ESD protection device

Patent metadata

Field	Value
Publication number	US-10057970-B2
Application number	US-201514922417-A
Country	US
Kind code	B2
Filing date	Oct 26, 2015
Priority date	May 8, 2013
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

There is provided an ESD protection device capable of lowering a discharge starting voltage. An ESD protection device 1 includes a ceramic multilayer substrate 2, a first discharge electrode 4 and a second discharge electrode 5 arranged at a height position of the ceramic multilayer substrate, an end 4a of the first discharge electrode 4 and an end 5a of the second discharge electrode 5 facing each other, in which each of the first discharge electrode 4 and the second discharge electrode 5 contains a metal and a shrinkage suppression material having a lower rate of shrinkage than that of the metal at a temperature at which firing for the production of the ceramic multilayer substrate 2 is performed.

First claim

The invention claimed is:

1. An ESD protection device comprising:
a ceramic multilayer substrate; and
a first discharge electrode and a second discharge electrode arranged at a height position of the ceramic multilayer substrate, an end of the first discharge electrode and an end of the second discharge electrode facing each other,
wherein each of the first discharge electrode and the second discharge electrode comprises a metal and a shrinkage suppression material, a shrinkage rate of the shrinkage suppression material being lower than a shrinkage rate of the metal at a firing temperature for producing the ceramic multilayer substrate.

2. The ESD protection device according to claim 1 , wherein the shrinkage suppression material comprises an inorganic substance, a sintering temperature of the inorganic substance being higher than a sintering temperature of the metal.

3. The ESD protection device according to claim 1 , wherein the shrinkage suppression material is a semiconductor.

4. The ESD protection device according to claim 1 , wherein the shrinkage suppression material is an insulating material.

5. The ESD protection device according to claim 1 , further comprising an auxiliary electrode arranged in the ceramic multilayer substrate, the auxiliary electrode being connected to the first discharge electrode and the second discharge electrode, wherein the auxiliary electrode comprises a conductive material coated with an insulating material.

6. The ESD protection device according to claim 5 , wherein the auxiliary electrode further comprises a ceramic material.

7. The ESD protection device according to claim 6 , wherein the ceramic material is a semiconductor ceramic.

Assignees

• Murata Manufacturing Co

Inventors

• Imada Takayuki
• Tsukizawa Takayuki
• Adachi Jun

Classifications

• H05K3/1291

  Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets · CPC title

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• H05K2203/308

  Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs · CPC title

• H05K1/026

  Spark gaps · CPC title

• H05K1/0259

  Electrostatic discharge [ESD] protection · CPC title