Circuit board device and image capturing module having the circuit board device

Patent metadata

Field	Value
Publication number	US-10057473-B2
Application number	US-201615388814-A
Country	US
Kind code	B2
Filing date	Dec 22, 2016
Priority date	Jun 27, 2014
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

A circuit board device includes a polyhedral support frame and a circuit board unit. The circuit board unit includes two rigid boards and a flexible board connecting the two rigid boards. The two rigid boards are folded with respect to each other through the flexible board and are disposed on different sides of the support frame, respectively.

First claim

What is claimed is:

1. A circuit board device, comprising:
a polyhedral support frame, each side of the polyhedral support frame including an opening; and
a circuit board unit comprising at least two rigid boards and at least one flexible board connecting the at least two rigid boards,
wherein the at least two rigid boards are folded with respect to each other through the at least one flexible board and are disposed on different sides of the support frame, respectively.

2. The circuit board device of claim 1 , wherein the at least two rigid boards include at least four rigid boards folded with respect to each other through the at least one flexible board and disposed on different sides of the support frame, respectively.

3. The circuit board device of claim 1 , wherein:
each of the rigid boards includes a plurality of positioning through-holes configured to position the rigid boards on the support frame, and
the support frame includes a plurality of positioning structures, each corresponding to one of the positioning through-holes, the positioning structures and the corresponding positioning through-holes being configured to cooperatively position the rigid boards on the support frame.

4. The circuit board device of claim 3 , wherein each of the positioning structures includes a convex column having an internal thread and protruding from a side of the support frame along a longitudinal direction of the convex column.

5. The circuit board device of claim 1 , wherein the support frame includes a hollow frame structure within which a receiving portion for receiving electric elements is formed.

6. The circuit board device of claim 5 , wherein the opening on each side of the support frame is in communication with the receiving portion.

7. An image capturing module, comprising:
a camera unit; and
a circuit board device connected to the camera unit, the circuit board device comprising:
a polyhedral support frame, each side of the polyhedral support frame including an opening; and
a circuit board unit comprising two rigid boards and a flexible board connecting the two rigid boards,
wherein the two rigid boards are folded with respect to each other through the flexible board and are disposed on different sides of the support frame, respectively.

8. The image capturing module of claim 7 , wherein:
the camera unit comprises an optical lens and an image sensing module arranged at an imaging side of the optical lens, and
the image sensing module is electrically connected to the circuit board device.

9. The image capturing module of claim 7 , wherein:
each of the rigid boards includes a plurality of positioning through-holes configured to position the rigid boards on the support frame, and
the support frame includes a plurality of positioning structures, each corresponding to one of the positioning through-holes, the positioning structures and the corresponding positioning through-holes being configured to cooperatively position the rigid boards on the support frame.

10. The image capturing module of claim 9 , wherein each of the positioning structures includes a convex column having an internal thread.

11. The image capturing module of claim 7 , wherein:
the support frame includes a hollow frame structure within which a receiving portion is formed, and
the camera unit is received in the receiving portion.

12. The image capturing module of claim 11 , wherein the opening on each side of the support frame is in communication with the receiving portion.

13. The image capturing module of claim 7 , further comprising:
a housing having a receiving space formed therein, the housing including a lens aperture, wherein:
the camera unit and the circuit board device are received in the housing, and
an object side of the camera unit faces the lens aperture.

14. The image capturing module of claim 13 , wherein the lens aperture is provided at a joint of the first casing and the second casing.

15. The image capturing module of claim 13 , wherein the housing comprises a mounting portion for mounting the image capturing module on a gimbal.

16. The image capturing module of claim 15 , wherein the mounting portion is formed at a joint of the first casing and the second casing.

17. The image capturing module of claim 13 , wherein the housing comprises a first casing and a second casing connected to the first casing, the first casing and the second casing collectively enclose the receiving space, and the support frame is fixed on the first casing.

18. The image capturing module of claim 17 , further comprising:
a plurality of first connecting portions formed on an inner wall of the first casing; and
a plurality of second connecting portions formed on a periphery of the support frame, each of the second connecting portions corresponding to one of the first connecting portions,
wherein the first connecting portions and the second connecting portions are configured to cooperatively fix the support frame.

19. The image capturing module of claim 18 , wherein:
each of the first connecting portions includes a convex column having an internal thread,
each of the second connecting portions includes a sheet structure protruding from the periphery of the support frame and has a connecting hole, and
the connecting hole of each of the second connecting portions is aligned with the internal thread of the corresponding first connecting portion.

Assignees

• Sz Dji Technology Co Ltd

Inventors

• Tang Yin
• Qiu Hualiang
• Yang Feihu

Classifications

• H04N23/57 Primary

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H05K2203/167

  Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment · CPC title

• H04N23/51

  Housings · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H05K1/147 Primary

  at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence) · CPC title