either or both of the first flat plate and the second flat plate, wherein the bonding agent cures to form bond lines bonding the membrane to the ultrasonic device and wherein the bond lines divide the membrane into mechanically isolated membrane sections. 2. The method of claim 1 , wherein applying the bonding agent to the ultrasonic device comprises: placing a stencil on the ultrasonic device; and applying the bonding agent to the ultrasonic device through one or more openings in the stencil. 3. The method of claim 2 , wherein the stencil is placed on the ultrasonic device based on fiducials of the stencil and fiducials of a substrate of the ultrasonic device. 4. The method of claim 2 , wherein the openings of the stencil comprise dashes and dots, the dashes forming a grid of dashed squares with a dot at the center of each dashed square in the grid of dashed squares. 5. The method of claim 2 , wherein the bonding agent applied to the ultrasonic device creates borders of ultrasonic transducer cells, and wherein a dot of the bonding agent is applied to the tips of the free ends of electromechanically active devices of the ultrasonic device. 6. The method of claim 2 , wherein the bonding agent is applied using a metal straight-edge or a rubber squeegee. 7. The method of claim 1 , wherein the bonding agent is an epoxy. 8. The method of claim 1 , wherein the light pressure is applied for the entire curing time of the bonding agent. 9. The method of claim 1 , wherein each of the membrane sections is bonded by the cured bonding agent to the tip of the free end of an electromechanically active device covered by the membrane section. 10. The method of claim 9 , wherein the electromechanically active device is bonded to the membrane section off the center of the membrane section. 11. The method of claim 9 , wherein the electromechanically active device is a piezoelectric unimorph or a piezoelectric bimorph. 12. The method of claim 1 , further comprising keeping the membrane and ultrasonic device at a temperature below 90 degrees Celsius for the curing time of the bonding agent. 13. The method of claim 1 , further comprising, before placing the membrane on the ultrasonic device, preparing or texturing at least one surface of the membrane. 14. The method of claim 1 , wherein the membrane comprises a metal film. 15. The method of claim 1 , wherein the bonding agent is mixed with glass microspheres. 16. The method of claim 1 , wherein the ultrasonic device comprises one or more ultrasonic transducers on a substrate. 17. The method of claim 1 , wherein each ultrasonic transducer comprises an electromechanically active device attached to the substrate and partially projecting out over a cavity in the substrate.

Assignees

Inventors

Classifications

  • by gluing (gluing of plastics material B29C65/48) · CPC title

  • B06B1/0666Primary

    used as a diaphragm · CPC title

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Frequently asked questions

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What does patent US10058892B2 cover?
Systems and techniques are provided for membrane bonding. A bonding agent may be applied to one or both of an ultrasonic device and membrane. The membrane may be placed on the ultrasonic device such that the membrane is in contact with the ultrasonic device through the bonding agent. The membrane and the ultrasonic device may be placed in between a first flat plate and a second flat plate, such…
Who is the assignee on this patent?
Ubeam Inc
What technology area does this patent fall under?
Primary CPC classification B06B1/0666. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 28 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).