Waterproof structure for casing of electronic device

US10058000B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10058000-B2
Application numberUS-201615361028-A
CountryUS
Kind codeB2
Filing dateNov 24, 2016
Priority dateOct 27, 2016
Publication dateAug 21, 2018
Grant dateAug 21, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A waterproof structure for a casing of an electronic device includes: a first casing member, having a first casing portion, a first side portion surrounding the first casing portion, and a first peg disposed in the first casing portion; a second casing member, having a second casing portion, a second side portion surrounding the second casing portion, and a second pegs disposed in the second casing portion and configured to be corresponsive to the first peg; a waterproof member, having a ring portion and a packing portion integrally coupled with each other, and the ring portion being surrounded continuously by the first and second side portions and clamped between the first and second side portions, and the packing portion being disposed between the first and second pegs; and plural locking elements, passing into the first and second pegs to combine with the first and second casing members respectively.

First claim

Opening claim text (preview).

What is claimed is: 1. A waterproof structure for a casing of an electronic device, comprising: a first casing member, having a first casing portion, a first side portion surrounding the periphery of the first casing portion, and a plurality of first pegs disposed in and protruded from the first casing portion; a second casing member, assembled with the first casing member, and having a second casing portion, a second side portion surrounding the periphery of the second casing portion, a plurality of second pegs disposed in and protruded from the second casing portion, and configured to be corresponsive to the first pegs respectively; a waterproof member, having a ring portion, and a plurality of packing portions formed by integrally coupling the ring portion, and the ring portion being surrounded continuously by the first and second side portions and clamped between the first and second side portions, and the packing portions being disposed between the first and second pegs respectively; and a plurality of locking elements, passing into the first and second pegs to combine the first and second casing members, wherein a first accommodating area and a second accommodating area are defined between the first and second casing members, and the waterproof member is accommodated in the first and second accommodating areas; wherein the first and second accommodating areas have a first interference slot and a second interference slot respectively and concavely formed on the first and second side portions and disposed around the ring portion, and each of the first and second interference slots is recessed into a width greater than the corresponsive width of the ring portion, so that the ring portion deforms in a widthwise direction of each of the first and second interference slots when the first and second casing members are engaged with each other to compress the ring portion. 2. The waterproof structure for a casing of an electronic device according to claim 1 , wherein the first pegs are coupled to an inner side of the first side portion. 3. The waterproof structure for a casing of an electronic device according to claim 1 , wherein the second pegs are coupled to an inner side of the second side portion. 4. The waterproof structure for a casing of an electronic device according to claim 1 , wherein the waterproof member is made of a rubber material and integrally formed. 5. The waterproof structure for a casing of an electronic device according to claim 1 , wherein the packing portions are disposed at the internal periphery of the ring portion. 6. The waterproof structure for a casing of an electronic device according to claim 1 , wherein each of the packing portions has an outer sleeve and an inner sleeve, and the outer sleeve with an external diameter corresponsive to each first peg is sheathed on each respective first peg, and the inner sleeve is extended inwardly from the internal periphery of the outer sleeve. 7. The waterproof structure for a casing of an electronic device according to claim 6 , wherein each first peg has a tapered neck portion formed at an upper end of the first peg, and the inner sleeve having an external diameter corresponsive to the neck portion is sheathed on the neck portion. 8. The waterproof structure for a casing of an electronic device according to claim 6 , wherein the outer sleeve has a thickness greater than the thickness of the inner sleeve.

Assignees

Inventors

Classifications

  • Electricity · mapped topic

  • H05K5/061Primary

    sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing · CPC title

  • assembled by screws · CPC title

  • for storing portable computing devices, e.g. laptops, tablets or calculators · CPC title

  • for storing portable handheld communication devices, e.g. pagers or smart phones · CPC title

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Frequently asked questions

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What does patent US10058000B2 cover?
A waterproof structure for a casing of an electronic device includes: a first casing member, having a first casing portion, a first side portion surrounding the first casing portion, and a first peg disposed in the first casing portion; a second casing member, having a second casing portion, a second side portion surrounding the second casing portion, and a second pegs disposed in the second ca…
Who is the assignee on this patent?
Cal Comp Big Data Inc
What technology area does this patent fall under?
Primary CPC classification H05K5/061. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 21 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).